Hexanal

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Normal alkane RI, polar column, temperature ramp

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Data compilation copyright by the U.S. Secretary of Commerce on behalf of the U.S.A. All rights reserved.

Data compiled by: NIST Mass Spectrometry Data Center, William E. Wallace, director

Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase CP-Wax CBHP-InnowaxFFAPAT-WaxFFAP
Column length (m) 30.15.30.60.60.
Carrier gas HeliumHeliumNitrogenHeliumHelium
Substrate      
Column diameter (mm) 0.250.320.320.250.25
Phase thickness (μm) 0.250.500.500.250.25
Tstart (C) 50.40.35.60.45.
Tend (C) 150.250.250.280.220.
Heat rate (K/min) 2.3.4.4.5.
Initial hold (min)   5. 1.
Final hold (min) 5. 45. 5.
I 1077.1068.1092.1066.1072.
ReferenceAlves, da Penha, et al., 2012Puvipirom and Chaisei, 2012Budryn, Nebesny, et al., 2011Kiss, Csoka, et al., 2011Piyachaiseth, Jirapakkul, et al., 2011
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase DB-WaxTC-WaxCP Wax 52 CBDB-WaxDB-Wax
Column length (m) 30.60.30.30.30.
Carrier gas HeliumHeliumHeliumHeliumHelium
Substrate      
Column diameter (mm) 0.250.250.320.320.32
Phase thickness (μm) 0.25 0.500.250.25
Tstart (C) 40.40.40.40.40.
Tend (C) 210.230.230.230.230.
Heat rate (K/min) 3.3.4.6.6.
Initial hold (min)  3.2.2.2.
Final hold (min)   15.20.20.
I 1090.1083.1086.1083.1098.
ReferenceKumazawa, Sakai, et al., 2010Miyazawa, Fujita, et al., 2010Birtic, Ginies, et al., 2009Chen, Song, et al., 2009Chen, Song, et al., 2009
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase FFAPDB-WaxCP-WaxDB-WaxDB-Wax
Column length (m) 30.30.60.30.30.
Carrier gas HeliumHeliumHeliumHeliumHelium
Substrate      
Column diameter (mm) 0.320.320.250.250.25
Phase thickness (μm) 0.250.250.250.250.25
Tstart (C) 40. 50.60.60.
Tend (C) 240.240.230.200.200.
Heat rate (K/min) 6.6.6.8.8.
Initial hold (min) 2. 2.3.3.
Final hold (min)  5.15.9.59.5
I 1079.1082.1093.1083.1084.
ReferenceChristlbauer and Schieberle, 2009Mallia, Escher, et al., 2009Mo, Fan, et al., 2009Rochat, Egger, et al., 2009Rochat, Egger, et al., 2009
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase DB-WaxDB-WaxDB-WaxStabilwaxZB-Wax
Column length (m) 30.30.30.30.60.
Carrier gas HeliumHeliumHeliumHeliumHydrogen
Substrate      
Column diameter (mm) 0.250.250.250.250.53
Phase thickness (μm) 0.250.250.250.501.0
Tstart (C) 60.60.60.35.60.
Tend (C) 200.200.200.225.200.
Heat rate (K/min) 8.8.8.6.8.
Initial hold (min) 3.3.3.5. 
Final hold (min) 9.59.59.510. 
I 1110.1114.1116.1081.1119.
ReferenceRochat, Egger, et al., 2009Rochat, Egger, et al., 2009Rochat, Egger, et al., 2009Watcharananun, Cadwallader, et al., 2009Zawirska-Wojtasiak, Siwulski, et al., 2009
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase HP-InnowaxDB-WaxHP-FFAPDB-WaxZB-Wax
Column length (m) 30.60.30.30.60.
Carrier gas Helium HeliumHeHelium
Substrate      
Column diameter (mm) 0.250.350.250.250.32
Phase thickness (μm) 0.25 0.250.250.50
Tstart (C) 50.40.40.30.40.
Tend (C) 240.200.120.210.220.
Heat rate (K/min) 15.4.3.5.4.
