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Normal alkane RI, non-polar column, temperature ramp

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Data compilation copyright by the U.S. Secretary of Commerce on behalf of the U.S.A. All rights reserved.

Data compiled by: NIST Mass Spectrometry Data Center, William E. Wallace, director

Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase HP-5HP-5 MSHP-1RTX-1RTX-1
Column length (m) 30.60.30.60.60.
Carrier gas HeliumHeliumHeliumHeliumHelium
Substrate      
Column diameter (mm) 0.250.250.250.220.22
Phase thickness (mum) 0.250.250.250.250.25
Tstart (C) 60.40.60.60.60.
Tend (C) 300.250.240.230.230.
Heat rate (K/min) 4.3.3.2.2.
Initial hold (min) 3.1.   
Final hold (min) 15.20. 5.5.
I 978.976.978.978.978.
ReferenceBertuzzi, Tirillini, et al., 2013Sardashti, Valizadeh, et al., 2013Alizadeh and Shaabani, 2012Bendiabdellah, El Amine Dib, et al., 2012Bendiabdellah, El Amine Dib, et al., 2012
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase Mega-5Polydimethyl siloxane with 5 % PhDB-5VF-5 MSPetrocol DH
Column length (m) 25.30.35.60.100.
Carrier gas HeliumHeliumHeliumHeliumHelium
Substrate      
Column diameter (mm) 0.25 0.200.250.25
Phase thickness (mum) 0.25 0.100.250.50
Tstart (C) 50.80.50.40.20.
Tend (C) 220.200.200.250.220.
Heat rate (K/min) 3.5.4.4.15.
Initial hold (min) 1.  2.15.
Final hold (min) 5.25.  30.
I 977.980.980.987.977.
ReferenceDell'Agli, Sanna, et al., 2012Priya, Prathapan, et al., 2012Silva, Suzuki, et al., 2012Srisajjalerwaja, Apichartsrangkoon, et al., 2012Supelco, 2012
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase HP-5HP-5HP-5RTX-1HP-5 MS
Column length (m) 25.25.25.60.30.
Carrier gas HydrogenHydrogenHydrogenHeliumHelium
Substrate      
Column diameter (mm) 0.320.320.320.220.25
Phase thickness (mum) 0.520.520.520.250.25
Tstart (C) 40.40.40.60.50.
Tend (C) 280.280.280.230.250.
Heat rate (K/min) 4.4.4.2.7.
Initial hold (min)     1.
Final hold (min) 10.10.10.45.5.
I 970.970.970.966.978.
ReferenceVelickovic, Ristic, et al., 2012Velickovic, Ristic, et al., 2012Velickovic, Ristic, et al., 2012Yapi, Boti, et al., 2012Zouari, Ayadi, et al., 2012
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase HP-1CP-Sil 5 CBHP-5DB-5DB-5 MS
Column length (m) 30.25.30.30.30.
Carrier gas HeliumHeliumHeliumHeliumHelium
Substrate      
Column diameter (mm) 0.250.250.250.250.25
Phase thickness (mum) 0.250.150.250.250.25
Tstart (C) 60.50.60.40.60.
Tend (C) 240.220.240.250.270.
Heat rate (K/min) 3. 3.3.3.
Initial hold (min)    5. 
Final hold (min)    20. 
I 978.976.979.973.978.
ReferenceAlizadeh, Khosh-Khui, et al., 2011Ameen, Usman, et al., 2011Bertoli, Lepnardi, et al., 2011Cao, Li, et al., 2011Cui, Yang, et al., 2011
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase CP-Sil 5 CBDB-1HP-5 MSHP-5 MSHP-5
Column length (m) 25.30.30.30.30.
Carrier gas HydrogenHeliumHeliumHeliumHelium
Substrate      
Column diameter (mm) 0.250.250.250.250.32
Phase thickness (mum) 0.150.250.250.250.25
Tstart (C) 50.40.60.35.60.
Tend (C) 230.210.220.250.240.
Heat rate (K/min) 3.5.4.5.3.
Initial hold (min)   20.3.2.
Final hold (min)   20.10. 
I 982.982.974.980.977.
ReferenceEsseien, Aboaba, et al., 2011Fathi, Sahari, et al., 2011Feizbakhsh and Naeemy, 2011Kadri, Zarai, et al., 2011Kahriman, Tosun, et al., 2011
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase DB-5VF-5 MSVF-5 MSSE-30 MSCP-Sil 5 CB
Column length (m) 30.60.60.30.30.
Carrier gas HeliumHeliumHeliumHeliumNitrogen
Substrate      
Column diameter (mm) 0.250.320.320.250.25
Phase thickness (mum) 0.250.250.250.250.26
Tstart (C) 60.30.30.50.45.
Tend (C) 240.260.260.250.280.
Heat rate (K/min) 3.2.2.5.3.
Initial hold (min)    5. 
Final hold (min)  28.28.10.22.
I 980.977.980.978.974.
ReferenceKarimi, Farmani, et al., 2011Leffingwell and Alford, 2011Leffingwell and Alford, 2011Menichini, Tundis, et al., 2011Mothana, Hasson, et al., 2011
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase Methylsiloxane + 5 % Ph-groupsDB-5RTX-5HP-5 MSZB-5 MS
Column length (m) 30.30.30.30.30.
Carrier gas HeliumHeliumNitrogenHeliumHelium
Substrate      
Column diameter (mm) 0.250.320.320.250.25
Phase thickness (mum) 0.250.250.250.320.25
Tstart (C) 60.35.60.60.60.
Tend (C) 230.200.210.210.290.
Heat rate (K/min) 7.2.3.6.5.
Initial hold (min) 2.  3. 
Final hold (min) 20.  2. 
I 979.972.976.962.978.
ReferenceNadim, Malik, et al., 2011Pattiram, Lasekan, et al., 2011Prasad, Moulekhi, et al., 2011Taherpour, Maroofi, et al., 2011Boix, Victorio, et al., 2010
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase ZB-5 MSDB-5 MSRTx-1RTX-1DB-5
Column length (m) 30.25.60.60.30.
Carrier gas HeliumHeliumHeliumHeliumHelium
Substrate      
Column diameter (mm) 0.250.300.220.220.32
Phase thickness (mum) 0.250.250.250.250.25
Tstart (C) 60.50.60.60.60.
