Phenylethyl Alcohol

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Van Den Dool and Kratz RI, polar column, temperature ramp

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Data compilation copyright by the U.S. Secretary of Commerce on behalf of the U.S.A. All rights reserved.

Data compiled by: NIST Mass Spectrometry Data Center, William E. Wallace, director

Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase DB-WaxInnowaxDB-FFAPDB-FFAPDB-Wax
Column length (m) 30.30.30.30.30.
Carrier gas HeH2HeHeHe
Substrate      
Column diameter (mm) 0.250.250.250.250.32
Phase thickness (μm) 0.250.250.50.50.5
Tstart (C) 50.45.35.35.40.
Tend (C) 180.210.225.225.240.
Heat rate (K/min) 3.53.54.4.7.
Initial hold (min) 2.5.5.5. 
Final hold (min) 25.20.30.30.5.
I 1915.1931.1920.1925.1924.
ReferenceBotelho, Caldeira, et al., 2007Botelho, Caldeira, et al., 2007Jarunrattanasri, Theerakulkait, et al., 2007Jarunrattanasri, Theerakulkait, et al., 2007Mahattanatawee K., Perez-Cacho P.R., et al., 2007
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase HP-20MDB-WaxHP-InnowaxDB-FFAPFFAP
Column length (m) 50.30.60.30.30.
Carrier gas HeliumHeHeHeHe
Substrate      
Column diameter (mm) 0.200.250.250.320.32
Phase thickness (μm) 0.200.50.250.24 
Tstart (C) 70.40.50.40.40.
Tend (C) 180.250.220.240.240.
Heat rate (K/min) 4.4.4.6.8.
Initial hold (min) 4.5.4.2.2.
Final hold (min) 15.15.10.10.5.
I 1858.1914.1872.1900.1935.
ReferencePoliteo, Jukic, et al., 2007Pozo-Bayon M.A., Ruiz-Rodriguez A., et al., 2007Quijano, Linares, et al., 2007Scheidig, Czerny, et al., 2007Schlutt B., Moran N., et al., 2007
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase FFAPDB-Wax EtrDB-WaxDB-WaxDB-Wax
Column length (m) 30.30.60.60.60.
Carrier gas  HeHeHeHe
Substrate      
Column diameter (mm) 0.320.250.250.250.25
Phase thickness (μm) 0.250.250.250.250.25
Tstart (C) 40.40.40.40.40.
Tend (C) 240.250.200.265.265.
Heat rate (K/min) 6.5.4.7.7.
Initial hold (min) 2.3.1.  
Final hold (min) 10.15.10.5.5.
I 1900.1915.1920.1920.1946.
ReferenceSteinhaus and Schieberle, 2007Aubert C. and Pitrat M., 2006Cho, Choi, et al., 2006Gurbuz O., Rouseff J.M., et al., 2006Gurbuz O., Rouseff J.M., et al., 2006
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase DB-WaxInnowaxCP-Wax 52CBDB-WaxDB-Wax
Column length (m) 30.60.50.30.30.
Carrier gas HeHe He 
Substrate      
Column diameter (mm) 0.320.250.320.250.32
Phase thickness (μm) 0.50.25 0.250.5
Tstart (C) 40.40.60.50.40.
Tend (C) 265.230.220.220.200.
Heat rate (K/min) 7.4.4.4.5.
Initial hold (min)  4.5.4.3.
Final hold (min) 5.20.30.20.8.
I 1921.1905.1895.1875.1944.
ReferenceGurbuz O., Rouseff J.M., et al., 2006Lee, Lee, et al., 2006Mahadevan and Farmer, 2006Osorio, Alarcon, et al., 2006Petka, Ferreira, et al., 2006
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase ZB-WaxOV-351DB-WaxSupelcowax-10Stabilwax
Column length (m) 30.50.30.60.30.
Carrier gas HeHe  N2
Substrate      
Column diameter (mm) 0.250.320.250.250.32
Phase thickness (μm) 0.250.20.250.251.
Tstart (C) 50.60.40.35.40.
Tend (C) 220.220.200.195.230.
Heat rate (K/min) 4.5.10.6.4.
Initial hold (min) 1. 3.5.2.
Final hold (min) 10. 20.60.10.
I 1896.1862.1873.1872.1946.
ReferenceUgliano, Bartowsky, et al., 2006Bonvehí, 2005Carunchia Whetstine, Croissant, et al., 2005Chung, Fung, et al., 2005Fang and Qian, 2005