Initial hold (min) 10. 3. 5.
Final hold (min) 19. 5. 5.
I 1093.1084.1104.1091.1103.
ReferenceCharoensiddhi and Anprung, 2008Ganeko, Shoda, et al., 2008Guzman-Geronimo, Lopez, et al., 2008Kumazawa, Itobe, et al., 2008Marin, Pozrl, et al., 2008
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase HP-InnowaxHP-InnowaxCP-Wax 52CBStabilwaxDB-Wax
Column length (m) 50.30.60.60.30.
Carrier gas HeliumHeliumHeHeliumHe
Substrate      
Column diameter (mm) 0.200.250.250.250.32
Phase thickness (μm) 0.200.250.250.250.5
Tstart (C) 45.50.40.40.40.
Tend (C) 190.250.220.240.240.
Heat rate (K/min) 4.6.53.3.5.
Initial hold (min) 2.1.5 5. 
Final hold (min) 50.10. 10. 
I 1084.1082.1097.1073.1086.
ReferenceSoria, Sanz, et al., 2008Thakeow, Angeli, et al., 2008Chyau, Tsai, et al., 2007Cros, Vandanjon, et al., 2007Dury-Brun, Fournier, et al., 2007
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase CP-Wax 52CBTC-WaxFFAPCP-Wax 52CBCP-Wax 52CB
Column length (m) 30.60.30.60.60.
Carrier gas HeHeN2HeHe
Substrate      
Column diameter (mm) 0.320.250.320.320.32
Phase thickness (μm) 0.250.250.50.50.5
Tstart (C) 40.60.35.40.40.
Tend (C) 220.240.320.220.220.
Heat rate (K/min) 3.2.4.4.4.
Initial hold (min) 1. 5.8.8.
Final hold (min) 2. 45.20.20.
I 1089.1103.1092.1090.1087.
ReferenceHymete, Rohloff, et al., 2007Miyazawa and Tamura, 2007Nebesny, Budryn, et al., 2007Povolo, Contarini, et al., 2007Povolo, Contarini, et al., 2007
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase CP-Wax 52CBTR-WAXDB-WaxDB-WaxDB-Wax
Column length (m) 60.60.30.30.15.
Carrier gas HeH2HeliumHeHe
Substrate      
Column diameter (mm) 0.320.250.250.320.32
Phase thickness (μm) 0.50.250.250.250.25
Tstart (C) 40.40.40.40.40.
Tend (C) 220.200.250.230.230.
Heat rate (K/min) 4.3.3.4.6.
Initial hold (min) 8.10. 2. 
Final hold (min) 20.10.20.15.20.
I 1089.1074.1084.1073.1103.
ReferencePovolo, Contarini, et al., 2007Tena N., Lazzez A., et al., 2007Berlinet, Brat, et al., 2006Fan and Qian, 2006Kishimoto, Wanikawa, et al., 2006
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase HP-20MDB-Wax EtrDB-WaxZB-WaxInnowax
Column length (m) 50.30.60.60.50.
Carrier gas HeHeHeliumHeHe
Substrate      
Column diameter (mm) 0.20.250.250.320.2
Phase thickness (μm) 0.20.250.250.50.5
Tstart (C) 70.40.35.40.60.
Tend (C) 180.220.240.250.250.
Heat rate (K/min) 4.2.6.3.2.
Initial hold (min) 4.1.3.2. 
Final hold (min) 15.10.10.10.60.
I 1089.1101.1082.1096.1098.
ReferenceMastelic, Jerkovic, et al., 2006Perestrelo, Fernandes, et al., 2006Spadone, Matthey-Doret, et al., 2006Wierda R.L., Fletcher G., et al., 2006Bendimerad and Bendiab, 2005
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase StabilwaxStabilwaxInnowaxDB-WaxDB-Wax
Column length (m) 30.30.60.30.60.
Carrier gas H2 HeHeNitrogen
Substrate      
Column diameter (mm) 0.320.320.250.250.32
Phase thickness (μm) 0.50.50.250.250.50
Tstart (C) 40.40.60.50.35.
Tend (C) 280.280.240.180.235.
Heat rate (K/min) 6.6.5.3.2.
Initial hold (min) 5.5.  4.
Final hold (min) 5.5.30.40.30.
I 1063.1063.1083.1073.1098.