Tend (C) 290.240.230.230.280.
Heat rate (K/min) 5.3.2.2.3.
Initial hold (min)      
Final hold (min)   35.30. 
I 981.977.978.978.975.
ReferenceBoix, Victorio, et al., 2010Chalchat, Figueredo, et al., 2010Dib, Bendahou, et al., 2010Dib, Djabou, et al., 2010Georgiou, Koutsaviti, et al., 2010
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase DB-1DB-5DB-5 MSDB-1BP-1
Column length (m) 30.30.60.25. 
Carrier gas HeliumHeliumHeliumNitrogenNitrogen
Substrate      
Column diameter (mm) 0.250.250.250.25 
Phase thickness (mum) 0.250.250.250.25 
Tstart (C) 50.50.40.60.60.
Tend (C) 265.250.250.250.220.
Heat rate (K/min) 2.52.5.4.5.
Initial hold (min) 1. 15.1.10.
Final hold (min) 20. 15.10.30.
I 962.979.979.976.973.
ReferenceHajimahdipoor, Samadi, et al., 2010Ho, Wang, et al., 2010Mesa-Arango, Betancur-Galvis, et al., 2010Mirjalili, Salehi, et al., 2010Mishra, Chaudhary, et al., 2010
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase HP-5SPB-1HP-5 MSHP-5 MSHP-5
Column length (m) 30.30.30.30.30.
Carrier gas HeliumHeliumHeliumHeliumHydrogen
Substrate      
Column diameter (mm) 0.250.200.250.250.25
Phase thickness (mum) 0.250.200.250.250.25
Tstart (C) 50.70.60.100.70.
Tend (C) 240.220.220.220.290.
Heat rate (K/min) 3.3.5.2.5.
Initial hold (min) 5. 10.  
Final hold (min)  15.   
I 971.970.980.978.984.
ReferenceMonsef-Esfahani, Miri, et al., 2010Neves, Rosa, et al., 2010Ogunwande, Flamini, et al., 2010Pripdeevech, Chumpolsri, et al., 2010Radulovic, Dordevic, et al., 2010
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase HP-5 MSHP-5 MSSLB-5 MSSLB-5 MSDB-5 MS
Column length (m) 30.30.10.10.30.
Carrier gas HeliumHeliumHeliumHeliumHelium
Substrate      
Column diameter (mm) 0.250.250.100.100.25
Phase thickness (mum) 0.250.250.100.100.25
Tstart (C) 70.60.50.50.60.
Tend (C) 290.220.250.250.240.
Heat rate (K/min) 5.6.10.10.3.
Initial hold (min)  3.   
Final hold (min) 10.    
I 983.961.976.978.981.
ReferenceRadulovic, Dordevic, et al., 2010, 2Safaei-Ghomi and Batooli, 2010Scandinaro, Tranchida, et al., 2010Scandinaro, Tranchida, et al., 2010Silva, Pott, et al., 2010
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase DB-5DB-1-MSCP Sil 5 CBDB-5DB-1
Column length (m) 30.60.25.30.30.
Carrier gas HeliumHelium HeliumHelium
Substrate      
Column diameter (mm) 0.250.250.250.250.25
Phase thickness (mum) 0.250.250.150.250.25
Tstart (C) 40.30.50.80.50.
Tend (C) 240.200.230.240.220.
Heat rate (K/min) 3.2.3.3.4.
Initial hold (min) 1.4.  2.
Final hold (min)  35. 2.2.
I 954.967.976.979.967.
Referencede Souza, Lopes, et al., 2010Takeoka, Hobbs, et al., 2010Usman, Zubair, et al., 2010Vahirua-Lechat, Mitermite, et al., 2010Xu, Tang, et al., 2010
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase DB-5HP-5MSDB-5OV-101SE-54
Column length (m) 30.30.30.50.30.
Carrier gas HeliumHeliumHeliumHeliumHelium
Substrate      
Column diameter (mm) 0.250.250.250.250.25
Phase thickness (mum) 0.250.250.250.250.25
Tstart (C) 40.50.60.70.60.
Tend (C) 250.250.240.220.260.
Heat rate (K/min) 10.7.3.2.2.
Initial hold (min) 1.1.  5.
Final hold (min) 3.5.  999.
I 982.982.978.982.977.
ReferenceYang, Zhang, et al., 2010Zouari, Zouari, et al., 2010Alim, Goze, et al., 2009Benites, Moiteiro, et al., 2009Dayisoylu and Alma, 2009
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase HP-5 MSZB-5SPB-5SPB-5DB-5
Column length (m) 30.30.60.30.30.
Carrier gas HeliumHeliumNitrogenNitrogenHelium
Substrate      
Column diameter (mm) 0.250.250.350.530.25
Phase thickness (mum) 0.250.250.250.500.25
Tstart (C) 60.50.60.50.50.
Tend (C) 250.240.230.210.250.
Heat rate (K/min) 2.3.4.3.5.
Initial hold (min) 8.  5.2.
Final hold (min) 15.1.40.45. 
I 971.984.984.977.979.
ReferenceFarhat, Ginies, et al., 2009Gardini, Beletti, et al., 2009Gauvin-Bialecki and Marodon, 2009Gilani, Shah, et al., 2009Ho, Wang, et al., 2009
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase DB-5HP-5 MSDB-5DB-5HP-5MS
Column length (m) 30.30.50.30.60.
Carrier gas HeliumHydrogenNitrogenHeliumHelium
Substrate      
Column diameter (mm) 0.250.250.200.250.25
Phase thickness (mum) 0.250.250.320.250.25
Tstart (C) 60.30.60.70.70.
Tend (C) 210.230.220.240.250.
Heat rate (K/min) 3.8.5.5.3.
Initial hold (min)  5.3.  
Final hold (min)  10.   
I 986.981.980.979.985.
ReferenceJaimand, Rezaee, et al., 2009Karlsson, Birgersson, et al., 2009Kazemi and Akhavani, 2009Lawal and Oyedelji, 2009Males, Plazibat, et al., 2009
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase VF-1 MSRTX-1RTX-1DB-5DB-5
Column length (m) 30.60.60.30.30.
