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Van Den Dool and Kratz RI, polar column, temperature ramp

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Data compilation copyright by the U.S. Secretary of Commerce on behalf of the U.S.A. All rights reserved.

Data compiled by: NIST Mass Spectrometry Data Center, William E. Wallace, director

Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase DB-WaxDB-Wax EtrDB-WaxHP-InnowaxDB-FFAP
Column length (m) 30.30.60.60.30.
Carrier gas He He He
Substrate      
Column diameter (mm) 0.250.250.250.250.25
Phase thickness (μm) 0.250.250.250.250.5
Tstart (C) 40.40.40.40.35.
Tend (C) 200.250.200.250.225.
Heat rate (K/min) 4.5.4.4.4.
Initial hold (min) 1.3.1.2.5.
Final hold (min) 10.15.10.10.30.
I 1097.1080.1097.1081.1087.
ReferenceCho, Namgung, et al., 2008Aubert and Chanforan, 2007Cho I.H., Lee S.M., et al., 2007Hashizume M., Gordon M.H., et al., 2007Jarunrattanasri, Theerakulkait, et al., 2007
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase DB-FFAPFFAPFFAPFFAPDB-Wax
Column length (m) 30.30.30.30.30.
Carrier gas HeHeHeHeHe
Substrate      
Column diameter (mm) 0.250.250.250.250.32
Phase thickness (μm) 0.50.250.250.250.5
Tstart (C) 35.35.35.35.40.
Tend (C) 225.225.225.225.240.
Heat rate (K/min) 4.10.10.10.7.
Initial hold (min) 5.5.5.5. 
Final hold (min) 30.25.25.25.5.
I 1089.1095.1095.1069.1088.
ReferenceJarunrattanasri, Theerakulkait, et al., 2007Lozano P.R., Drake M., et al., 2007Lozano P.R., Drake M., et al., 2007Lozano P.R., Miracle E.R., et al., 2007Mahattanatawee K., Perez-Cacho P.R., et al., 2007
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase DB-WaxDB-WaxHP-InnowaxDB-WaxDB-FFAP
Column length (m) 30.30.60.30.30.
Carrier gas HeHeHeHeHe
Substrate      
Column diameter (mm) 0.250.250.250.320.32
Phase thickness (μm) 0.50.50.250.50.24
Tstart (C) 40.40.50.40.40.
Tend (C) 250.250.220.240.240.
Heat rate (K/min) 4.4.4.7.6.
Initial hold (min) 5.5.4. 2.
Final hold (min) 15.15.10.5.10.
I 1077.1089.1084.1090.1074.
ReferencePozo-Bayon M.A., Ruiz-Rodriguez A., et al., 2007Pozo-Bayon M.A., Ruiz-Rodriguez A., et al., 2007Quijano, Linares, et al., 2007Ruiz Perez-Cacho, Mahattanatawee, et al., 2007Scheidig, Czerny, et al., 2007
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase FFAPSupelcowax-10DB-Wax EtrDB-WaxDB-Wax
Column length (m) 30.30.30.60.60.
Carrier gas HeHeHeHeHe
Substrate      
Column diameter (mm) 0.320.320.250.250.25
Phase thickness (μm)  0.50.250.250.25
Tstart (C) 40.70.40.40.40.
Tend (C) 240.220.250.200.200.
Heat rate (K/min) 8.4.5.4.4.
Initial hold (min) 2.7.3.1.1.
Final hold (min) 5.20.15.10.10.
I 1070.1099.1087.1085.1097.
ReferenceSchlutt B., Moran N., et al., 2007Arena, Guarrera, et al., 2006Aubert C. and Pitrat M., 2006Cho, Choi, et al., 2006Cho, Kim, et al., 2006
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase DB-WaxCP-Wax 52CBZB-WaxDB-WaxCP-Wax 52CB
Column length (m) 30.60.30.30.50.
Carrier gas HeHeHeHe 
Substrate      
Column diameter (mm) 0.250.250.250.320.32
Phase thickness (μm) 0.250.250.150.5 
Tstart (C) 50.40.35.40.60.
Tend (C) 230.250.220.240.220.
Heat rate (K/min) 10.4.5.5.4.
Initial hold (min) 5. 5. 5.
Final hold (min) 25. 10.10.30.
I 1080.1087.1064.1084.1072.
