2-Hexenal, (E)-


Van Den Dool and Kratz RI, polar column, temperature ramp

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Data compilation copyright by the U.S. Secretary of Commerce on behalf of the U.S.A. All rights reserved.

Data compiled by: NIST Mass Spectrometry Data Center, William E. Wallace, director

Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase DB-Wax EtrHP-InnowaxDB-Wax EtrDB-WaxHP-Wax
Column length (m) 30.60.30.30.30.
Carrier gas  HeHeHeN2
Substrate      
Column diameter (mm) 0.250.250.250.250.25
Phase thickness (μm) 0.250.250.250.250.25
Tstart (C) 40.50.40.50.60.
Tend (C) 250.220.250.230.220.
Heat rate (K/min) 5.4.5.10.5.
Initial hold (min) 3.4.3.5.10.
Final hold (min) 15.10.15.25. 
I 1220.1220.1220.1215.1222.
ReferenceAubert and Chanforan, 2007Quijano, Linares, et al., 2007Aubert C. and Pitrat M., 2006Fernandez-Segovia, Escriche, et al., 2006Flamini, Tebano, et al., 2006
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase DB-WaxStabilwaxSupelcowax-10DB-WaxSupelcowax-10
Column length (m) 30.60.60.30.30.
Carrier gas HeHeHeHeHe
Substrate      
Column diameter (mm) 0.250.250.250.250.25
Phase thickness (μm) 0.250.250.250.250.25
Tstart (C) 50.40.40.40.60.
Tend (C) 220.240.280.250.240.
Heat rate (K/min) 4.3.4.3.3.
Initial hold (min) 4.5.2. 5.
Final hold (min) 20.10. 20.10.
I 1205.1212.1231.1200.1234.
ReferenceOsorio, Alarcon, et al., 2006Cros, Lignot, et al., 2005Elmore, Nisyrios, et al., 2005Gancel, Ollitrault, et al., 2005Riu-Aumatell, Lopez-Tamames, et al., 2005
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase HP-WaxHP-WaxDB-Wax EtrDB-WaxDB-Wax
Column length (m) 30.30.30.30.30.
Carrier gas N2N2HeHeHe
Substrate      
Column diameter (mm) 0.250.250.250.250.25
Phase thickness (μm) 0.250.250.250.250.25
Tstart (C) 60.60.40.45.45.
Tend (C) 240.220.245.240.240.
Heat rate (K/min) 3.5.3.6.6.
Initial hold (min)  10.3.10.10.
Final hold (min)   20.30.30.
I 1220.1220.1218.1230.1230.
ReferenceFlamini, Cioni, et al., 2004Flamini, Luigi Cioni, et al., 2004Ménager, Jost, et al., 2004Nielsen, Larsen, et al., 2004Nielsen, Larsen, et al., 2004, 2
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase DB-WaxDB-WaxDB-WaxDB-WaxDB-Wax
Column length (m) 30.30.30.30.30.
Carrier gas HeHeHeHeHe
Substrate      
Column diameter (mm) 0.250.250.250.250.25
Phase thickness (μm) 0.250.250.250.250.25
Tstart (C) 45.45.40.40.40.
Tend (C) 240.240.200.200.200.
Heat rate (K/min) 6.3.4.4.4.
Initial hold (min) 10.10.5.5.5.
Final hold (min) 30.30.20.20.20.
I 1230.1201.1200.1204.1206.
ReferenceNielsen, Larsen, et al., 2004, 3Nielsen and Poll, 2004Yu, Kim, et al., 2004Yu, Kim, et al., 2004Yu, Kim, et al., 2004, 2
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase DB-WaxDB-WaxDB-WaxDB-WaxDB-Wax
Column length (m) 30.30.30.30.30.
Carrier gas HeHeHe  
Substrate      
Column diameter (mm) 0.250.250.250.320.32
Phase thickness (μm) 0.250.250.250.50.5
Tstart (C) 40.40.40.40.40.
Tend (C) 200.200.200.245.245.
Heat rate (K/min) 4.4.4.2.2.
Initial hold (min) 5.5.5.3.3.
Final hold (min) 20.20.20.20.20.
I 1202.1204.1207.1220.1220.
ReferenceYu, Kim, et al., 2004, 2Zheng, Kim, et al., 2004Zheng, Kim, et al., 2004Aubert, Günata, et al., 2003Aubert, Günata, et al., 2003
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase HP-WaxHP-WaxStabilwaxHP-WaxDB-Wax
Column length (m) 30.30.60.30.60.
Carrier gas N2N2HeN2H2
Substrate      
Column diameter (mm) 0.250.250.250.250.32
Phase thickness (μm) 0.250.250.250.250.25
Tstart (C) 60.60.40.60.40.
Tend (C) 220.220.240.220.245.
Heat rate (K/min) 5.5.3.5.1.5
Initial hold (min) 10.10.5.10. 
Final hold (min)   10. 20.
I 1220.1220.1212.1220.1200.
ReferenceCampeol, Flamini, et al., 2003Campeol, Flamini, et al., 2003Cros, Vandanjon, et al., 2003Emilio Tomei, Manganelli, et al., 2003Gancel, Ollitrault, et al., 2003
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase DB-WaxAT-WaxZB-WaxSupelcowax-10AT-Wax
Column length (m) 30.60.60.60.60.
Carrier gas HeHeHeHeHe
Substrate      
Column diameter (mm) 0.250.320.320.250.32
Phase thickness (μm) 0.250.250.250.250.25
Tstart (C) 40.65.40.35.65.
Tend (C) 240.250.220.195.250.
Heat rate (K/min) 6.2.3.2.2.
Initial hold (min) 10.10. 5.10.
