2-Hexenal, (E)-


Normal alkane RI, polar column, temperature ramp

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Data compilation copyright by the U.S. Secretary of Commerce on behalf of the U.S.A. All rights reserved.

Data compiled by: NIST Mass Spectrometry Data Center, William E. Wallace, director

Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase CP Wax 52 CBDB-WaxDB-WaxHP-InnowaxHP-20M
Column length (m) 30.30.30.30.50.
Carrier gas HeliumHeliumHydrogenNitrogenHelium
Substrate      
Column diameter (mm) 0.320.320.250.250.25
Phase thickness (μm) 0.500.250.250.520.25
Tstart (C) 40.40.30.35.70.
Tend (C) 230.230.230.205.180.
Heat rate (K/min) 4.6.8.3.4.
Initial hold (min) 2.2.5.10.4.
Final hold (min) 15.20.10.10. 
I 1225.1205.1209.1219.1180.
ReferenceBirtic, Ginies, et al., 2009Chen, Song, et al., 2009Karlsson, Birgersson, et al., 2009Wannes, Mhamdi, et al., 2009Blazevic and Mastelic, 2008
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase HP-20MDB-WaxHP-FFAPDB-WaxStabilwax
Column length (m) 50.60.30.30.60.
Carrier gas Helium HeliumHeHelium
Substrate      
Column diameter (mm) 0.250.350.250.250.25
Phase thickness (μm) 0.25 0.250.250.25
Tstart (C) 70.40.40.30.40.
Tend (C) 180.200.120.210.240.
Heat rate (K/min) 4.4.3.5.3.
Initial hold (min) 4. 3. 5.
Final hold (min)   5. 10.
I 1180.1228.1228.1234.1212.
ReferenceBlazevic and Mastelic, 2008Ganeko, Shoda, et al., 2008Guzman-Geronimo, Lopez, et al., 2008Kumazawa, Itobe, et al., 2008Cros, Vandanjon, et al., 2007
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase CP-Wax 52CBBP-20BP-20Supelcowax-10TR-WAX
Column length (m) 60.30.30.30.60.
Carrier gas HeHeHe H2
Substrate      
Column diameter (mm) 0.320.250.250.250.25
Phase thickness (μm) 0.50.250.250.250.25
Tstart (C) 40.70.70.40.40.
Tend (C) 220.220.220.210.200.
Heat rate (K/min) 4.4.4.2.3.
Initial hold (min) 8.4.4. 10.
Final hold (min) 20.5.5.33.10.
I 1226.1230.1230.1226.1216.
ReferencePovolo, Contarini, et al., 2007Rawat, Gulati, et al., 2007Rawat, Gulati, et al., 2007Sylvestre, Longtin, et al., 2007Tena N., Lazzez A., et al., 2007
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase DB-Wax EtrTR-WAXDB-WaxDB-WaxZB-Wax
Column length (m) 60.60.30.30.60.
Carrier gas HeHe  He
Substrate      
Column diameter (mm) 0.250.250.250.250.32
Phase thickness (μm) 0.250.250.250.250.5
Tstart (C) 40.40.40.40.40.
Tend (C) 230.200.200.200.250.
Heat rate (K/min) 2.3.8.8.3.
Initial hold (min) 5.10.3.3.2.
Final hold (min) 100. 20.20.10.
I 1226.1220.1188.1188.1238.
ReferenceIbarz, Ferreira, et al., 2006Salas J.J., Garcia-Gonzalez D.L., et al., 2006Schirack, Drake, et al., 2006Schirack, Drake, et al., 2006Wierda R.L., Fletcher G., et al., 2006
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase InnowaxInnowaxDB-WaxDB-WaxDB-Wax
Column length (m) 50.60.30.60.60.
Carrier gas HeHeHeNitrogen 
Substrate      
Column diameter (mm) 0.20.250.250.320.53
Phase thickness (μm) 0.50.250.250.501.
Tstart (C) 60.60.50.35.50.
Tend (C) 250.240.180.235.180.
Heat rate (K/min) 2.5.3.2.3.
Initial hold (min)    4.10.
Final hold (min) 60.30.40.30. 
I 1216.1233.1209.1237.1204.
ReferenceBendimerad and Bendiab, 2005Joichi, Yomogida, et al., 2005Lee, Umano, et al., 2005Qian and Wang, 2005Rizzolo, Cambiaghi, et al., 2005
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase Supelcowax-10Supelcowax-10Supelcowax-10TR-WAXPEG-20M
Column length (m) 60.60.60.60.30.
Carrier gas HeHeHeH2 
Substrate      