ReferenceFernandez-Segovia, Escriche, et al., 2006Kourkoutas, Elmore, et al., 2006Ledauphin, Basset, et al., 2006Lopez-Galilea I., Fournier N., et al., 2006Mahadevan and Farmer, 2006
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase DB-WaxCP-Wax 52CBDB-WaxDB-WaxSupelcowax-10
Column length (m) 30.60.30.30.60.
Carrier gas He He  
Substrate      
Column diameter (mm) 0.250.250.250.250.25
Phase thickness (μm) 0.50.250.250.250.25
Tstart (C) 50.35.40.40.35.
Tend (C) 260.203.250.200.195.
Heat rate (K/min) 4.3.3.10.6.
Initial hold (min)  4. 3.5.
Final hold (min) 5. 20.20.60.
I 1091.1076.1077.1051.1059.
ReferenceSelli, Rannou, et al., 2006Alasalvar, Taylor, et al., 2005Berlinet, Ducruet, et al., 2005Carunchia Whetstine, Croissant, et al., 2005Chung, Fung, et al., 2005
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase StabilwaxSupelcowax-10DB-WaxSupelcowax-10Carbowax 20M
Column length (m) 60.60.30.30.60.
Carrier gas HeHeHeHeHe
Substrate      
Column diameter (mm) 0.250.250.250.250.25
Phase thickness (μm) 0.250.250.250.250.25
Tstart (C) 40.40.40.60.45.
Tend (C) 240.280.250.240.250.
Heat rate (K/min) 3.4.3.3.2.
Initial hold (min) 5.2. 5.0.17
Final hold (min) 10. 20.10. 
I 1073.1097.1072.1105.1077.
ReferenceCros, Lignot, et al., 2005Elmore, Nisyrios, et al., 2005Gancel, Ollitrault, et al., 2005Riu-Aumatell, Lopez-Tamames, et al., 2005Verzera, Campisi, et al., 2005
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase DB-WaxZB-WaxDB-WaxDB-WaxDB-Wax
Column length (m) 30.30.30.30.0.
Carrier gas  He   
Substrate      
Column diameter (mm) 0.250.320.250.250.32
Phase thickness (μm) 0.250.250.250.250.5
Tstart (C) 40.40.40.40.40.
Tend (C) 200.250.200.200.240.
Heat rate (K/min) 10.5.10.10.7.
Initial hold (min) 3.2.5.5. 
Final hold (min) 20.5.15.15.5.
I 1048.1075.1073.1073.1087.
ReferenceWhetstine, Cadwallader, et al., 2005Wu, Zorn, et al., 2005Avsar, Karagul-Yuceer, et al., 2004Avsar, Karagul-Yuceer, et al., 2004Gocmen, Gurbuz, et al., 2004
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase ZB-WaxDB-WaxDB-Wax EtrDB-WaxDB-Wax
Column length (m) 30.30.30.30.30.
Carrier gas HeHeHeHeHe
Substrate      
Column diameter (mm) 0.250.250.250.250.25
Phase thickness (μm) 0.150.50.250.250.25
Tstart (C) 35.40.40.45.45.
Tend (C) 220.230.245.240.240.
Heat rate (K/min) 1.85.3.6.6.
Initial hold (min) 10.2.3.10.10.
Final hold (min) 10.10.20.30.30.
I 1064.1097.1075.1111.1111.
ReferenceLedauphin, Saint-Clair, et al., 2004Mahajan, Goddik, et al., 2004Ménager, Jost, et al., 2004Nielsen, Larsen, et al., 2004Nielsen, Larsen, et al., 2004, 2
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase DB-WaxDB-WaxDB-WaxDB-WaxDB-Wax
Column length (m) 30.30.30.30.30.
Carrier gas HeHeHeHeHe
Substrate      
Column diameter (mm) 0.250.250.320.250.25
Phase thickness (μm) 0.250.250.50.250.25
Tstart (C) 45.45.40.40.40.
Tend (C) 240.240.240.200.200.
Heat rate (K/min) 6.3.5.4.4.
Initial hold (min) 10.10.5.5.5.
Final hold (min) 30.30. 20.20.
I 1111.1070.1083.1074.1074.
ReferenceNielsen, Larsen, et al., 2004, 3Nielsen and Poll, 2004Rega, Fournier, et al., 2004Yu, Kim, et al., 2004Yu, Kim, et al., 2004, 2
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase DB-WaxDB-WaxDB-WaxSupelcowaxSupelcowax
Column length (m) 30.30.30.25.25.
Carrier gas He He  
Substrate      
Column diameter (mm) 0.250.320.250.250.25
Phase thickness (μm) 0.250.50.250.250.25
Tstart (C) 40.40.40.35.35.