Carrier gas HeliumHeliumHeliumHeliumNitrogen
Substrate      
Column diameter (mm) 0.250.220.220.250.25
Phase thickness (mum) 0.250.250.250.250.25
Tstart (C) 60.60.60.45.40.
Tend (C) 280.230.230.250.250.
Heat rate (K/min) 4.2.2.3.3.
Initial hold (min) 5.  3.1.
Final hold (min) 10.30.30.5.10.
I 973.971.978.982.976.
ReferenceMarchesini, Prada, et al., 2009Museli, Pau, et al., 2009Museli, Pau, et al., 2009Porto, Decorti, et al., 2009Rahmi-Nasrabadi, Gholivand, et al., 2009
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase DB-55 % Phenyl methyl siloxaneDB-5DB-1 MSDB-5
Column length (m) 30.60.30.30.50.
Carrier gas NitrogenHeliumNitrogenHeliumNitrogen
Substrate      
Column diameter (mm) 0.250.250.250.250.20
Phase thickness (mum) 0.250.250.250.250.32
Tstart (C) 40.90.40.40.60.
Tend (C) 250.225.230.250.220.
Heat rate (K/min) 3.3.2.6.5.
Initial hold (min) 1.  1.3.
Final hold (min) 10.3. 4.5.
I 979.980.981.967.968.
ReferenceRahimi-Nasrabadi, Gholivand, et al., 2009Retta, Gattuso, et al., 2009Scrivanti, Anton, et al., 2009Seo, Kim, et al., 2009Shafaghat and Sadeghi, 2009
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase DB-5 MSDB-5DB-5 MSHP-5MSHP-5 MS
Column length (m) 30.30.30.30.30.
Carrier gas HeliumHeliumHeliumHeliumHelium
Substrate      
Column diameter (mm) 0.250.250.250.250.25
Phase thickness (mum) 0.250.250.250.250.25
Tstart (C) 50.40.40.50.60.
Tend (C) 220.240.250.240.325.
Heat rate (K/min) 3.3.4.5.10.
Initial hold (min) 2.1.2. 6.
Final hold (min) 70. 2. 10.
I 979.954.980.980.978.
ReferenceShimizu, Imayoshi, et al., 2009de Souza, Lopes, et al., 2009Su, Wang, et al., 2009Wannes, Mhamdi, et al., 2009Zaibunnisa, Norashikin, et al., 2009
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase HP-5 MSHP-5HP-5 MSSE-52HP-5
Column length (m) 30.30.30.50.30.
Carrier gas HeliumHelium HeliumN2
Substrate      
Column diameter (mm) 0.250.250.250.250.25
Phase thickness (mum) 0.250.25 0.250.25
Tstart (C) 50.50.60.60.60.
Tend (C) 280.280.280.280.220.
Heat rate (K/min) 4.9.3.3.5.
Initial hold (min)  3.  10.
Final hold (min)  3. 20. 
I 975.980.977.976.984.
ReferenceZhao, Zeng, et al., 2009Aicha, Ines, et al., 2008Baziou, Couladis, et al., 2008Djarri, Medjroubi, et al., 2008Flamini, Tebano, et al., 2008
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase HP-5 MSHP-5HP-5SLB-5 MSZB-1
Column length (m) 30.30.30.30.30.
Carrier gas HeliumHeliumHeliumHeliumNitrogen
Substrate      
Column diameter (mm) 0.250.250.320.250.25
Phase thickness (mum) 0.250.250.250.250.25
Tstart (C) 50.50.100.50.45.
Tend (C) 230.300.240.250.230.
Heat rate (K/min) 4.3.5.3.3.
Initial hold (min) 4. 2.2. 
Final hold (min) 10.30.5.10. 
I 979.974.980.978.966.
ReferenceForero, Quijano, et al., 2008Isidorov, Lech, et al., 2008Lago, Romoff, et al., 2008Lo Presti, Sciarrone, et al., 2008Mierendorff, Stahl-Biskup, et al., 2008
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase DB-5Elite-1HP-5 MSBPX-5RTX-5
Column length (m) 60.30.30.7.520.
Carrier gas NitrogenHeliumHeliumHeliumHelium
Substrate      
Column diameter (mm) 0.250.320.250.100.18
Phase thickness (mum) 0.250.250.2510.0.20
Tstart (C) 60.60.60.60.50.
Tend (C) 250.246.250.240.280.
Heat rate (K/min) 5.3.2.3.4.
Initial hold (min)   8. 1.
Final hold (min) 10. 15.  
I 980.971.971.982.979.
ReferenceMosayebi, Amin, et al., 2008Raj, Baby, et al., 2008Sahraoui, Vian, et al., 2008Shellie, 2008Skalicka-Wozniak, Los, et al., 2008
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase HP-5OV-1HP-5HP-5 MSDB-5
Column length (m) 25.30.30.30.50.
Carrier gas HeliumHeliumHeliumHeliumNitrogen
Substrate      
Column diameter (mm) 0.250.250.250.250.20
Phase thickness (mum) 0.250.250.320.250.32
Tstart (C) 60.65.60.50.60.
Tend (C) 240.260.250.230.220.
Heat rate (K/min) 4.6.5.3.5.
Initial hold (min) 2. 30.10.3.
Final hold (min)    10.5.
I 981.987.981.980.974.
ReferenceVerdian-rizi, 2008Wang, Yi, et al., 2008Yassa and Akhani, 2008Adams, Beauchamp, et al., 2007Amiri, 2007
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase DB-5MSHP-5 MSHP-5CP Sil 5 CBHP-5MS
Column length (m) 30.30.30.30.30.
Carrier gas HeHeliumHeN2He
Substrate      
Column diameter (mm) 0.250.250.250.320.25
Phase thickness (mum) 0.250.25 0.250.25
Tstart (C) 60.60.70.60.60.
Tend (C) 240.200.240.300.280.
Heat rate (K/min) 3.4.5.4.3.
Initial hold (min)      
Final hold (min)  20.   
I 982.981.974.967.978.
ReferenceAndrade, Oliveira, et al., 2007Araque, Rojas, et al., 2007Asekun, Olusegun, et al., 2007Baran, von Reuss, et al., 2007Basta, Pavlovic, et al., 2007
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase DB-5HP-5MSHP-5MSHP-5 MSHP-5
Column length (m) 30.30.30.30.30.