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase DB-WaxSupelcowax-10Carbowax 20MDB-WaxZB-Wax
Column length (m) 60.30.60.30.30.
Carrier gas HeHeHeH2He
Substrate      
Column diameter (mm) 0.320.250.250.320.32
Phase thickness (μm) 1.0.250.250.250.25
Tstart (C) 45.60.45.40.40.
Tend (C) 250.240.250.250.250.
Heat rate (K/min) 5.3.2.5.5.
Initial hold (min) 1.5.0.172.2.
Final hold (min) 12.10. 5.5.
I 1952.1902.1878.1883.1892.
ReferenceMalliaa, Fernandez-Garcia, et al., 2005Riu-Aumatell, Lopez-Tamames, et al., 2005Verzera, Campisi, et al., 2005Wu, Zorn, et al., 2005Wu, Zorn, et al., 2005
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase DB-WaxDB-FFAPDB-WaxZB-WaxDB-Wax
Column length (m) 30.15.0.30.30.
Carrier gas H2He HeHe
Substrate      
Column diameter (mm) 0.250.320.320.250.25
Phase thickness (μm) 0.250.250.50.150.25
Tstart (C) 40.35.40.35.40.
Tend (C) 250.225.240.220.240.
Heat rate (K/min) 3.10.7.1.86.
Initial hold (min) 3.5. 10.10.
Final hold (min) 20.15.5.10.25.
I 1890.1901.1911.1914.1902.
ReferenceAubert and Bourger, 2004Avsar, Karagul-Yuceer, et al., 2004Gocmen, Gurbuz, et al., 2004Ledauphin, Saint-Clair, et al., 2004Varming, Petersen, et al., 2004
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase DB-WaxOV-351DB-WaxDB-WaxAT-Wax
Column length (m) 30.50.60.60.60.
Carrier gas  HeHeHeHe
Substrate      
Column diameter (mm) 0.320.320.250.250.32
Phase thickness (μm) 0.50.20.25 0.25
Tstart (C) 40.60.40.40.65.
Tend (C) 245.220.210.220.250.
Heat rate (K/min) 3.5.2.3.2.
Initial hold (min) 3.  10.10.
Final hold (min) 20. 40.30.60.
I 1906.1862.1901.1915.1885.
ReferenceAubert, Ambid, et al., 2003Bonvehi and Coll, 2003Chyau, Ko, et al., 2003Hayata, Sakamoto, et al., 2003Pino, Almora, et al., 2003
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase DB-WaxDB-WaxSupelcowax-10AT-WaxDB-Wax
Column length (m) 60.30.30.60.30.
Carrier gas He HeHeHe
Substrate      
Column diameter (mm) 0.320.250.250.320.32
Phase thickness (μm) 0.50.250.250.251.
Tstart (C) 67.35.50.65.40.
Tend (C) 235.200.230.250.200.
Heat rate (K/min) 2.710.3.2.10.
Initial hold (min)  5. 10.5.
Final hold (min) 30.30.30.60.30.
I 1939.1905.1929.1888.1919.
ReferenceClaudela, Dirningera, et al., 2002Karagül-Yüceer, Cadwallader, et al., 2002Moreira, Trugo, et al., 2002Pino, Marbot, et al., 2002Wu and Cadwallader, 2002
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase DB-FFAPDB-WaxDB-WaxCP-Wax 52CBDB-Wax
Column length (m) 15.30.30.50.30.
Carrier gas  HeHeH2H2
Substrate      
Column diameter (mm) 0.320.250.250.320.32
Phase thickness (μm) 0.250.250.25 0.25
Tstart (C) 30.40.40.50.35.
Tend (C) 225.200.200.200.220.
Heat rate (K/min) 10.2.2.2.4.
Initial hold (min) 2.5.5. 0.5
Final hold (min) 20.20.20.  
I 1893.1897.1894.1879.1873.3
ReferenceZhou, Wintersteen, et al., 2002Kim, Shin, et al., 2001Kim, Shin, et al., 2001Liu, Yang, et al., 2001Pet'ka, Mocák, et al., 2001
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase AT-WaxAT-WaxCP-Wax 52CBDB-WaxDB-Wax
Column length (m) 60.60.60.30.30.
Carrier gas HeHeHeHeHe
Substrate      
Column diameter (mm) 0.320.320.250.320.32
Phase thickness (μm) 0.250.250.250.50.5
Tstart (C) 65.65.45.60.60.
Tend (C) 250.250.250.245.245.
Heat rate (K/min) 2.2.2.3.3.
Initial hold (min) 10.10.0.173.3.
Final hold (min) 60.60. 20.20.