Tend (C) 200.245.250.225.225.
Heat rate (K/min) 4.2.3.4.4.
Initial hold (min) 5.3. 5.5.
Final hold (min) 20.20.20.10.10.
I 1072.1099.1063.1092.1092.
ReferenceYu, Kim, et al., 2004, 2Aubert, Günata, et al., 2003Brat, Rega, et al., 2003Chisholm, Wilson, et al., 2003Chisholm, Wilson, et al., 2003
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase StabilwaxDB-WaxDB-WaxDB-FFAPDB-Wax
Column length (m) 60.60.30.30.60.
Carrier gas HeH2 HeN2
Substrate      
Column diameter (mm) 0.250.320.320.250.25
Phase thickness (μm) 0.250.250.50.250.25
Tstart (C) 40.40.40.35.40.
Tend (C) 240.245.240.200.210.
Heat rate (K/min) 3.1.57.10.2.
Initial hold (min) 5.  5. 
Final hold (min) 10.20.5.30.40.
I 1073.1072.1093.1077.1068.
ReferenceCros, Vandanjon, et al., 2003Gancel, Ollitrault, et al., 2003Högnadóttir and Rouseff, 2003Karagül-Yüceer, Vlahovich, et al., 2003Mau, Ko, et al., 2003
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase DB-WaxDB-WaxAT-WaxDB-WaxZB-Wax
Column length (m) 30.30.60.30.60.
Carrier gas He He He
Substrate      
Column diameter (mm) 0.250.250.320.320.32
Phase thickness (μm) 0.250.250.250.50.25
Tstart (C) 40.35.65.35.40.
Tend (C) 240.240.250.240.220.
Heat rate (K/min) 6.6.2.5.3.
Initial hold (min) 10.2.10.5. 
Final hold (min) 30.6.60.5. 
I 1111.1076.1062.1083.1067.
ReferenceNielsen, Larsen, et al., 2003Peterson and Reineccius, 2003Pino, Almora, et al., 2003Rega, Fournier, et al., 2003Brunton, Cronin, et al., 2002
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase Supelcowax-10DB-WaxAT-WaxDB-WaxSupelcowax-10
Column length (m) 60.30.60.30.60.
Carrier gas He HeHeHe
Substrate      
Column diameter (mm) 0.250.250.320.320.25
Phase thickness (μm) 0.250.250.251.0.25
Tstart (C) 35.35.65.40.35.
Tend (C) 195.200.250.200.195.
Heat rate (K/min) 2.10.2.10.2.
Initial hold (min) 5.5.10.5.5.
Final hold (min) 90.30.60.30.90.
I 1086.1060.1062.1078.1086.
ReferenceChung, Yung, et al., 2002Karagül-Yüceer, Cadwallader, et al., 2002Pino, Marbot, et al., 2002Wu and Cadwallader, 2002Chung, Yung, et al., 2001
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase EC-WAXDB-WaxDB-WaxDB-WaxCP-Wax 52CB
Column length (m) 30.60.60.60.50.
Carrier gas HeHeHeHeH2
Substrate      
Column diameter (mm) 0.320.250.250.250.32
Phase thickness (μm) 0.50.250.250.25 
Tstart (C) 40.40.40.40.50.
Tend (C) 250.200.200.200.200.
Heat rate (K/min) 5.2.2.2.2.
Initial hold (min) 2.5.   
Final hold (min) 10.30.   
I 1092.1078.1083.1083.1071.
Referencele Guen, Prost, et al., 2001Kim, 2001Lee, Suriyaphan, et al., 2001Lee, Suriyaphan, et al., 2001Liu, Yang, et al., 2001
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase AT-WaxAT-WaxDB-WaxCP-Wax 52CBDB-Wax
Column length (m) 60.60.30.60.60.
Carrier gas HeHeHeHeHe
Substrate      
Column diameter (mm) 0.320.320.320.250.5
Phase thickness (μm) 0.250.250.50.250.32
Tstart (C) 65.65.50.45.40.
Tend (C) 250.250.250.250.290.
Heat rate (K/min) 2.2.8.2.4.
Initial hold (min) 10.10. 0.172.
Final hold (min) 60.60.  5.
I 1067.1062.1088.1077.1086.