Carrier gas HeHeN2HeliumN2
Substrate      
Column diameter (mm) 0.260.250.320.320.25
Phase thickness (mum) 0.250.250.250.250.25
Tstart (C) 60.60.50.60.50.
Tend (C) 240.280.200.280.240.
Heat rate (K/min) 3.3.1.4.5.
Initial hold (min)   1.5.1.
Final hold (min)     4.
I 973.978.997.975.980.
ReferenceBos, Woerdenbag, et al., 2007Bozin B., Mlmica-Dukic N., et al., 2007Calyecac-cortero, Cibrian-Tovar, et al., 2007Capetanos, Saroglou, et al., 2007Cheraif, Ben Jannet, et al., 2007
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase DB-5DB-5DB-5MSDB-5HP-5MS
Column length (m) 60.30.30.30.30.
Carrier gas HeHeHeHeliumHe
Substrate      
Column diameter (mm) 0.250.250.250.260.25
Phase thickness (mum) 0.250.250.250.250.25
Tstart (C) 40.70.60.60.60.
Tend (C) 220.310.240.290.250.
Heat rate (K/min) 3.3.3.3.2.
Initial hold (min)  5.  8.
Final hold (min)  20.  15.
I 989.947.978.973.974.
ReferenceChyau, Tsai, et al., 2007Coelho, Grosso, et al., 2007Da Silva J.K.R., Sousa P.J.C., et al., 2007Elfami, Bos, et al., 2007Ferhat, Meklati, et al., 2007
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase ZP-5DB-1Col-Elite 5MSHP-1DBP-5
Column length (m) 60.60.30.30.25.
Carrier gas HeNitrogenHeHeHelium
Substrate      
Column diameter (mm) 0.250.250.250.250.25
Phase thickness (mum) 0.250.250.250.250.22
Tstart (C) 40.60.30.60.40.
Tend (C) 260.250.246.240.250.
Heat rate (K/min) 6.4.3.2.3.
Initial hold (min) 7.1.  1.
Final hold (min) 1.10. 20.10.
I 995.977.980.966.951.
ReferenceFüssel, Dötterl, et al., 2007Ghasempour, Shirinpour, et al., 2007Gudaityte and Venskutonis R.P., 2007Hachicha, Skanji, et al., 2007Heravi and Sereshti, 2007
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase RTX-5 MSDB-5SE-30HP-5AT-5
Column length (m) 30.30.30.30.60.
Carrier gas HeHeHeHeHelium
Substrate      
Column diameter (mm) 0.250.250.250.250.25
Phase thickness (mum) 0.250.250.250.250.25
Tstart (C) 45.60.40.40.60.
Tend (C) 210.300.250.250.260.
Heat rate (K/min) 3.3.5.5.4.
Initial hold (min)   5.5. 
Final hold (min)   10.10. 
I 984.968.978.972.968.
ReferenceHudaib and Aburjai, 2007Limberger, Scopel, et al., 2007Loizzo, Tundis, et al., 2007Loizzo, Tundis, et al., 2007Meccia, Rojas, et al., 2007
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase ZB-5DB-1DB-5DB-5DB-5
Column length (m) 30.30.30.30.30.
Carrier gas  HeliumHeliumHeliumHe
Substrate      
Column diameter (mm) 0.250.250.250.250.25
Phase thickness (mum) 0.250.250.250.250.32
Tstart (C) 60.50.60.60.50.
Tend (C) 220.260.300.220.250.
Heat rate (K/min) 4.2.53.4.5.
Initial hold (min) 5.1.   
Final hold (min) 20.20.   
I 974.964.953.981.970.
ReferenceMohottalage, Tabacchi, et al., 2007Monser-Esfahani, Karamkhani, et al., 2007Moreno, Lima, et al., 2007Morteza-Semnani, Saeedi, et al., 2007Nori-Shargh, Raftari, et al., 2007
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase Methyl SiliconeDB-1SPB-1SPB-5BPX-5
Column length (m) 50.50.30.30.50.
Carrier gas HeliumHeHeHeHe
Substrate      
Column diameter (mm) 0.250.250.20.250.22
Phase thickness (mum)  0.250.20.25 
Tstart (C) 50.95.70.50.50.
Tend (C) 240.240.220.250.300.
Heat rate (K/min) 3.4.3.2.4.
Initial hold (min)     1.
Final hold (min)   15. 10.
I 980.970.970.972.1000.
ReferenceOzcan and Chalchat, 2007Pala-Paul, Brophy, et al., 2007Pinto, Salgueiro, et al., 2007Raal, Orav, et al., 2007Rali, Wossa, et al., 2007
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase BPX-5DB-1HP-5HP-5 MSDB-1
Column length (m) 50.60.30.60.60.
Carrier gas HeNitrogenHeliumHydrogen 
Substrate      
Column diameter (mm) 0.220.250.250.250.25
Phase thickness (mum) 1.0.250.250.250.25
Tstart (C) 50.60.40.60.60.
Tend (C) 300.250.260.260.250.
Heat rate (K/min) 4.4.4.4.5.
Initial hold (min) 1.1.   
Final hold (min) 10.10. 20. 
I 1000.977.969.968.972.
ReferenceRali, Wossa, et al., 2007, 2Reza, Ebrahim, et al., 2007Ristic, Krivokuca-Dokic, et al., 2007Rojas, Velasco, et al., 2007Salehi, Asghari, et al., 2007
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase DB-1DB-5DBP-5DB-5DB-1
Column length (m) 60.30.25.30.60.
Carrier gas HeHeHeliumHeNitrogen
Substrate      
Column diameter (mm) 0.250.250.250.250.25
Phase thickness (mum) 0.250.250.220.250.25
Tstart (C) 60.50.40.60.60.
Tend (C) 250.240.250.320.250.
Heat rate (K/min) 5.4.3.10.5.
Initial hold (min)   1.  
Final hold (min)   10.4.10.
I 975.976.951.982.976.
