2,4-Decadienal, (E,E)-


Van Den Dool and Kratz RI, polar column, temperature ramp

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Data compilation copyright by the U.S. Secretary of Commerce on behalf of the U.S.A. All rights reserved.

Data compiled by: NIST Mass Spectrometry Data Center, William E. Wallace, director

Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase HP-InnowaxFFAPFFAPRTX-WaxDB-Wax
Column length (m) 30.30.30.60.30.
Carrier gas HeHeHeHeHe
Substrate      
Column diameter (mm) 0.250.250.250.220.25
Phase thickness (μm) 0.250.250.250.250.5
Tstart (C) 60.35.35.60.40.
Tend (C) 280.225.225.230.250.
Heat rate (K/min) 3.10.10.2.4.
Initial hold (min)  5.5. 5.
Final hold (min)  25.25.35.15.
I 1826.1809.1812.1798.1805.
ReferenceKundakovic, Fokialakis, et al., 2007Lozano P.R., Drake M., et al., 2007Lozano P.R., Drake M., et al., 2007Paolini, Muselli, et al., 2007Pozo-Bayon M.A., Ruiz-Rodriguez A., et al., 2007
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase DB-WaxDB-WaxFFAPCP-Wax 52CBCP-Wax 52CB
Column length (m) 30.30.30.50.50.
Carrier gas HeHeHe  
Substrate      
Column diameter (mm) 0.250.320.320.320.32
Phase thickness (μm) 0.50.5   
Tstart (C) 40.40.40.60.60.
Tend (C) 250.240.240.220.220.
Heat rate (K/min) 4.7.8.4.4.
Initial hold (min) 5. 2.5.5.
Final hold (min) 15.5.5.30.30.
I 1800.1828.1800.1810.1798.
ReferencePozo-Bayon M.A., Ruiz-Rodriguez A., et al., 2007Ruiz Perez-Cacho, Mahattanatawee, et al., 2007Schlutt B., Moran N., et al., 2007Mahadevan and Farmer, 2006Mahadevan and Farmer, 2006
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase DB-WaxSupelcowax-10StabilwaxStabilwaxDB-Wax
Column length (m) 30.60.60.60.30.
Carrier gas He HeHeHe
Substrate      
Column diameter (mm) 0.250.250.250.250.32
Phase thickness (μm) 0.50.250.250.250.5
Tstart (C) 50.35.40.40.40.
Tend (C) 260.195.240.240.240.
Heat rate (K/min) 4.6.3.3.7.
Initial hold (min)  5.5.5. 
Final hold (min) 5.60.10.10.5.
I 1763.1784.1840.1827.1819.
ReferenceSelli, Rannou, et al., 2006Chung, Fung, et al., 2005Cros S., Lignot B., et al., 2005Cros, Lignot, et al., 2005Mahattanatawee, Rouseff, et al., 2005
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase RTX-WaxSupelcowax-10DB-WaxDB-WaxDB-Wax
Column length (m) 60.30.30.0.30.
Carrier gas HeHeHelium He
Substrate      
Column diameter (mm) 0.220.250.320.320.25
Phase thickness (μm) 0.250.250.500.50.5
Tstart (C) 60.60.40.40.40.
Tend (C) 230.240.240.240.230.
Heat rate (K/min) 2.3.7.7.5.
Initial hold (min)  5.  2.
Final hold (min) 35.10.5.5.10.
I 1798.1809.1828.1825.1795.
ReferencePaolini, Costa, et al., 2005Riu-Aumatell, Lopez-Tamames, et al., 2005Bell, 2004Gocmen, Gurbuz, et al., 2004Mahajan, Goddik, et al., 2004
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase DB-WaxDB-WaxInnowaxStabilwaxDB-Wax
Column length (m) 30.30.15.60.30.
Carrier gas HeHeHeHe 
Substrate      
Column diameter (mm) 0.250.250.250.250.32
Phase thickness (μm) 0.250.250.250.250.5
Tstart (C) 45.45.35.40.40.
Tend (C) 240.240.225.240.240.
Heat rate (K/min) 6.6.4.3.7.
Initial hold (min) 10.10.5.5. 
Final hold (min) 30.30.20.10.5.
I 1789.1789.1814.1827.1820.