Column diameter (mm) 0.530.530.530.250.25
Phase thickness (μm) 1.1.1.0.25 
Tstart (C) 40.40.40.40.60.
Tend (C) 240.240.240.200.180.
Heat rate (K/min) 4.4.4.3.3.
Initial hold (min) 2.2.2.10.10.
Final hold (min) 20.20.20. 30.
I 1259.1263.1264.1220.1228.
ReferenceRochat and Chaintreau, 2005Rochat and Chaintreau, 2005Rochat and Chaintreau, 2005Salas, Sánchez, et al., 2005Yao, Guo, et al., 2005
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase DB-WaxHP-FFAPStabilwaxDB-WaxDB-Wax
Column length (m) 60.30.60.60.60.
Carrier gas HeHeHeliumH2Helium
Substrate      
Column diameter (mm) 0.250.250.250.320.25
Phase thickness (μm) 0.250.250.250.25 
Tstart (C) 40.40.40.40.70.
Tend (C) 220.120.240.230.210.
Heat rate (K/min) 3.5.3.4.2.
Initial hold (min) 5.5.5.5. 
Final hold (min)  3.10.25.60.
I 1221.1228.1212.1216.1220.
ReferenceLópez, Ezpeleta, et al., 2004López, Guzmán, et al., 2004Cros, Vandanjon, et al., 2003Dregus and Engel, 2003Mookdasanit, Tamura, et al., 2003
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase Carbowax 20MSupelcowax-10Supelcowax-10Supelcowax-10BP-20
Column length (m) 50.30.30.30.50.
Carrier gas HeliumHeHeHeH2
Substrate      
Column diameter (mm) 0.700.250.250.250.25
Phase thickness (μm)  0.250.250.250.25
Tstart (C) 50.40.40.40.45.
Tend (C) 280.200.200.200.230.
Heat rate (K/min) 4.3.3.3.3.
Initial hold (min) 2.10.10.10.1.
Final hold (min)     10.
I 1211.1216.1218.1211.1207.
ReferenceSaura, LAencina, et al., 2003Vichi, Castellote, et al., 2003Vichi, Pizzale, et al., 2003Vichi, Pizzale, et al., 2003, 2Darriet, Pons, et al., 2002
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase DB-WaxDB-WaxHP-FFAPEC-1000DB-Wax
Column length (m) 60.30.25.30.60.
Carrier gas H2He He 
Substrate      
Column diameter (mm) 0.320.320.320.250.32
Phase thickness (μm) 0.250.50.520.250.25
Tstart (C) 40.40.60.35.50.
Tend (C) 245.240.240.230.210.
Heat rate (K/min) 1.57.5.5.1.5
Initial hold (min)   1.5.5.
Final hold (min) 20.5.5.15.10.
I 1206.1232.1202.1240.1236.
ReferenceGancel, Ollé, et al., 2002Lin, Rouseff, et al., 2002Qian and Reineccius, 2002Bendall, 2001Chyau and Mau, 2001
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase DB-WaxDB-WaxDB-WaxSupelcowax-10DB-Wax
Column length (m) 60.30.60.60.30.
Carrier gas HeHe HeH2
Substrate      
Column diameter (mm) 0.250.250.250.250.32
Phase thickness (μm)  0.250.250.250.5
Tstart (C) 40.50.30.35.60.
Tend (C) 220.220.170.200.245.
Heat rate (K/min) 2.4.2.4.3.
Initial hold (min)  3.4.10.3.
Final hold (min)   30. 20.
I 1247.1214.1214.1242.1220.
ReferenceJiang and Kubota, 2001Weckerle, Bastl-Borrmann, et al., 2001Buttery, Light, et al., 2000Girard and Durance, 2000Kotseridis and Baumes, 2000
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase DB-WaxDB-WaxDB-WaxDB-WaxDB-Wax
Column length (m) 25.25.60.30.30.
Carrier gas HeHeHeliumHeHe
Substrate      
Column diameter (mm) 0.250.250.320.250.25
Phase thickness (μm) 0.250.250.250.250.25
Tstart (C) 50.50.50.50.50.
Tend (C) 200.200.230.240.240.
Heat rate (K/min) 4.4.5.4.4.
Initial hold (min) 4.4.2.3.3.
Final hold (min) 10.10. 10.10.
I 1207.1211.1219.1202.1213.
ReferenceMorales, Duque, et al., 2000Morales, Duque, et al., 2000Paniandy, Chane-Ming, et al., 2000Parada, Duque, et al., 2000Parada, Duque, et al., 2000
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase DB-WaxInnowaxCarbowaxDB-WaxDB-Wax
Column length (m) 60.60.50.60.60.
Carrier gas HeHeN2He 
Substrate      