ReferenceJirovetz, Buchbauer, et al., 2005Jirovetz, Buchbauer, et al., 2005, 2Joichi, Yomogida, et al., 2005Lee, Umano, et al., 2005Qian and Wang, 2005
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase DB-WaxSupelcowax-10Supelcowax-10Supelcowax-10ZB-Wax
Column length (m) 60.60.60.60.30.
Carrier gas  HeHeHeHelium
Substrate      
Column diameter (mm) 0.530.530.530.530.32
Phase thickness (μm) 1.1.1.1.0.25
Tstart (C) 50.40.40.40.40.
Tend (C) 180.240.240.240.250.
Heat rate (K/min) 3.4.4.4.5.
Initial hold (min) 10.2.2.2.2.
Final hold (min)  20.20.20.5.
I 1084.1105.1108.1114.1067.
ReferenceRizzolo, Cambiaghi, et al., 2005Rochat and Chaintreau, 2005Rochat and Chaintreau, 2005Rochat and Chaintreau, 2005N/A
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase ZB-WaxZB-WaxZB-WaxZB-WaxPEG-20M
Column length (m) 30.30.30.30.30.
Carrier gas HeliumHeliumHeliumHe 
Substrate      
Column diameter (mm) 0.320.320.320.320.25
Phase thickness (μm) 0.250.250.250.25 
Tstart (C) 40.40.40.40.60.
Tend (C) 250.250.250.250.180.
Heat rate (K/min) 5.5.5.5.3.
Initial hold (min) 2.2.2.2.10.
Final hold (min) 5.5.5.10.30.
I 1069.1069.1072.1069.1124.
ReferenceN/AN/AN/AWu, Krings, et al., 2005Yao, Guo, et al., 2005
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase TC-WaxDB-WaxHP-FFAPPEG-20MDB-Wax
Column length (m) 60.60.30.50.30.
Carrier gas HeHeHe H2
Substrate      
Column diameter (mm) 0.250.250.250.200.25
Phase thickness (μm) 0.50.250.250.200.5
Tstart (C) 40.40.40.40.50.
Tend (C) 230.220.120.180.200.
Heat rate (K/min) 3.3.5.3.3.
Initial hold (min) 8.5.5.5.10.
Final hold (min)   3.30.10.
I 1085.1094.1104.1080.1100.
ReferenceIshikawa, Ito, et al., 2004López, Ezpeleta, et al., 2004López, Guzmán, et al., 2004Narain, Almeida, et al., 2004Alves and Franco, 2003
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase HP-WaxHP-WaxStabilwaxDB-WaxDB-Wax
Column length (m) 60.60.60.60.60.
Carrier gas HeHeHeliumH2Helium
Substrate      
Column diameter (mm) 0.250.250.250.320.25
Phase thickness (μm) 0.50.50.250.25 
Tstart (C) 40.40.40.40.70.
Tend (C) 199.190.240.230.210.
Heat rate (K/min) 3.3.3.4.2.
Initial hold (min) 6.6.5.5. 
Final hold (min)   10.25.60.
I 1084.1084.1073.1077.1090.
ReferenceAndueza, Maeztu, et al., 2003Andueza, de Peña, et al., 2003Cros, Vandanjon, et al., 2003Dregus and Engel, 2003Mookdasanit, Tamura, et al., 2003
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase Carbowax 20MHP-InnowaxSupelcowax-10Supelcowax-10Supelcowax-10
Column length (m) 50.50.30.30.30.
Carrier gas HeliumHeHeHeHe
Substrate      
Column diameter (mm) 0.700.20.250.250.25
Phase thickness (μm)  0.20.250.250.25
Tstart (C) 50.70.40.40.40.
Tend (C) 280.190.200.200.200.
Heat rate (K/min) 4.5.3.3.3.
Initial hold (min) 2. 10.10.10.
Final hold (min)      
I 1078.1094.1074.1084.1073.
ReferenceSaura, LAencina, et al., 2003Velasco-Negueruela, Pérez-Alonso, et al., 2003Vichi, Castellote, et al., 2003Vichi, Pizzale, et al., 2003Vichi, Pizzale, et al., 2003, 2
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase DB-FFAPDB-FFAPBP-20DB-WaxRTX-Wax
Column length (m) 30.30.50.30.60.
Carrier gas HeHeH2HeHe