ReferenceSalehi, Fakhari, et al., 2007Sefidkon, Abbasi, et al., 2007Sereshti and Samadi, 2007Smelcerovic, Spiteller, et al., 2007Sonboli, Kanani, et al., 2007
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase DB-5DB-5Elite-5MSDB-5DB-5
Column length (m) 30.30.30.30.30.
Carrier gas   HeHeliumHelium
Substrate      
Column diameter (mm) 0.250.250.320.250.25
Phase thickness (mum) 0.250.250.5  
Tstart (C) 40.40.40.60.60.
Tend (C) 210.250.280.200.200.
Heat rate (K/min) 2.2.4.2.2.
Initial hold (min)   5.  
Final hold (min) 33.33.10.20.20.
I 976.976.977.975.980.
ReferenceSylvestre, Longtin, et al., 2007Sylvestre, Pichette, et al., 2007Tava, Pecetti, et al., 2007Tiwary, Nail, et al., 2007Tiwary, Nail, et al., 2007
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase HP-5 MSHP-5MSHP-5 MSHP-5MSHP-5
Column length (m) 30.30.30.30.30.
Carrier gas HeliumHeHeliumHeHe
Substrate      
Column diameter (mm) 0.250.250.250.250.25
Phase thickness (mum) 0.250.250.250.250.32
Tstart (C) 60.60.60.40.60.
Tend (C) 280.280.280.250.250.
Heat rate (K/min) 3.3.3.3.5.
Initial hold (min)    5.30.
Final hold (min)    10. 
I 979.949.979.969.981.
ReferenceTsokou, Georgopoulos, et al., 2007Tzakou, Bazos, et al., 2007Vagionas, Graikou, et al., 2007Vichi, Riu-Aumatell, et al., 2007Yassa and Akhani, 2007
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase HP-5HP-5DB-5DB-5CP Sil 5 CB
Column length (m) 30.30.30.30.25.
Carrier gas N2N2He He
Substrate      
Column diameter (mm) 0.250.250.250.25 
Phase thickness (mum) 0.250.250.250.25 
Tstart (C) 50.50.60.60.80.
Tend (C) 280.280.300.300.270.
Heat rate (K/min) 9.9.3.3.10.
Initial hold (min) 3.3.   
Final hold (min) 3.3.   
I 973.980.971.972.978.
ReferenceAbdelwahed, Hayder, et al., 2006Abdelwahed, Hayder, et al., 2006Apel, Sobral, et al., 2006Apel, Sobral, et al., 2006, 2Ayoub, Al-Azizi, et al., 2006
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase DB-5HP-1ZB-5AT-5BP-1
Column length (m) 30.50.30.60.50.
Carrier gas HeN2 He 
Substrate      
Column diameter (mm) 0.250.20.250.250.22
Phase thickness (mum) 0.250.330.250.250.25
Tstart (C) 50.60.40.60.60.
Tend (C) 265.250.300.200.220.
Heat rate (K/min) 2.52.2.4.2.
Initial hold (min) 1.    
Final hold (min) 20.20. 20.20.
I 982.970.977.988.973.
ReferenceBazargani, Almasirad, et al., 2006Berlioz, Cordella, et al., 2006Biondi, Sari, et al., 2006Borges, Rojas, et al., 2006Boti, Yao, et al., 2006
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase HP-5MSHP-1HP-1HP-1SPB-1
Column length (m) 30.50.50.50.30.
Carrier gas HeHeHeHeHelium
Substrate      
Column diameter (mm) 0.250.20.20.20.20
Phase thickness (mum) 0.250.330.330.330.20
Tstart (C) 60.60.60.60.70.
Tend (C) 280.250.250.250.220.
Heat rate (K/min) 3.2.2.2.3.
Initial hold (min)  4.4.4. 
Final hold (min)  30.30.30.15.
I 977.970.970.970.970.
ReferenceBozin, Mimicá-Dukic, et al., 2006Castel, Fernandez, et al., 2006Castel, Fernandez, et al., 2006Castel, Fernandez, et al., 2006, 2Cavaleiro, Pinto, et al., 2006
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase DB-1DB-5HP-5DB-5HP-5MS
Column length (m) 60.30.30.30.30.
Carrier gas NitrogenN2He  
Substrate      
Column diameter (mm) 0.250.250.320.320.25
Phase thickness (mum)  0.250.250.250.25
Tstart (C) 40.70.60.60.60.
Tend (C) 200.230.246.230.280.
Heat rate (K/min) 2.2.3.3.4.
Initial hold (min) 1.2.   
Final hold (min) 9.20. 15. 
I 969.982.977.980.981.
ReferenceChen, Sheu, et al., 2006Choi, 2006Coronel, Cerda-Garcia-Rojas, et al., 2006Damjanovic, Skala, et al., 2006Ebrahim Sajjadi and Mehregan, 2006
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase DB-5BP-1HP-1HP-5HP-1
Column length (m) 30.50.50.30.50.
Carrier gas HeliumHeHeHeHe
Substrate      
Column diameter (mm) 0.260.220.20.250.2
Phase thickness (mum) 0.250.250.330.250.33
Tstart (C) 60.60.60.50.60.
Tend (C) 290.220.250.300.250.
Heat rate (K/min) 3.2.2.5.2.
Initial hold (min)    5. 
Final hold (min)  20.60.5.40.
I 973.970.968.977.971.
ReferenceElfami, Komar, et al., 2006Fanciullino, Tomi, et al., 2006Fernandez, Pintaric, et al., 2006Figuérédo, Cabassu, et al., 2006Filippi, Lanfranchi, et al., 2006
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase DB-1DB-5DB-1DB-5DB-5
Column length (m) 60.30.60.30.30.
Carrier gas HeHeHeHeHe
Substrate      
Column diameter (mm) 0.250.250.250.250.25
Phase thickness (mum) 0.250.250.250.250.25
Tstart (C) 60.60.60.60.50.
Tend (C) 240.240.240.240.250.
Heat rate (K/min) 5.5.5.5.3.
Initial hold (min) 2.2.2.2. 
Final hold (min)     10.
I 998.978.998.978.979.
ReferenceGohari, Hadjiakhoondi, et al., 2006Gohari, Hadjiakhoondi, et al., 2006Gohari A.R., Hadjiakhoondi A., et al., 2006Gohari A.R., Hadjiakhoondi A., et al., 2006Havlik, Kokoska, et al., 2006
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase CP Sil 5 CBHP-5HP-5MSDB-5CP Sil 5 CB
Column length (m) 30.30.30.30.25.