Column diameter (mm) 0.250.250.20.250.25
Phase thickness (μm) 0.250.25 0.25 
Tstart (C) 40.60.80.40.30.
Tend (C) 200.220.200.200.170.
Heat rate (K/min) 2. 1.2.2.
Initial hold (min) 2.10. 2.4.
Final hold (min)   20. 30.
I 1215.1232.1200.1215.1214.
ReferenceUmano, Hagi, et al., 2000Kaya, Baser, et al., 1999Menon, Chacko, et al., 1999Umano, Nakahara, et al., 1999Buttery and Ling, 1998
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase DB-WaxSupelcowax-10HP-InnowaxCBP-20DB-Wax
Column length (m) 60.30.25.25.60.
Carrier gas HeHe   
Substrate      
Column diameter (mm) 0.250.250.320.250.25
Phase thickness (μm) 1.   0.25
Tstart (C) 50.60.35.35.50.
Tend (C) 200.240.250.200.230.
Heat rate (K/min) 3.4.4.5.2.
Initial hold (min)    5. 
Final hold (min) 40.    
I 1209.1228.1207.1214.1195.
ReferenceHoriuchi, Umano, et al., 1998Lamarque, Maestri, et al., 1998Ong and Acree, 1998Quiroz A. and Niemeyer H.M., 1998Ravichandran and Parthiban, 1998
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase DB-WaxDB-WaxDB-WaxDB-WaxPEG-20M
Column length (m) 60.30.30.30.50.
Carrier gas H2HeHeHeHe
Substrate      
Column diameter (mm) 0.320.320.250.250.25
Phase thickness (μm) 0.250.250.250.25 
Tstart (C) 60.50.20.50.70.
Tend (C) 220.240.200.200.250.
Heat rate (K/min) 3.6.4.4.2.
Initial hold (min)  3.4.4. 
Final hold (min)   10.10. 
I 1215.1200.1205.1207.1220.
ReferenceWerkhoff, Güntert, et al., 1998Hashizume and Samuta, 1997Morales, Albarracín, et al., 1996Morales, Albarracín, et al., 1996Orav, Kailas, et al., 1996
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase TC-WaxSupelcowax-10Carbowax 20MDB-WaxDB-Wax
Column length (m) 60.60.60.60.60.
Carrier gas  He HeHe
Substrate      
Column diameter (mm) 0.250.250.250.250.25
Phase thickness (μm)  0.25   
Tstart (C) 80.40.60.60.60.
Tend (C) 240.200.180.180.180.
Heat rate (K/min) 3.3.2.2.2.
Initial hold (min) 5.3.4.4.4.
Final hold (min)  30.   
I 1220.1235.1192.1206.1209.
ReferenceShuichi, Masazumi, et al., 1996Wong and Lai, 1996Kawakami, Ganguly, et al., 1995Kobayashi, Tsuda, et al., 1995Kobayashi, Tsuda, et al., 1995
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase PEG-20MPEG-20MDB-WaxCarbowax 20MCarbowax 20M
Column length (m) 50.50.60.80.50.
Carrier gas HeHe  He
Substrate      
Column diameter (mm) 0.250.250.250.20.25
Phase thickness (μm) 0.150.15   
Tstart (C) 60.60.60.70.60.
Tend (C) 180.180.220.170.180.
Heat rate (K/min) 2.2.3.2.2.
Initial hold (min) 4.4.4. 4.
Final hold (min)      
I 1192.1195.1210.1207.1192.
ReferenceTogari, Kobayashi, et al., 1995Togari, Kobayashi, et al., 1995Chung, Eiserich, et al., 1993Egolf and Jurs, 1993Kawakami, Kobayashi, et al., 1993
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase CP-Wax 52CBCarbowax 20MDB-WaxDB-WaxDB-Wax
Column length (m) 50.50.60.60.60.
Carrier gas H2He   
Substrate      
Column diameter (mm) 0.320.250.320.320.32
Phase thickness (μm) 0.22    
Tstart (C) 50.60.50.50.50.
Tend (C) 200.180.230.230.230.
Heat rate (K/min) 2.2.4.4.4.
Initial hold (min) 5.4.   
Final hold (min)   10.10.10.
I 1202.11192.1212.1222.1215.
ReferenceChyau, Chen, et al., 1992Kawakami and Kobayashi, 1991Binder, Benson, et al., 1990Binder, Turner, et al., 1990Binder, Turner, et al., 1990, 2
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase DB-WaxDB-WaxSupelcowax-10DB-WaxDB-Wax
Column length (m) 60.60.60.60.60.
Carrier gas   HeHeHe
Substrate      
Column diameter (mm) 0.320.320.250.320.32
Phase thickness (μm)   0.250.250.25