Substrate      
Column diameter (mm) 0.320.320.250.250.25
Phase thickness (μm) 0.250.250.250.250.5
Tstart (C) 40.40.45.40.40.
Tend (C) 230.230.230.250.180.
Heat rate (K/min) 6.6.3.8.5.
Initial hold (min) 2.2.1.5.5.
Final hold (min) 10.10.10.5.20.
I 1071.1071.1073.1076.1095.
ReferenceCzerny and Schieberle, 2002Czerny and Schieberle, 2002Darriet, Pons, et al., 2002Fu, Yoon, et al., 2002Galindo-Cuspinera, Lubran, et al., 2002
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase DB-WaxHP-WaxDB-WaxEC-1000DB-Wax
Column length (m) 60.60.60.30.30.
Carrier gas H2HeHeHeHe
Substrate      
Column diameter (mm) 0.320.250.250.250.53
Phase thickness (μm) 0.250.50.250.251.
Tstart (C) 40.40.40.35.40.
Tend (C) 245.190.200.230.225.
Heat rate (K/min) 1.53.2.5.6.
Initial hold (min)  6.2.5.5.
Final hold (min) 20.  15.30.
I 1072.1084.1070.1105.1071.
ReferenceGancel, Ollé, et al., 2002Sanz, Maeztu, et al., 2002Umano, Hagi, et al., 2002Bendall, 2001Cadwallader and Heo, 2001
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase DB-WaxDB-WaxDB-WaxDB-WaxHP-Wax
Column length (m) 60.30.60.30.60.
Carrier gas  HeliumHeHeHe
Substrate      
Column diameter (mm) 0.320.250.250.250.25
Phase thickness (μm) 0.250.25 0.10.5
Tstart (C) 50.25.40.40.40.
Tend (C) 210.220.220.180.190.
Heat rate (K/min) 1.54.2.2.3.
Initial hold (min) 5.  5.6.
Final hold (min) 10.30. 20. 
I 1090.1090.1112.1076.1084.
ReferenceChyau and Mau, 2001Duque, Bonilla, et al., 2001Jiang and Kubota, 2001Kato and Shibamoto, 2001Maeztu, Sanz, et al., 2001
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase TC-WaxHP-FFAPHP-WaxDB-WaxDB-Wax
Column length (m) 60.50.60.30.60.
Carrier gas He HeHe 
Substrate      
Column diameter (mm) 0.250.320.250.250.25
Phase thickness (μm)  0.50.50.250.25
Tstart (C) 80.35.40.50.30.
Tend (C) 250.230.190.220.170.
Heat rate (K/min) 4.6.3.4.2.
Initial hold (min)   6.3.4.
Final hold (min) 47.15.  30.
I 1080.1107.1084.1080.1077.
ReferenceMiyazawa, Kurose, et al., 2001Preininger and Ullrich, 2001Sanz, Ansorena, et al., 2001Weckerle, Bastl-Borrmann, et al., 2001Buttery, Light, et al., 2000
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase FFAPSupelcowax-10DB-WaxDB-WaxDB-Wax
Column length (m) 30.60.30.30.25.
Carrier gas HeHeH2HeHe
Substrate      
Column diameter (mm) 0.320.250.320.250.25
Phase thickness (μm) 0.250.250.50.250.25
Tstart (C) 40.35.60.50.50.
Tend (C) 230.200.245.180.200.
Heat rate (K/min) 6.4.3.3.4.
Initial hold (min) 2.10.3. 4.
Final hold (min) 5. 20.40.10.
I 1076.1092.1090.1089.1067.
ReferenceCzerny and Grosch, 2000Girard and Durance, 2000Kotseridis and Baumes, 2000Lee and Shibamoto, 2000Morales, Duque, et al., 2000
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase DB-WaxDB-WaxDB-WaxDB-WaxCarbowax 20M
Column length (m) 25.60.60.60.25.
Carrier gas HeHeliumNitrogenHeHe
Substrate      
Column diameter (mm) 0.250.320.250.250.3
Phase thickness (μm) 0.250.25 0.25 
Tstart (C) 50.50.40.40.60.
Tend (C) 200.230.200.200.190.
Heat rate (K/min) 4.5.2.2.5.
Initial hold (min) 4.2.10.2.2.
Final hold (min) 10.   20.
I 1075.1083.1093.1080.1087.