I 1888.1888.1878.1902.1905.
ReferencePino and Marbot, 2001Pino, Marbot, et al., 2001Verzera, Campisi, et al., 2001Wirth, Guo, et al., 2001Bureau, Baumes, et al., 2000
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase DB-WaxDB-FFAPSupelcowax-10DB-WaxDB-Wax
Column length (m) 30.30.60.60.30.
Carrier gas  H2HeHeH2
Substrate      
Column diameter (mm) 0.320.320.250.320.25
Phase thickness (μm) 0.50.250.250.50.25
Tstart (C) 60.40.35.40.60.
Tend (C) 245.240.195.250.220.
Heat rate (K/min) 3.5.2.4.2.
Initial hold (min) 3.2. 2.3.
Final hold (min) 20. 90.10. 
I 1905.1925.1917.1933.1893.
ReferenceBureau, Razungles, et al., 2000Charles, Martin, et al., 2000Chung, 2000Le Guen, Prost, et al., 2000Chassagne, Boulanger, et al., 1999
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase HP-InnowaxSupelcowax-10DB-WaxDB-WaxDB-Wax
Column length (m) 60.60.60.30.30.
Carrier gas HeHe He 
Substrate      
Column diameter (mm) 0.250.250.250.320.32
Phase thickness (μm)  0.250.250.250.5
Tstart (C) 32.35.40.40.40.
Tend (C) 220.195.200.200.245.
Heat rate (K/min) 2.2.3.6.3.
Initial hold (min) 1.5.5.5.3.
Final hold (min) 40.90.60.30.20.
I 1924.1917.1912.1908.1866.
ReferenceChristensen, Jakobsen, et al., 1999Chung, 1999Cha, Kim, et al., 1998Cha, Kim, et al., 1998Ollé, Baumes, et al., 1998
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase DB-WaxHP-WaxDB-WaxPEG-20MDB-Wax
Column length (m) 30.50.60.60.60.
Carrier gas  HeHeHeHe
Substrate      
Column diameter (mm) 0.320.20.320.250.25
Phase thickness (μm) 0.50.40.50.250.25
Tstart (C) 40.30.50.50.50.
Tend (C) 245.220.225.230.230.
Heat rate (K/min) 3.5.2.2.2.
Initial hold (min) 3.1.   
Final hold (min) 20.30.20.60.60.
I 1866.1946.1856.1893.1893.
ReferenceOllé, Baumes, et al., 1998Christensen, Jakobsen, et al., 1997Sagrero-Nieves, Bartley, et al., 1997Shimoda, Nakada, et al., 1997Shimoda, Shiratsuchi, et al., 1996
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase DB-WaxDB-WaxDB-WaxCarbowax 20MDB-Wax
Column length (m) 60.30.30.60.60.
Carrier gas HeHeHeHe 
Substrate      
Column diameter (mm) 0.250.320.320.320.25
Phase thickness (μm) 0.250.50.50.4250.25
Tstart (C) 50.50.50.45.50.
Tend (C) 230.230.230.300.230.
Heat rate (K/min) 3.2.2.3.2.
Initial hold (min)    3. 
Final hold (min)    20. 
I 1923.1924.1923.1886.1903.
ReferenceShimoda, Wu, et al., 1996Coen, Engel, et al., 1995Coen, Engel, et al., 1995Mondello, Dugo, et al., 1995Shimoda, Shigematsu, et al., 1995
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase DB-WaxHP-20MDB-WaxDB-WaxDB-Wax
Column length (m) 60.50.30.30.30.
Carrier gas HeHeHeHeHe
Substrate      
Column diameter (mm) 0.250.250.250.250.25
Phase thickness (μm)    0.250.25
Tstart (C) 40.60.40.50.50.
Tend (C) 200.190.200.220.240.
Heat rate (K/min) 3.3.2.4.4.
Initial hold (min) 5. 10.3.3.
Final hold (min)    20. 
I 1932.1873.1903.1890.1899.
ReferenceSumitani, Suekane, et al., 1994Chung, Eiserich, et al., 1993Umano, Hagi, et al., 1992Humpf and Schreier, 1991Krammer, Winterhalter, et al., 1991
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase CP-Wax 58CBDB-WaxDB-WaxDB-WaxDB-Wax
Column length (m) 30.30.30.30.30.
Carrier gas HeHeHeHe 
Substrate      
Column diameter (mm) 0.250.2590.2590.320.25
Phase thickness (μm) 0.220.250.250.25 
Tstart (C) 40.50.50.40.50.
Tend (C) 220.240.240.220.240.
Heat rate (K/min) 3.4.4.5.2.