Carrier gas  HeHeHelium 
Substrate      
Column diameter (mm) 0.250.250.250.250.25
Phase thickness (mum) 0.250.250.250.25 
Tstart (C) 40.60.60.60.50.
Tend (C) 220.240.260.260.230.
Heat rate (K/min) 3.4.4.3.3.
Initial hold (min)      
Final hold (min) 3.    
I 979.980.980.978.978.
ReferenceHymete, Rohloff, et al., 2006Ibañez and Usubillaga, 2006Ibanez and Usubillaga, 2006Javidnia, Miri, et al., 2006Kasali, Ekundayo, et al., 2006
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase HP-5MSHP-5MSMethyl SiliconeHP-5RTX-1
Column length (m) 30.30.25.30.30.
Carrier gas HeHeHeHeliumHe
Substrate      
Column diameter (mm) 0.250.250.250.320.32
Phase thickness (mum) 0.250.250.250.250.25
Tstart (C) 50.50.90.60.60.
Tend (C) 280.280.220.260.300.
Heat rate (K/min) 5.5.7.5.4.
Initial hold (min) 4.4.2.2. 
Final hold (min) 10.10. 13. 
I 982.979.974.983.971.
ReferenceKim, Abd El-Aty, et al., 2006Kim, El-Aty, et al., 2006Kitchlu, Bakshi, et al., 2006Kucuk, Gulec, et al., 2006Kula, Izydorczyk, et al., 2006
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase CP Sil 5 CBDB-1CP Sil 8 CBCP Sil 5 CBCP Sil 5 CB
Column length (m) 30.60.30.30.30.
Carrier gas N2  N2N2
Substrate      
Column diameter (mm) 0.250.250.250.320.25
Phase thickness (mum) 0.250.250.250.250.25
Tstart (C) 60.70.40.50.50.
Tend (C) 300.230.250.300.200.
Heat rate (K/min) 5.2.3.4.5.
Initial hold (min) 4.2.5.  
Final hold (min)  20.20.  
I 971.973.980.969.973.
ReferenceKurowska and Galazka, 2006Lan Phi N.T., Nishiyama C., et al., 2006Li, Lee, et al., 2006Lis and Milczarek, 2006Martin, Joseph, et al., 2006
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase HP-5 MSHP-55 % Phenyl methyl siloxaneHP-101BP-1
Column length (m) 30.30.30.25.25.
Carrier gas NitrogenN2HeliumHeHe
Substrate      
Column diameter (mm) 0.250.250.250.20.3
Phase thickness (mum) 0.250.520.250.2 
Tstart (C) 50.50.60.70.70.
Tend (C) 280.280.280.200.220.
Heat rate (K/min) 5.5.3.3.4.
Initial hold (min)    2.2.
Final hold (min) 5.5.30.15.10.
I 976.976.956.957.980.
ReferenceMarzouk, Mansour, et al., 2006Marzouk, Neffati, et al., 2006Marongiu, Piras, et al., 2006Mastelic, Jerkovic, et al., 2006Moody, Gundidza, et al., 2006
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase DB-5DB-5DB-5DB-5DB-5
Column length (m) 30.30.30.30.30.
Carrier gas HeHeHeHe 
Substrate      
Column diameter (mm) 0.250.250.250.250.25
Phase thickness (mum) 0.250.250.250.250.25
Tstart (C) 60.60.60.50.50.
Tend (C) 220.220.220.250.265.
Heat rate (K/min) 4.4.4.4.2.5
Initial hold (min)  5.5. 0.5
Final hold (min)      
I 980.981.981.978.963.
ReferenceMorteza-Semnani, Akbarzadeh, et al., 2006Morteza-Semnani K., Akbarzadeh M., et al., 2006Morteza-Semnani K., Saeedi M., et al., 2006Najafpour Navaei, Mirza, et al., 2006Nickavar B., Kamalinejad M., et al., 2006
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase NB-30DB-5SE-52DB-1HP-5MS
Column length (m) 30.25.50.50.30.
Carrier gas HeN2HeliumN2He
Substrate      
Column diameter (mm) 0.20.250.250.250.25
Phase thickness (mum) 0.250.15 0.250.25
Tstart (C) 50.50.50.95.40.
Tend (C) 250.200.240.240.260.
Heat rate (K/min) 2.4.3.4.4.
Initial hold (min)  3.   
Final hold (min)      
I 970.977.980.981.975.
ReferenceOrav, Raal, et al., 2006Ouamba, Ouabonzi, et al., 2006Ozcan, Chalchat, et al., 2006Pala-Paul J., Perez-Alonso M.J., et al., 2006Petrovic, Ristic, et al., 2006
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase HP-5DB-5DB-5DB-5HP-5MS
Column length (m) 30.30.30.30.30.
Carrier gas HeHydrogenHydrogenHydrogenHe
Substrate      
Column diameter (mm) 0.250.250.250.250.25
Phase thickness (mum) 0.250.250.250.250.25
Tstart (C) 60.70.70.70.60.
Tend (C) 220.280.280.280.280.
Heat rate (K/min) 5.4.4.4.3.
Initial hold (min) 10.4.4.4. 
Final hold (min)      
I 978.980.980.980.958.
ReferencePintore G., Chessa M., et al., 2006Pino, Marbot, et al., 2006Pino, Marbot, et al., 2006Pino, Marbot, et al., 2006Pitarokili, Tzakou, et al., 2006
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase HP-5HP-5MSDB-5DB-5HP-5MS
Column length (m) 25.30.30.30.30.
Carrier gas H2 HeHeHe
Substrate      
Column diameter (mm) 0.320.250.250.250.32
Phase thickness (mum) 0.250.250.250.250.25
Tstart (C) 60.50.60.60.60.
Tend (C) 240.250.200.260.243.
Heat rate (K/min) 3.10.2.5.3.
Initial hold (min)  5.   
Final hold (min)   60.  
I 981.976.982.979.972.