Final hold (min) 30.60. 90.60.
I 1230.1205.1222.1221.1206.
ReferenceNielsen, Larsen, et al., 2003Pino, Almora, et al., 2003Brunton, Cronin, et al., 2002Chung, Yung, et al., 2002Pino, Marbot, et al., 2002
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase Supelcowax-10AT-WaxAT-WaxCP-Wax 52CBDB-Wax
Column length (m) 60.60.60.50.30.
Carrier gas HeHeHeHeHe
Substrate      
Column diameter (mm) 0.250.320.320.250.25
Phase thickness (μm) 0.250.250.250.20.25
Tstart (C) 35.65.65.30.40.
Tend (C) 195.250.250.220.200.
Heat rate (K/min) 2.2.2.2.2.
Initial hold (min) 5.10.10.1.35.
Final hold (min) 90.60.60. 20.
I 1221.1206.1206.1201.1209.
ReferenceChung, Yung, et al., 2001Pino and Marbot, 2001Pino, Marbot, et al., 2001Jensen, Christensen, et al., 2000Kim, Thuy, et al., 2000
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase DB-WaxSupelcowax-10DB-WaxDB-WaxHP-Wax
Column length (m) 30.60.60.30.50.
Carrier gas  He  He
Substrate      
Column diameter (mm) 0.320.250.250.320.2
Phase thickness (μm) 0.250.250.250.50.4
Tstart (C) 40.35.40.40.30.
Tend (C) 230.195.200.245.220.
Heat rate (K/min) 3.2.3.3.5.
Initial hold (min) 4.5.5.3.1.
Final hold (min)  90.60.20.30.
I 1201.1223.1214.1209.1231.
ReferenceRuther, 2000Chung, 1999Cha, Kim, et al., 1998Ollé, Baumes, et al., 1998Christensen, Jakobsen, et al., 1997
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase DB-WaxDB-WaxDB-WaxDB-WaxSupelcowax-10
Column length (m) 60.60.30.60.60.
Carrier gas He HeHeHe
Substrate      
Column diameter (mm) 0.250.250.250.250.25
Phase thickness (μm) 0.250.25  0.25
Tstart (C) 50.50.40.40.40.
Tend (C) 230.230.200.200.195.
Heat rate (K/min) 2.2.2.3.2.
Initial hold (min)   5.5.5.
Final hold (min) 60.   40.
I 1209.1196.1207.1219.1216.
ReferenceShimoda, Shiratsuchi, et al., 1996Shimoda, Shigematsu, et al., 1995Iwaoka, Hagi, et al., 1994Sumitani, Suekane, et al., 1994Chung and Cadwallader, 1993
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase HP-20MHP-FFAPCarbowax 20MCarbowax 20MCarbowax 20M
Column length (m) 50.50.25.25.25.
Carrier gas HeHe   
Substrate      
Column diameter (mm) 0.250.250.310.310.31
Phase thickness (μm)   0.3  
Tstart (C) 60.60.50.50.50.
Tend (C) 190.210.200.200.200.
Heat rate (K/min) 3.3.2.2.2.
Initial hold (min)      
Final hold (min)      
I 1209.1250.1210.1207.1210.
ReferenceChung, Eiserich, et al., 1993Chung, Eiserich, et al., 1993Suárez and Duque, 1992Suárez and Duque, 1991Suárez and Duque, 1991
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillary
Active phase DB-WaxDB-WaxDB-WaxCarbowax 20M
Column length (m) 30.30.30.50.
Carrier gas HeHeHeH2
Substrate     
Column diameter (mm) 0.320.250.250.2
Phase thickness (μm) 0.250.250.25 
Tstart (C) 40.50.50.50.
Tend (C) 220.250.250.200.
Heat rate (K/min) 5.4.4.2.
Initial hold (min) 3.3.3. 
Final hold (min)    55.
I 1212.1212.1217.1196.
ReferenceFrohlich and Schreier, 1990Fröhlich, Duque, et al., 1989Fröhlich, Duque, et al., 1989Wu and Liou, 1986
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI

References

Go To: Top, Van Den Dool and Kratz RI, polar column, temperature ramp, Notes

Data compilation copyright by the U.S. Secretary of Commerce on behalf of the U.S.A. All rights reserved.

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Pino, Marbot, et al., 2001
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Chung, 1999
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Cha, Kim, et al., 1998
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Christensen, Jakobsen, et al., 1997
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Shimoda, Shiratsuchi, et al., 1996
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Shimoda, Shigematsu, et al., 1995
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Iwaoka, Hagi, et al., 1994
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Sumitani, Suekane, et al., 1994
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Chung and Cadwallader, 1993
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Chung, Eiserich, et al., 1993
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Wu and Liou, 1986
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Notes

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