ReferenceMorales, Duque, et al., 2000Paniandy, Chane-Ming, et al., 2000Tamura, Boonbumrung, et al., 2000Umano, Hagi, et al., 2000Xue, Ye, et al., 2000
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase DB-WaxDB-WaxCP-Wax 52CBDB-WaxDB-Wax
Column length (m) 60.60.50.30.30.
Carrier gas  N2H2  
Substrate      
Column diameter (mm) 0.320.250.320.530.53
Phase thickness (μm)  0.250.22  
Tstart (C) 30.40.60.60.60.
Tend (C) 170.210.190.210.210.
Heat rate (K/min) 2.3.2.4.4.
Initial hold (min) 4. 4.  
Final hold (min) 60. 21.  
I 1077.1074.1084.1084.1104.
ReferenceButtery, Orts, et al., 1999Chyau and Mau, 1999Hwan and Chou, 1999Iwatsuki, Mizota, et al., 1999Iwatsuki, Mizota, et al., 1999
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase InnowaxSupelcowax-10DB-WaxDB-WaxDB-Wax
Column length (m) 60.30.60.60.60.
Carrier gas HeHeHeHeHe
Substrate      
Column diameter (mm) 0.250.250.320.320.25
Phase thickness (μm) 0.25 0.50.250.25
Tstart (C) 60.60.34.34.40.
Tend (C) 220.240.200.200.200.
Heat rate (K/min)  4.5.5.2.
Initial hold (min) 10. 3.3.2.
Final hold (min)   10.10. 
I 1093.1088.1103.1075.1080.
ReferenceKaya, Baser, et al., 1999Labuckas, Zygadlo, et al., 1999Schlüter, Steinhart, et al., 1999Schlüter, Steinhart, et al., 1999Umano, Nakahara, et al., 1999
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase DB-WaxPEG-20MDB-WaxSupelcowax-10DB-Wax
Column length (m) 60.25.60.30.30.
Carrier gas   HeHeN2
Substrate      
Column diameter (mm) 0.250.250.250.250.25
Phase thickness (μm)   1. 0.25
Tstart (C) 30.50.50.60.45.
Tend (C) 170.230.200.240.220.
Heat rate (K/min) 2.2.3.4.3.
Initial hold (min) 4.    
Final hold (min) 30. 40.  
I 1077.1034.1073.1088.1080.
ReferenceButtery and Ling, 1998Ding, Deng, et al., 1998Horiuchi, Umano, et al., 1998Lamarque, Maestri, et al., 1998Molleken U., Sinnwell V., et al., 1998
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase HP-InnowaxHP-InnowaxInnowaxCBP-20DB-Wax
Column length (m) 25.25.30.25.60.
Carrier gas      
Substrate      
Column diameter (mm) 0.320.320.250.250.25
Phase thickness (μm)   0.25 0.25
Tstart (C) 35.35.40.35.50.
Tend (C) 250.250.240.200.230.
Heat rate (K/min) 4.4.6.5.2.
Initial hold (min)   10.5. 
Final hold (min)   25.  
I 1071.1071.1079.1074.1075.
ReferenceOng and Acree, 1998Ong, Acree, et al., 1998Petersen, Poll, et al., 1998Quiroz A. and Niemeyer H.M., 1998Ravichandran and Parthiban, 1998
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase PEG-20MCP-Wax 52CBDB-WaxDB-WaxDB-Wax
Column length (m) 60.50.30.30.30.
Carrier gas HeHeHydrogenHeHe
Substrate      
Column diameter (mm) 0.250.320.320.320.25
Phase thickness (μm)  0.250.500.250.25
Tstart (C) 70.50.35.50.20.
Tend (C) 210.210.250.240.200.
Heat rate (K/min) 3.1.54.6.4.
Initial hold (min)  5.0.53.4.
Final hold (min)  10.  10.
I 1083.1090.1090.1099.1063.
ReferenceAwano, Honda, et al., 1997Chyau, Lin, et al., 1997Farkas, Sádecká, et al., 1997Hashizume and Samuta, 1997Morales, Albarracín, et al., 1996
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase DB-WaxPEG-20MTC-WaxSupelcowax-10Supelcowax-10