ReferencePotzernheim, Bizzo, et al., 2006Robinson, 2006Rout, Naik, et al., 2006Sabulal, Dan, et al., 2006Sabulal, Dan, et al., 2006, 2
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase ZB-5DB-1FSOT-RSL-200DB-5DB-5
Column length (m) 30.60.30.30.30.
Carrier gas He HydrogenHeHe
Substrate      
Column diameter (mm) 0.250.250.320.250.25
Phase thickness (mum) 0.250.250.250.250.25
Tstart (C) 40.70.40.50.50.
Tend (C) 300.230.280.240.240.
Heat rate (K/min) 2.2.6.4.4.
Initial hold (min)  2.5.  
Final hold (min)  20.5.  
I 977.976.981.984.984.
ReferenceSari M., Biondi D.M., et al., 2006Sawamura, Onishi, et al., 2006Schmidt, Jirovetz, et al., 2006Sefidkon, Abbasi, et al., 2006Sefidkon, Abbasi, et al., 2006
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase DB-5DB-1HP-5CP Sil 5 CBCP Sil 5 CB
Column length (m) 30.60.25.25.25.
Carrier gas HeHeN2H2 
Substrate      
Column diameter (mm) 0.250.250.20.250.25
Phase thickness (mum) 0.25 0.33  
Tstart (C) 40.40.30.50.50.
Tend (C) 240.250.280.230.230.
Heat rate (K/min) 4.4.3.3.3.
Initial hold (min)      
Final hold (min)      
I 980.976.982.982.976.
ReferenceSefidkon and Jamzad, 2006Sefidkon, Jamzad, et al., 2006Shafi, Jose, et al., 2006Tesso, König, et al., 2006Tesso, Kubeczka, et al., 2006
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase HP-5 MSMethyl SiliconeSPB-5DB-5DB-1
Column length (m) 30.25.60.30.50.
Carrier gas HeliumN2HeN2N2
Substrate      
Column diameter (mm) 0.250.30.320.250.25
Phase thickness (mum) 0.250.151.0.250.25
Tstart (C) 60.50.40.60.90.
Tend (C) 250.210.230.240.240.
Heat rate (K/min) 2.2.3.4.4.
Initial hold (min) 8.5.5.  
Final hold (min) 15. 2.  
I 972.986.989.977.964.
ReferenceTigrine-Kordiani, Meklati, et al., 2006Tonzibo, Coffy, et al., 2006Tornambe, Cornu, et al., 2006Trilles, Bombarda, et al., 2006Velasco-Negueruela, Pérez-Alonso, et al., 2006
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase SPB-1SPB-1DB-5SE-30DB-5
Column length (m) 50.30.30.30.30.
Carrier gas HeHeHeHeHe
Substrate      
Column diameter (mm) 0.20.250.25 0.25
Phase thickness (mum) 0.330.250.25 0.25
Tstart (C) 50.50.40.90.60.
Tend (C) 220.250.250.220.210.
Heat rate (K/min) 4.4.4.7.3.
Initial hold (min) 1.1. 2.5.
Final hold (min) 10.10.   
I 968.966.963.968.978.
ReferenceWong, Lim, et al., 2006Wong, Sivasothy, et al., 2006Yadegarinia, Gachkar, et al., 2006Ahuja, Bakshi, et al., 2005Askari and Sefidkon, 2005
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase HP-5MSHP-1DB-5DB-5MSDB-1
Column length (m) 30.50.30.30.25.
Carrier gas HeHeHeHeHe
Substrate      
Column diameter (mm) 0.250.20.2490.250.25
Phase thickness (mum) 0.250.50.250.250.25
Tstart (C) 60.60.60.60.50.
Tend (C) 280.250.290.240.250.
Heat rate (K/min) 3.2.3.3.3.
Initial hold (min)     3.
Final hold (min)  60.   
I 971.970.973.981.978.
ReferenceBasta, Tzakou, et al., 2005Bendimerad and Bendiab, 2005Bos, Stojanova, et al., 2005Busman, Zoghbi, et al., 2005Cégiéla-Carlioz, Bessière, et al., 2005
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase DB-5DB-5DB-5Methyl SiliconeSPB-5
Column length (m) 50.30.30.60.60.
Carrier gas  HeHeHeHe
Substrate      
Column diameter (mm) 0.30.250.250.30.32
Phase thickness (mum) 0.250.250.25 1.
Tstart (C) 60.60.60.50.40.
Tend (C) 240.240.240.240.230.
Heat rate (K/min) 2.3.3.3.3.
Initial hold (min)     5.
Final hold (min)      
I 978.980.981.973.989.
ReferenceChagonda and Chalchat, 2005Chaverri and Cicció, 2005Chaverri and Cicció, 2005Chalchat and Özcan, 2005Cornu, Kondjoyan, et al., 2005
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase Polymethylsiloxane, (PMS-20000)ZB-5HP-5DB-1DB-1
Column length (m) 25.60.25.60.60.
Carrier gas HeHeHeHeN2
Substrate      
Column diameter (mm) 0.200.250.20.250.25
Phase thickness (mum)  0.250.330.250.25
Tstart (C) 50.40.60.60.60.
Tend (C) 250.250.240.250.250.
Heat rate (K/min) 3.6.3.5.5.
Initial hold (min) 3.7.   
Final hold (min)  1.7. 10.
I 982.995.974.977.973.
ReferenceDohou, Yamni, et al., 2005Dötterl, Wolfe, et al., 2005Duarte, Figueira, et al., 2005Fakhari, Salehi, et al., 2005Fakhari A.R., Sonboli A., et al., 2005
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase DB-5HP-1HP-5HP-5HP-5MS
Column length (m) 30.50.30.30.30.
Carrier gas He HeHeHe
Substrate      
Column diameter (mm) 0.250.20.250.250.25
Phase thickness (mum) 0.250.250.250.250.25
Tstart (C) 60.60.60.50.60.
Tend (C) 300.250.30.300.200.
Heat rate (K/min) 3.2.4.5.4.
Initial hold (min) 3.60.3.5.30.
Final hold (min)   15.5. 
I 969.972.978.977.970.
ReferenceFerraz, Limberger, et al., 2005Fernandez, Lizzani-Cuvelier, et al., 2005Ferretti, Maggi, et al., 2005Figuérédo, Cabassu, et al., 2005Gauvin and Smadja, 2005
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase HP-5MSCP Sil 5 CBRSL-200DB-1DB-1
Column length (m) 25.30.30.30.30.