ReferencePino and Marbot, 2001Pino, Marbot, et al., 2001Serot, Prost, et al., 2001Verzera, Campisi, et al., 2001Bartley and Jacobs, 2000
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase DB-WaxCP-Wax 52CBDB-WaxCP-Wax 52CBDB-Wax
Column length (m) 60.50.60.50.60.
Carrier gas He HeHeHe
Substrate      
Column diameter (mm) 0.320.320.320.250.32
Phase thickness (μm) 0.5 0.50.20.5
Tstart (C) 30.60.40.30.40.
Tend (C) 160.220.250.220.250.
Heat rate (K/min) 3.4.3.2.4.
Initial hold (min)  5.5.1.32.
Final hold (min) 5.30.10. 10.
I 1120.1092.1089.1069.1088.
ReferenceBeauchene, Grua-Priol, et al., 2000Chevance, Farmer, et al., 2000le Guen, Prost, et al., 2000Jensen, Christensen, et al., 2000Le Guen, Prost, et al., 2000
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase DB-WaxDB-WaxHP-WaxDB-WaxCP-Wax 52CB
Column length (m) 60.15.15.30.50.
Carrier gas HeHeHe  
Substrate      
Column diameter (mm) 0.320.530.530.320.32
Phase thickness (μm) 0.51.1.0.25 
Tstart (C) 40.40.40.40.60.
Tend (C) 250.220.220.230.220.
Heat rate (K/min) 4.5.5.3.4.
Initial hold (min) 2.3.3.4.5.
Final hold (min) 10.30.30. 30.
I 1092.1106.1101.1067.1083.
ReferenceLe Guen, Prost, et al., 2000Peng, 2000Peng, 2000Ruther, 2000Chevance and Farmer, 1999
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase CP-Wax 52CBCP-Wax 52CBCP-Wax 52CBSupelcowax-10Supelcowax-10
Column length (m) 50.50.50.60.60.
Carrier gas    HeHe
Substrate      
Column diameter (mm) 0.320.320.320.250.25
Phase thickness (μm)    0.250.25
Tstart (C) 60.60.40.35.35.
Tend (C) 220.220.220.195.195.
Heat rate (K/min) 4.4.4.2.2.
Initial hold (min) 5.5.5.5.5.
Final hold (min) 30.30.30.90.90.
I 1083.1070.1085.1086.1086.
ReferenceChevance and Farmer, 1999Chevance and Farmer, 1999, 2Chevance and Farmer, 1999, 2Chung, 1999Chung, 1999, 2
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase FFAPDB-WaxDB-WaxPEG-20MPEG-20M
Column length (m) 60.60.30.25.25.
Carrier gas   HeH2H2
Substrate      
Column diameter (mm) 0.250.250.320.200.20
Phase thickness (μm) 0.50.250.25  
Tstart (C) 50.40.40.50.50.
Tend (C) 230.200.200.230.230.
Heat rate (K/min) 5.3.6.2.2.
Initial hold (min) 3.5.5.3.3.
Final hold (min) 15.60.30.  
I 1106.1075.1068.1068.1069.
ReferenceStephan and Steinhart, 1999Cha, Kim, et al., 1998Cha, Kim, et al., 1998Li, Wang, et al., 1998Li, Wang, et al., 1998
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase DB-WaxHP-WaxFFAPPEG-20MDB-Wax
Column length (m) 30.50.30.60.60.
Carrier gas  HeHeHeHe
Substrate      
Column diameter (mm) 0.320.20.250.250.25
Phase thickness (μm) 0.50.40.250.250.25
Tstart (C) 40.30.20.50.50.
Tend (C) 245.220.200.230.230.
Heat rate (K/min) 3.5.4.2.3.
Initial hold (min) 3.1.1.  
Final hold (min) 20.30.1.60. 
I 1090.1077.1094.1086.1097.
ReferenceOllé, Baumes, et al., 1998Christensen, Jakobsen, et al., 1997Ott, Fay, et al., 1997Shimoda, Nakada, et al., 1997Shimoda, Peralta, et al., 1996
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase DB-WaxDB-WaxSupelcowax-10Supelcowax-10Carbowax 20M
Column length (m) 60.60.60.60.60.
Carrier gas HeHeHeHeHe
Substrate      
Column diameter (mm) 0.250.250.250.250.32
Phase thickness (μm) 0.250.250.250.250.425
Tstart (C) 50.50.40.60.45.
Tend (C) 230.230.200.230.300.
Heat rate (K/min) 2.3.2.5.3.
Initial hold (min)   5.5.3.
Final hold (min) 60. 30.20.20.