Column length (m) 30.50.60.60.90.
Carrier gas HeHe HeHe
Substrate      
Column diameter (mm) 0.250.250.250.250.25
Phase thickness (μm) 0.25  0.250.25
Tstart (C) 50.70.80.40.35.
Tend (C) 200.250.240.200.220.
Heat rate (K/min) 4.2.3.3.2.
Initial hold (min) 4. 5.3.20.
Final hold (min) 10.  30.30.
I 1067.1089.1082.1092.1084.
ReferenceMorales, Albarracín, et al., 1996Orav, Kailas, et al., 1996Shuichi, Masazumi, et al., 1996Wong and Lai, 1996Girard and Lau, 1995
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase Carbowax 20MDB-WaxDB-WaxPEG-20MPEG-20M
Column length (m) 60.60.60.50.50.
Carrier gas  HeHeHeHe
Substrate      
Column diameter (mm) 0.250.250.250.250.25
Phase thickness (μm)    0.150.15
Tstart (C) 60.60.60.60.60.
Tend (C) 180.180.180.180.180.
Heat rate (K/min) 2.2.2.2.2.
Initial hold (min) 4.4.4.4.4.
Final hold (min)      
I 1064.1071.1076.1063.1065.
ReferenceKawakami, Ganguly, et al., 1995Kobayashi, Tsuda, et al., 1995Kobayashi, Tsuda, et al., 1995Togari, Kobayashi, et al., 1995Togari, Kobayashi, et al., 1995
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase DB-WaxDB-WaxDB-WaxDB-WaxDB-Wax
Column length (m) 30.30.30.30.30.
Carrier gas H2H2HeHeHe
Substrate      
Column diameter (mm)   0.250.250.25
Phase thickness (μm) 0.250.250.250.250.25
Tstart (C) 60.60.60.60.60.
Tend (C) 230.230.230.230.230.
Heat rate (K/min) 8.8.8.8.8.
Initial hold (min) 5.5.5.5.5.
Final hold (min) 10.10.10.10.10.
I 1084.1085.1077.1079.1079.
ReferenceSteullet and Guerin, 1994Steullet and Guerin, 1994Steullet and Guerin, 1994Steullet and Guerin, 1994Steullet and Guerin, 1994
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase DB-WaxDB-WaxCarbowax 20MCarbowax 20MDB-Wax
Column length (m) 30.60.80.50.60.
Carrier gas He  HeHe
Substrate      
Column diameter (mm) 0.250.250.20.250.25
Phase thickness (μm) 0.25   0.25
Tstart (C) 60.60.70.60.50.
Tend (C) 230.220.170.180.230.
Heat rate (K/min) 8.3.2.2.2.
Initial hold (min) 5.4. 4.4.
Final hold (min) 10.    
I 1081.1107.1084.1064.1079.
ReferenceSteullet and Guerin, 1994Chung, Eiserich, et al., 1993Egolf and Jurs, 1993Kawakami, Kobayashi, et al., 1993Shimoda, Shiratsuchi, et al., 1993
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase CP-Wax 52CBDB-WaxCarbowax 20MPEG-20MCarbowax 20M
Column length (m) 50.30.50.50.80.
Carrier gas H2HeHeN2 
Substrate      
Column diameter (mm) 0.320.250.250.250.2
Phase thickness (μm) 0.22    
Tstart (C) 50.60.60.60.70.
Tend (C) 200.240.180.180.170.
Heat rate (K/min) 2.3.2.2.2.
Initial hold (min) 5.10.4.  
Final hold (min)      
I 1080.31058.1064.1067.1084.
ReferenceChyau, Chen, et al., 1992Hatsuko, Kazuko, et al., 1992Kawakami and Kobayashi, 1991Kubota, Nakamoto, et al., 1991Anker, Jurs, et al., 1990
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase DB-WaxDB-WaxDB-WaxCarbowax 20MDB-Wax
Column length (m) 60.60. 50.60.
Carrier gas   30Nitrogen 
Substrate      
Column diameter (mm) 0.320.320.250.250.32
Phase thickness (μm)      
Tstart (C) 50.50.30.80.50.
Tend (C) 230.230.240.180.230.
Heat rate (K/min) 4.4.50.2.4.
Initial hold (min)   10. 0.1
