1-Butanol, 3-methyl-

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Van Den Dool and Kratz RI, polar column, temperature ramp

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Data compilation copyright by the U.S. Secretary of Commerce on behalf of the U.S.A. All rights reserved.

Data compiled by: NIST Mass Spectrometry Data Center, William E. Wallace, director

Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase DB-WaxInnowaxHP-InnowaxFFAPDB-Wax
Column length (m) 30.30.60.30.60.
Carrier gas HeH2He He
Substrate      
Column diameter (mm) 0.250.250.250.320.25
Phase thickness (μm) 0.250.250.250.250.25
Tstart (C) 50.45.50.40.40.
Tend (C) 180.210.220.240.200.
Heat rate (K/min) 3.53.54.6.4.
Initial hold (min) 2.5.4.2.1.
Final hold (min) 25.20.10.10.10.
I 1217.1230.1206.1210.1209.
ReferenceBotelho, Caldeira, et al., 2007Botelho, Caldeira, et al., 2007Quijano, Linares, et al., 2007Steinhaus and Schieberle, 2007Cho, Choi, et al., 2006
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase DB-WaxDB-WaxDB-WaxDB-WaxInnowax
Column length (m) 60.30.60.30.60.
Carrier gas HeHeHeHeHe
Substrate      
Column diameter (mm) 0.250.250.250.320.25
Phase thickness (μm) 0.250.250.250.50.25
Tstart (C) 40.50.40.40.40.
Tend (C) 200.230.265.265.230.
Heat rate (K/min) 4.10.7.7.4.
Initial hold (min) 1.5.  4.
Final hold (min) 10.25.5.5.20.
I 1212.1202.1209.1217.1210.
ReferenceCho, Choi, et al., 2006Fernandez-Segovia, Escriche, et al., 2006Gurbuz O., Rouseff J.M., et al., 2006Gurbuz O., Rouseff J.M., et al., 2006Lee, Lee, et al., 2006
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase DB-WaxDB-WaxDB-WaxLM-120CP-Wax 52CB
Column length (m) 30.30.30.50.60.
Carrier gas He    
Substrate      
Column diameter (mm) 0.250.320.320.250.25
Phase thickness (μm) 0.250.50.50.50.25
Tstart (C) 50.40.40.50.35.
Tend (C) 220.200.200.240.203.
Heat rate (K/min) 4.5.5.3.3.
Initial hold (min) 4.3.3. 4.
Final hold (min) 20.8.8.30. 
I 1205.1223.1237.1194.1199.
ReferenceOsorio, Alarcon, et al., 2006Petka, Ferreira, et al., 2006Petka, Ferreira, et al., 2006Pinto, Guedes, et al., 2006Alasalvar, Taylor, et al., 2005
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase OV-351Supelcowax-10Supelcowax-10StabilwaxDB-Wax
Column length (m) 50.60.60.30.60.
Carrier gas He HeN2He
Substrate      
Column diameter (mm) 0.320.250.250.320.32
Phase thickness (μm) 0.20.250.251.1.
Tstart (C) 60.35.40.40.45.
Tend (C) 220.195.280.230.250.
Heat rate (K/min) 5.6.4.4.5.
Initial hold (min)  5.2.2.1.
Final hold (min)  60. 10.12.
I 1163.1165.1213.1214.1223.
ReferenceBonvehí, 2005Chung, Fung, et al., 2005Elmore, Nisyrios, et al., 2005Fang and Qian, 2005Malliaa, Fernandez-Garcia, et al., 2005
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase Carbowax 20MCP-Wax 52CBZB-WaxDB-WaxDB-Wax
Column length (m) 60.30.30.30.30.
Carrier gas HeHeHeHeHe
Substrate      
Column diameter (mm) 0.250.250.250.250.25
Phase thickness (μm) 0.250.20.150.250.25
Tstart (C) 45.80.35.40.40.
Tend (C) 250.240.220.240.240.
Heat rate (K/min) 2.10.1.86.6.
Initial hold (min) 0.174.10.10.10.
Final hold (min)   10.25.25.
I 1194.1203.1208.1200.1206.
ReferenceVerzera, Campisi, et al., 2005Ferrari, Lablanquie, et al., 2004Ledauphin, Saint-Clair, et al., 2004Varming, Andersen, et al., 2004Varming, Petersen, et al., 2004
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase OV-351DB-WaxAT-WaxSupelcowax-10AT-Wax
Column length (m) 50.60.60.60.60.
Carrier gas HeHeHeHeHe
Substrate      
Column diameter (mm) 0.320.250.320.250.32
Phase thickness (μm) 0.20.250.250.250.25
Tstart (C) 60.40.65.35.65.
Tend (C) 220.210.250.195.250.
Heat rate (K/min) 5.2.2.2.2.
Initial hold (min)   10.5.10.
Final hold (min)  40.60.90.60.
I 1163.1195.1190.1208.1187.
ReferenceBonvehi and Coll, 2003Chyau, Ko, et al., 2003Pino, Almora, et al., 2003Chung, Yung, et al., 2002Pino, Marbot, et al., 2002
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase Supelcowax-10DB-WaxAT-WaxAT-WaxCP-Wax 52CB
Column length (m) 60.30.60.60.60.
Carrier gas HeHeHeHeHe
Substrate      
Column diameter (mm) 0.250.250.320.320.25
Phase thickness (μm) 0.250.250.250.250.25
Tstart (C) 35.40.65.65.45.
Tend (C) 195.200.250.250.250.
Heat rate (K/min) 2.2.2.2.2.
Initial hold (min) 5.5.10.10.0.17
Final hold (min) 90.20.60.60. 