I 1086.1081.1075.1089.1075.
ReferenceShimoda, Shiratsuchi, et al., 1996Shimoda, Wu, et al., 1996Cadwallader, Tan, et al., 1995Granicher, Christen, et al., 1995Mondello, Dugo, et al., 1995
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase DB-WaxDB-WaxDB-WaxDB-WaxDB-Wax
Column length (m) 60.60.30.60.60.
Carrier gas  HeHe He
Substrate      
Column diameter (mm) 0.250.250.250.250.25
Phase thickness (μm) 0.250.25 0.250.25
Tstart (C) 50.50.40.50.50.
Tend (C) 230.230.200.230.230.
Heat rate (K/min) 2.2.2.2.2.
Initial hold (min)   5.  
Final hold (min)    60.60.
I 1073.1073.1078.1085.1085.
ReferenceShimoda, Shigematsu, et al., 1995Shimoda, Shigematsu, et al., 1995, 2Iwaoka, Hagi, et al., 1994Shiratsuchi, Shimoda, et al., 1994Shiratsuchi, Shimoda, et al., 1994, 2
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase DB-WaxSupelcowax-10HP-20MHP-FFAPDB-Wax
Column length (m) 60.60.50.50.60.
Carrier gas HeHeHeHe 
Substrate      
Column diameter (mm) 0.250.250.250.250.25
Phase thickness (μm)  0.25  0.25
Tstart (C) 40.40.60.60.50.
Tend (C) 200.195.190.210.230.
Heat rate (K/min) 3.2.3.3.2.
Initial hold (min) 5.5.  4.
Final hold (min)  40.  30.
I 1081.1080.1075.1107.1079.
ReferenceSumitani, Suekane, et al., 1994Chung and Cadwallader, 1993Chung, Eiserich, et al., 1993Chung, Eiserich, et al., 1993Shiratsuchi, Shimoda, et al., 1993
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase DB-WaxCP-Wax 52CBDB-WaxSupelcowax-10Supelcowax-10
Column length (m) 30.50.30.60.60.
Carrier gas HeH2He  
Substrate      
Column diameter (mm) 0.250.320.320.250.25
Phase thickness (μm)   0.250.250.25
Tstart (C) 40.50.40.40.40.
Tend (C) 200.200.220.175.175.
Heat rate (K/min) 2.1.55.2.2.
Initial hold (min) 10.10.3.5.5.
Final hold (min)  80. 20.20.
I 1077.1044.1067.1086.1087.
ReferenceUmano, Hagi, et al., 1992Wu and Liou, 1992Frohlich and Schreier, 1990Matiella and Hsieh, 1990Tanchotikul and Hsieh, 1989
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase Supelcowax-10CP-WAX 57CBSupelcowax-10Supelcowax-10DB-Wax
Column length (m) 60.50.60.60.60.
Carrier gas     He
Substrate      
Column diameter (mm) 0.250.320.250.250.32
Phase thickness (μm) 0.25 0.250.25 
Tstart (C) 40.60.40.40.50.
Tend (C) 175.200.175.175.225.
Heat rate (K/min) 2.4.2.2.1.5
Initial hold (min) 5.5.5.5. 
Final hold (min) 20. 20.20.50.
I 1091.1088.1089.1091.1072.
ReferenceTanchotikul and Hsieh, 1989Salter L.J., Mottram D.S., et al., 1988Vejaphan, Hsieh, et al., 1988Vejaphan, Hsieh, et al., 1988Chen and Ho, 1987
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryPacked
Active phase Carbowax 20MCarbowax 20MCarbowax 20M
Column length (m) 50.  
Carrier gas HeHe 
Substrate   Celite 545
Column diameter (mm) 0.32  
Phase thickness (μm)    
Tstart (C) 50.50.75.
Tend (C) 200.160.228.
Heat rate (K/min) 2.1.4.6
Initial hold (min) 5.10. 
Final hold (min) 40.  
I 1069.1063.1080.
ReferenceChen, Kuo, et al., 1986Chen, Kuo, et al., 1982van den Dool and Kratz, 1963
Comment MSDC-RI MSDC-RI MSDC-RI

References

Go To: Top, Van Den Dool and Kratz RI, polar column, temperature ramp, Notes

Data compilation copyright by the U.S. Secretary of Commerce on behalf of the U.S.A. All rights reserved.

Cho, Namgung, et al., 2008
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Notes

Go To: Top, Van Den Dool and Kratz RI, polar column, temperature ramp, References