Final hold (min) 10.10.  10.
I 1075.1078.1059.1094.1077.
ReferenceBinder, Benson, et al., 1990Binder, Turner, et al., 1990Pfannhauser, 1990Tamura, Kihara, et al., 1990Binder, Flath, et al., 1989
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase DB-WaxSupelcowax-10DB-WaxDB-WaxDB-Wax
Column length (m) 60.60.60.60.60.
Carrier gas  HeHeHeHe
Substrate      
Column diameter (mm) 0.320.250.320.320.32
Phase thickness (μm)  0.250.250.250.25
Tstart (C) 50.40.30.30.30.
Tend (C) 250.175.180.180.180.
Heat rate (K/min) 4.1.2.2.2.
Initial hold (min) 0.15.4.4.4.
Final hold (min) 5.    
I 1075.1085.1078.1078.1078.
ReferenceBinder and Flath, 1989Hsieh, Williams, et al., 1989Takeoka and Butter, 1989Takeoka and Butter, 1989Takeoka and Butter, 1989
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase DB-WaxDB-WaxCarbowax 20MCarbowax 20MDB-Wax
Column length (m) 60.60.50.50.60.
Carrier gas HeHeN2N2H2
Substrate      
Column diameter (mm) 0.320.3220.220.220.25
Phase thickness (μm) 0.250.25  0.25
Tstart (C) 30.50.80.80.30.
Tend (C) 180.230.200.200.180.
Heat rate (K/min) 2.4.3.3.2.
Initial hold (min) 4.   2.
Final hold (min)      
I 1081.1078.1081.1082.1079.
ReferenceTakeoka and Butter, 1989Engel, Flath, et al., 1988Mihara, Tateba, et al., 1988Mihara, Tateba, et al., 1988Takeoka, Flath, et al., 1988
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase DB-WaxCarbowax 20MCarbowax 20MCarbowax 20MBP-20
Column length (m) 60.50.50.50.25.
Carrier gas H2N2N2Hydrogen 
Substrate      
Column diameter (mm) 0.250.220.220.200.2
Phase thickness (μm) 0.25    
Tstart (C) 30.80.80.50.70.
Tend (C) 180.200.200.200.180.
Heat rate (K/min) 2.3.3.1.3.
Initial hold (min) 2.   5.
Final hold (min)    35. 
I 1079.1081.1082.1079.1084.
ReferenceTakeoka, Flath, et al., 1988Mihara, Tateba, et al., 1987Mihara, Tateba, et al., 1987Wu, Liou, et al., 1987MacLeod and Snyder, 1985
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryPackedCapillaryCapillaryCapillary
Active phase Carbowax 20MCarbowaxCarbowax 20MCarbowax 20MCarbowax 20M
Column length (m) 150.3.31.150.150.
Carrier gas  HeHeliumHe 
Substrate  Chromosorb G AW DMCS   
Column diameter (mm) 0.66 0.500.640.64
Phase thickness (μm)      
Tstart (C) 60.60.40.50.50.
Tend (C) 170.180.200.170.170.
Heat rate (K/min) 1.4.10.1.1.
Initial hold (min) 40.  10.30.
Final hold (min)    60. 
I 1040.1096.1075.1050.1108.
ReferenceButtery and Ling, 1984Schieberle and Grosch, 1983Labropoulos, Palmer, et al., 1982Seifert and King, 1982Buttery, Parker, et al., 1981
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillary
Active phase Carbowax 20MCarbowax 20MCarbowax 20MCarbowax 20M
Column length (m) 150.150.50.50.
Carrier gas   N2N2
Substrate     
Column diameter (mm) 0.640.640.280.28
Phase thickness (μm)     
Tstart (C) 50.50.80.80.
Tend (C) 170.170.170.170.
Heat rate (K/min) 1.1.1.1.
Initial hold (min) 30.30.  
Final hold (min)     
I 1108.1100.1053.1054.
ReferenceButtery and Kamm, 1980Buttery, Ling, et al., 1980Yamaguchi and Shibamoto, 1980Yamaguchi and Shibamoto, 1980
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI

References

Go To: Top, Normal alkane RI, polar column, temperature ramp, Notes

Data compilation copyright by the U.S. Secretary of Commerce on behalf of the U.S.A. All rights reserved.

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Jirovetz, Buchbauer, et al., 2005, 2
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Rochat and Chaintreau, 2005
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Yao, Guo, et al., 2005
Yao, S.-S.; Guo, W.-F.; Lu, Y.; Jiang, Y.-X., Flavor Characteristics of Lapsang Souchong and Smoked Lapsang Souchong, a Special Chinese Black Tea with Pine Smoking Process, J. Agric. Food Chem., 2005, 53, 22, 8688-8693, https://doi.org/10.1021/jf058059i . [all data]

Ishikawa, Ito, et al., 2004
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López, Ezpeleta, et al., 2004
López, R.; Ezpeleta, E.; Sánchez, I.; Cacho, J.; Ferreira, V., Analysis of the aroma intensities of volatile compounds released from mild acid hydrolysates of odourless precursors extracted from Tempranillo and Grenache grapes using gas chromatography-olfactometry, Food Chem., 2004, 88, 1, 95-103, https://doi.org/10.1016/j.foodchem.2004.01.025 . [all data]

López, Guzmán, et al., 2004
López, M.G.; Guzmán, G.R.; Dorantes, A.L., Solid-phase microextraction and gas chromatography-mass spectrometry of volatile compounds from avocado puree after microwave processing, J. Chromatogr. A, 2004, 1036, 1, 87-90, https://doi.org/10.1016/j.chroma.2004.03.020 . [all data]

Narain, Almeida, et al., 2004
Narain, N.; Almeida, J.N.; Galvão, M.S.; Madruga, M.S.; de Brito, E.S., Volatile compounds in passion fruit (Passiflora edulis forma Flavicarpa) and yellow mombin (Spondias mombin L.) fruits obtained by dynamic headspace technique, Cienc. Tecnol. Aliment. Campinas, 2004, 24, 2, 212-216, https://doi.org/10.1590/S0101-20612004000200009 . [all data]

Alves and Franco, 2003
Alves, G.L.; Franco, M.R.B., Headspace gas chromatography-mass spectrometry of volatile compounds in murici (Byrsonima crassifolia L. Rich), J. Chromatogr. A, 2003, 985, 1-2, 297-301, https://doi.org/10.1016/S0021-9673(02)01398-5 . [all data]

Andueza, Maeztu, et al., 2003
Andueza, S.; Maeztu, L.; Pascual, L.; Ibanez, C.; de Pena M.P.; Cid, C., Influence of extraction temperature on the final quality of espresso coffee, J. Sci. Food Agric., 2003, 83, 3, 240-248, https://doi.org/10.1002/jsfa.1304 . [all data]

Andueza, de Peña, et al., 2003
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Notes

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