ReferenceNielsen, Larsen, et al., 2004Nielsen, Larsen, et al., 2004, 2Chisholm, Jell, et al., 2003Cros, Vandanjon, et al., 2003Högnadóttir and Rouseff, 2003
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase DB-WaxDB-WaxDB-WaxZB-WaxZB-Wax
Column length (m) 60.30.30.60.60.
Carrier gas N2He HeHe
Substrate      
Column diameter (mm) 0.250.250.320.320.32
Phase thickness (μm) 0.250.250.50.250.25
Tstart (C) 40.40.40.40.40.
Tend (C) 210.240.240.220.220.
Heat rate (K/min) 2.6.7.3.3.
Initial hold (min)  10.   
Final hold (min) 40.30.5.  
I 1795.1789.1832.1770.1770.
ReferenceMau, Ko, et al., 2003Nielsen, Larsen, et al., 2003Valim, Rouseff, et al., 2003Brunton, Cronin, et al., 2002Brunton, Cronin, et al., 2002
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase DB-WaxDB-WaxDB-WaxDB-WaxSupelcowax-10
Column length (m) 30.30.60.30.60.
Carrier gas   HeHeHe
Substrate      
Column diameter (mm) 0.250.250.250.320.25
Phase thickness (μm) 0.250.250.250.500.25
Tstart (C) 35.35.40.40.35.
Tend (C) 200.200.200.240.195.
Heat rate (K/min) 10.10.2.7.2.
Initial hold (min) 5.5.5. 5.
Final hold (min) 30.30.30.5.90.
I 1793.1807.1804.1825.1816.
ReferenceKaragül-Yüceer, Cadwallader, et al., 2002Karagül-Yüceer, Drake, et al., 2001Kim, 2001Lin and Rouseff, 2001Chung, 1999
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase DB-WaxDB-WaxDB-WaxPEG-20MDB-Wax
Column length (m) 30.60.30.60.60.
Carrier gas   HeHeHe
Substrate      
Column diameter (mm) 0.320.250.320.250.25
Phase thickness (μm) 0.250.250.250.250.25
Tstart (C) 40.40.40.50.50.
Tend (C) 200.200.200.230.230.
Heat rate (K/min) 6.3.6.2.2.
Initial hold (min) 5.5.5.  
Final hold (min) 30.60.30.60.60.
I 1804.1808.1797.1811.1811.
ReferenceCha and Cadwallader, 1998Cha, Kim, et al., 1998Cha, Kim, et al., 1998Shimoda, Nakada, et al., 1997Shimoda, Shiratsuchi, et al., 1996
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase DB-WaxSupelcowax-10Supelcowax-10Supelcowax-10CP-WAX 57CB
Column length (m) 60.60.60.60.50.
Carrier gas  He   
Substrate      
Column diameter (mm) 0.250.250.250.250.32
Phase thickness (μm) 0.250.250.250.25 
Tstart (C) 50.40.40.40.60.
Tend (C) 230.195.175.175.200.
Heat rate (K/min) 2.2.2.2.4.
Initial hold (min)  5.5.5.5.
Final hold (min)  40.20.20. 
I 1815.1817.1820.1820.1815.
ReferenceShimoda, Shigematsu, et al., 1995Chung and Cadwallader, 1993Tanchotikul and Hsieh, 1989Tanchotikul and Hsieh, 1989Salter L.J., Mottram D.S., et al., 1988
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillary
Active phase Carbowax 20MCarbowax 20M
Column length (m) 50.50.
Carrier gas HeH2
Substrate   
Column diameter (mm) 0.320.2
Phase thickness (μm)   
Tstart (C) 50.50.
Tend (C) 200.200.
Heat rate (K/min) 2.2.
Initial hold (min) 5. 
Final hold (min) 40.55.
I 1780.1765.
ReferenceChen, Kuo, et al., 1986Wu and Liou, 1986
Comment MSDC-RI MSDC-RI

References

Go To: Top, Van Den Dool and Kratz RI, polar column, temperature ramp, Notes

Data compilation copyright by the U.S. Secretary of Commerce on behalf of the U.S.A. All rights reserved.

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Notes

Go To: Top, Van Den Dool and Kratz RI, polar column, temperature ramp, References