I 1208.1209.1187.1187.1194.
ReferenceChung, Yung, et al., 2001Kim, Shin, et al., 2001Pino and Marbot, 2001Pino, Marbot, et al., 2001Verzera, Campisi, et al., 2001
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase DB-WaxDB-WaxDB-FFAPSupelcowax-10CP-Wax 52CB
Column length (m) 30.30.30.60.50.
Carrier gas He H2HeHe
Substrate      
Column diameter (mm) 0.320.320.320.250.25
Phase thickness (μm) 0.50.50.250.250.2
Tstart (C) 60.60.40.35.30.
Tend (C) 245.245.240.195.220.
Heat rate (K/min) 3.3.5.2.2.
Initial hold (min) 3.3.2. 1.3
Final hold (min) 20.20. 90. 
I 1210.1210.1207.1209.1191.
ReferenceBureau, Baumes, et al., 2000Bureau, Razungles, et al., 2000Charles, Martin, et al., 2000Chung, 2000Jensen, Christensen, et al., 2000
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase DB-WaxCP-Wax 52CBSupelcowax-10Supelcowax-10DB-Wax
Column length (m) 60.50.60.60.60.
Carrier gas He HeHe 
Substrate      
Column diameter (mm) 0.320.320.250.250.25
Phase thickness (μm) 0.5 0.250.250.25
Tstart (C) 40.60.35.35.40.
Tend (C) 250.220.195.195.200.
Heat rate (K/min) 4.4.2.2.3.
Initial hold (min) 2.5.5.5.5.
Final hold (min) 10.30.90.90.60.
I 1221.1215.1209.1209.1208.
ReferenceLe Guen, Prost, et al., 2000Chevance and Farmer, 1999Chung, 1999Chung, 1999, 2Cha, Kim, et al., 1998
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase DB-WaxDB-WaxDB-WaxSupelcowax-10DB-Wax
Column length (m) 30.30.60.60.30.
Carrier gas He HeHeHe
Substrate      
Column diameter (mm) 0.320.320.250.250.25
Phase thickness (μm) 0.250.50.250.25 
Tstart (C) 40.40.50.40.40.
Tend (C) 200.245.230.200.200.
Heat rate (K/min) 6.3.3.2.2.
Initial hold (min) 5.3. 5.5.
Final hold (min) 30.20. 30. 
I 1200.1197.1255.1204.1198.
ReferenceCha, Kim, et al., 1998Ollé, Baumes, et al., 1998Shimoda, Peralta, et al., 1996Cadwallader, Tan, et al., 1995Iwaoka, Hagi, et al., 1994
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase DB-WaxSupelcowax-10HP-20MHP-FFAPDB-Wax
Column length (m) 60.60.50.50.60.
Carrier gas HeHeHeHeHe
Substrate      
Column diameter (mm) 0.250.250.250.250.25
Phase thickness (μm)  0.25   
Tstart (C) 40.40.60.60.35.
Tend (C) 200.195.190.210.180.
Heat rate (K/min) 3.2.3.3.3.
Initial hold (min) 5.5.  5.
Final hold (min)  40.   
I 1206.1207.1182.1213.1203.
ReferenceSumitani, Suekane, et al., 1994Chung and Cadwallader, 1993Chung, Eiserich, et al., 1993Chung, Eiserich, et al., 1993Stashenko, Macku, et al., 1992
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase DB-WaxCP-Wax 52CBDB-WaxDB-WaxDB-Wax
Column length (m) 30.50.30.30.30.
Carrier gas HeH2HeHeHe
Substrate      
Column diameter (mm) 0.250.320.250.2590.259
Phase thickness (μm)   0.250.250.25
Tstart (C) 40.50.50.50.50.
Tend (C) 200.200.240.240.240.
Heat rate (K/min) 2.1.54.4.4.
Initial hold (min) 10.10.3.3.3.
Final hold (min)  80.   
I 1208.1183.1215.1198.1210.
ReferenceUmano, Hagi, et al., 1992Wu and Liou, 1992Krammer, Winterhalter, et al., 1991Suárez, Duque, et al., 1991Suárez, Duque, et al., 1991
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase Supelcowax-10Supelcowax-10Supelcowax-10Supelcowax-10Carbowax 20M
Column length (m) 60.60.60.60.50.
Carrier gas     He
Substrate      
Column diameter (mm) 0.250.250.250.250.32
Phase thickness (μm) 0.250.250.250.25 
Tstart (C) 40.40.40.40.50.
Tend (C) 175.175.175.175.200.
Heat rate (K/min) 2.2.2.2.2.
Initial hold (min) 5.5.5.5.5.
Final hold (min) 20.20.20.20.40.
I 1212.1222.1212.1218.1196.
ReferenceTanchotikul and Hsieh, 1989Tanchotikul and Hsieh, 1989Vejaphan, Hsieh, et al., 1988Vejaphan, Hsieh, et al., 1988Chen, Kuo, et al., 1986
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryPacked
Active phase OV-351Carbowax 20M
Column length (m) 25. 
Carrier gas   
Substrate  Celite 545
Column diameter (mm) 0.32 
Phase thickness (μm)   
Tstart (C) 50.75.
Tend (C)  228.
Heat rate (K/min) 6.4.6
Initial hold (min)   
Final hold (min)   
I 1194.1184.
ReferenceKorhonen, 1984van den Dool and Kratz, 1963
Comment MSDC-RI MSDC-RI

References

Go To: Top, Van Den Dool and Kratz RI, polar column, temperature ramp, Notes

Data compilation copyright by the U.S. Secretary of Commerce on behalf of the U.S.A. All rights reserved.

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Notes

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