Initial hold (min)  3.3.3. 
Final hold (min)      
I 1873.1888.1899.1899.1907.8
ReferencePabst, Barron, et al., 1991Suárez, Duque, et al., 1991Suárez, Duque, et al., 1991Frohlich and Schreier, 1990Chang, Sheng, et al., 1989
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase DB-WaxDB-WaxDB-WaxCarbowax 20MSupelcowax-10
Column length (m) 30.30.30.30.60.
Carrier gas  HeHeHe 
Substrate      
Column diameter (mm) 0.250.250.250.250.25
Phase thickness (μm)  0.250.250.250.25
Tstart (C) 50.50.50.40.40.
Tend (C) 240.250.250.240.175.
Heat rate (K/min) 2.4.4.4.2.
Initial hold (min)  3.3.3.5.
Final hold (min)     20.
I 1910.51899.1902.1871.1923.
ReferenceChang, Sheng, et al., 1989Fröhlich, Duque, et al., 1989Fröhlich, Duque, et al., 1989Schwab, Mahr, et al., 1989Tanchotikul and Hsieh, 1989
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase Supelcowax-10CP-WAX 57CBCarbowax 20MCarbowax 20MCarbowax 20M
Column length (m) 60.50.60.60.60.
Carrier gas  He   
Substrate      
Column diameter (mm) 0.250.240.320.320.32
Phase thickness (μm) 0.25 0.250.250.25
Tstart (C) 40.50.40.40.40.
Tend (C) 175.210.230.230.230.
Heat rate (K/min) 2.2.   
Initial hold (min) 5.5.   
Final hold (min) 20.    
I 1925.1901.1902.1906.1907.
ReferenceTanchotikul and Hsieh, 1989Baltes and Mevissen, 1988Peppard and Ramus, 1988Peppard and Ramus, 1988Peppard and Ramus, 1988
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase Carbowax 20MCarbowax 20MCarbowax 20MOV-351OV-351
Column length (m) 60.60.50.25.25.
Carrier gas   HeN2N2
Substrate      
Column diameter (mm) 0.320.320.320.330.33
Phase thickness (μm) 0.250.25   
Tstart (C) 40.40.50.100.50.
Tend (C) 230.230.200.220.220.
Heat rate (K/min)   2.6.10.
Initial hold (min)   5.  
Final hold (min)   40.  
I 1909.1919.1896.1873.1875.
ReferencePeppard and Ramus, 1988Peppard and Ramus, 1988Chen, Kuo, et al., 1986Korhonen, 1986Korhonen, 1986
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type Packed
Active phase Carbowax 20M
Column length (m)  
Carrier gas  
Substrate Celite 545
Column diameter (mm)  
Phase thickness (μm)  
Tstart (C) 75.
Tend (C) 228.
Heat rate (K/min) 4.6
Initial hold (min)  
Final hold (min)  
I 1894.
Referencevan den Dool and Kratz, 1963
Comment MSDC-RI

References

Go To: Top, Van Den Dool and Kratz RI, polar column, temperature ramp, Notes

Data compilation copyright by the U.S. Secretary of Commerce on behalf of the U.S.A. All rights reserved.

Botelho, Caldeira, et al., 2007
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Steinhaus, P.; Schieberle, P., Characterization of the key aroma compounds in soy sauce using approaches of molecular sensory science, J. Agric. Food Chem., 2007, 55, 15, 6262-6269, https://doi.org/10.1021/jf0709092 . [all data]

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Gurbuz O.; Rouseff J.M.; Rouseff R.L., Comparison of aroma volatiles in commercial Merlot and Cabernet Sauvignon wines using gas chromatography - Olfactometry and gas chromatography - Mass spectrometry, J. Agric. Food Chem., 2006, 54, 11, 3990-3996, https://doi.org/10.1021/jf053278p . [all data]

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Petka, Ferreira, et al., 2006
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Notes

Go To: Top, Van Den Dool and Kratz RI, polar column, temperature ramp, References