Tstart (C) 50.50.40.30.30.
Tend (C) 230.250.175.180.180.
Heat rate (K/min) 4.4.1.2.2.
Initial hold (min) 0.10.15.4.4.
Final hold (min) 10.5.   
I 1214.1211.1218.1213.1213.
ReferenceBinder, Flath, et al., 1989Binder and Flath, 1989Hsieh, Williams, et al., 1989Takeoka and Butter, 1989Takeoka and Butter, 1989
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase DB-WaxDB-WaxDB-WaxSupelcowax-10Carbowax 20M
Column length (m) 60.60.60.60.50.
Carrier gas HeHeHe N2
Substrate      
Column diameter (mm) 0.320.320.3220.320.22
Phase thickness (μm) 0.250.250.25  
Tstart (C) 30.30.50.60.80.
Tend (C) 180.180.230.220.200.
Heat rate (K/min) 2.2.4.3.3.
Initial hold (min) 4.4. 1. 
Final hold (min)      
I 1215.1215.1215.1241.1211.
ReferenceTakeoka and Butter, 1989Takeoka and Butter, 1989Engel, Flath, et al., 1988Hamilton-Kemp, Andersen, et al., 1988Mihara, Tateba, et al., 1988
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase Carbowax 20MCarbowax 20MCarbowax 20MDB-WaxDB-Wax
Column length (m) 50.50.50.60.60.
Carrier gas N2N2N2H2H2
Substrate      
Column diameter (mm) 0.220.220.220.250.25
Phase thickness (μm)    0.250.25
Tstart (C) 80.80.80.30.30.
Tend (C) 200.200.200.180.180.
Heat rate (K/min) 3.3.3.2.2.
Initial hold (min)    2.2.
Final hold (min)      
I 1216.1211.1216.1209.1209.
ReferenceMihara, Tateba, et al., 1988Mihara, Tateba, et al., 1988Mihara, Tateba, et al., 1988Takeoka, Flath, et al., 1988Takeoka, Flath, et al., 1988
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase Carbowax 20MCarbowax 20MCarbowax 20MCarbowax 20MCarbowax 20M
Column length (m) 150.50.50.50.50.
Carrier gas  N2N2N2N2
Substrate      
Column diameter (mm) 0.660.220.220.220.22
Phase thickness (μm)      
Tstart (C) 60.80.80.80.80.
Tend (C) 170.200.200.200.200.
Heat rate (K/min) 1.3.3.3.3.
Initial hold (min) 40.    
Final hold (min)      
I 1190.1211.1216.1211.1216.
ReferenceButtery, Ling, et al., 1987Mihara, Tateba, et al., 1987Mihara, Tateba, et al., 1987Mihara, Tateba, et al., 1987Mihara, Tateba, et al., 1987
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase Carbowax 20MCarbowax 20MCarbowax 20MCarbowax 20MCarbowax 20M
Column length (m) 50.150.150.150.150.
Carrier gas HydrogenHe   
Substrate      
Column diameter (mm) 0.200.660.660.640.66
Phase thickness (μm)      
Tstart (C) 50.60.60.50.60.
Tend (C) 200.170.170.170.170.
Heat rate (K/min) 1.1.1.1.1.
Initial hold (min)  40.40. 40.
Final hold (min) 35.  30. 
I 1189.1190.1190.1200.1190.
ReferenceWu, Liou, et al., 1987Buttery, Maddox, et al., 1986Buttery, Xu, et al., 1985Buttery, Kamm, et al., 1984Buttery and Ling, 1984
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type PackedCapillaryCapillary
Active phase CarbowaxCarbowax 20MCarbowax 20M
Column length (m) 3.150.150.
Carrier gas He  
Substrate Chromosorb G AW DMCS  
Column diameter (mm)  0.640.64
Phase thickness (μm)    
Tstart (C) 60.50.50.
Tend (C) 180.170.170.
Heat rate (K/min) 4.1.1.
Initial hold (min)  30.30.
Final hold (min)    
I 1210.1230.1230.
ReferenceSchieberle and Grosch, 1983Buttery, Parker, et al., 1981Buttery and Kamm, 1980
Comment MSDC-RI MSDC-RI MSDC-RI

References

Go To: Top, Normal alkane RI, polar column, temperature ramp, Notes

Data compilation copyright by the U.S. Secretary of Commerce on behalf of the U.S.A. All rights reserved.

Birtic, Ginies, et al., 2009
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Notes

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