Carrier gas HeN2 HeHe
Substrate      
Column diameter (mm) 0.250.250.250.250.25
Phase thickness (mum)  0.250.250.250.25
Tstart (C) 50.60.40.50.50.
Tend (C) 250.250.280.265.265.
Heat rate (K/min) 3.5.6.2.52.5
Initial hold (min) 3. 2.1.1.
Final hold (min) 10.10.10.20.30.
I 988.980.981.962.964.
ReferenceGhasemi Y., Faridi P., et al., 2005Jassbi, Mehrdad, et al., 2005Jirovetz, Buchbauer, et al., 2005Khanavi, Ghasemian, et al., 2005Khalighi-Sigaroodi, Hadijiakhoondi, et al., 2005
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase DB-5DB-1DB-5DB-5HP-5
Column length (m) 30.60.30.30.60.
Carrier gas HeHe HeliumHe
Substrate      
Column diameter (mm) 0.320.250.250.250.32
Phase thickness (mum)  0.250.250.250.25
Tstart (C) 60.50.35.35.30.
Tend (C) 240.250.280.280.260.
Heat rate (K/min) 3.4.4.4.2.
Initial hold (min)  5.2.2.2.
Final hold (min)     28.
I 981.979.975.975.979.0
ReferenceKhayyat and Karimi, 2005Khajeh, Yamini, et al., 2005Kowalski and Wolski, 2005Kowalski, 2005Leffingwell and Alford, 2005
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase DB-5DB-5DB-5DB-5DB-5
Column length (m) 30.30.30.30.30.
Carrier gas HeHeHeHeHe
Substrate      
Column diameter (mm) 0.250.250.250.250.25
Phase thickness (mum) 0.250.250.250.250.25
Tstart (C) 60.60.60.60.60.
Tend (C) 230.220.220.220.220.
Heat rate (K/min) 3.4.4.4.4.
Initial hold (min)  5.5.4.4.
Final hold (min)      
I 971.979.980.979.980.
ReferenceLimberger, Sobral, et al., 2005Morteza-Semnani, Akbarzadeh, et al., 2005Morteza-Semnani, Akbarzadeh, et al., 2005, 2Morteza-Semnani and Saeedi, 2005Morteza-Semnani and Saeedi, 2005, 2
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase DB-5CP Sil 5 CBCP Sil 5 CBDB-5DB-1
Column length (m) 30.25.25.30.50.
Carrier gas He  HeN2
Substrate      
Column diameter (mm) 0.250.250.250.250.25
Phase thickness (mum) 0.250.150.15 0.25
Tstart (C) 50.50.50.40.95.
Tend (C) 250.230.230.220.240.
Heat rate (K/min) 3.3.3.4.4.
Initial hold (min) 5.  1. 
Final hold (min)      
I 979.978.978.964.970.
ReferenceNajafpour Navaei, Mirza, et al., 2005Ogunwande, Olawore, et al., 2005Olawore, Ogunwande, et al., 2005de Oliveira, Dias, et al., 2005Pala-Paul, Perez-Alonso, et al., 2005
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase HP-5MSSPB-5HP-5MSDB-1Methyl Silicone
Column length (m) 30.30.30.60.12.5
Carrier gas  HeHeHeHe
Substrate      
Column diameter (mm) 0.20.250.250.250.25
Phase thickness (mum)  0.250.320.250.25
Tstart (C) 60.60.60.50.50.
Tend (C) 280.250.250.250.270.
Heat rate (K/min) 3.4.5.4.4.
Initial hold (min)  2.3.  
Final hold (min)  20.   
I 979.980.979.967.978.
ReferencePetrakis, Roussis, et al., 2005Pino, Marbot, et al., 2005Pourmortazavi, Ghadiri, et al., 2005Rasooli and Owlia, 2005Ricci, Fraternale, et al., 2005
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase CP Sil 5 CBCP Sil 5 CBDB-5HP-5MSHP-5MS
Column length (m) 30.30.25.30.30.
Carrier gas HeHeHeHeHe
Substrate      
Column diameter (mm) 0.250.250.250.250.25
Phase thickness (mum) 0.250.250.250.250.25
Tstart (C) 40.40.60.60.60.
Tend (C) 220.220.200.220.280.
Heat rate (K/min) 4.4.2.6.4.
Initial hold (min) 1.1. 3. 
Final hold (min)   80.  
I 979.979.981.985.979.
ReferenceRohloff and Bones, 2005Rohloff and Bones, 2005Rout, Misra, et al., 2005Safaei-Ghomi, Bamoniri, et al., 2005Sajjadi S.E. and Eskandari B., 2005
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase HP-5MSHP-5MSDB-5DB-1DB-1
Column length (m) 30.30.30.60.30.
Carrier gas HeHeHeHeHe
Substrate      
Column diameter (mm) 0.250.250.250.250.25
Phase thickness (mum) 0.250.250.250.250.25
Tstart (C) 60.60.60.60.50.
Tend (C) 275.280.220.250.265.
Heat rate (K/min) 4.4.3.5.2.5
Initial hold (min)   4. 1.
Final hold (min)    10.20.
I 980.976.988.976.966.
ReferenceSajjadi and Ghannadi, 2005Sajjadi, 2005Salehi, Sefidkon, et al., 2005Salehi, Sonboli, et al., 2005Sarkhail, Amin, et al., 2005
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase DB-5HP-5MSDB-5MSDB-5DB-5
Column length (m) 30.30.30.30.30.
Carrier gas HeHeHeHeHe
Substrate      
Column diameter (mm) 0.250.250.250.250.25
Phase thickness (mum)  0.250.250.250.25
Tstart (C) 40.60.60.60.60.
Tend (C) 240.280.240.300.300.
Heat rate (K/min) 4.3.3.3.3.
Initial hold (min)  5.   
Final hold (min)      
I 980.981.980.970.970.
ReferenceSefidkon and Jamzad, 2005Setzer, Noletto, et al., 2005da Silva, Andrade, et al., 2005Simoes-Pires C.A., Debenedetti S., et al., 2005Simoes-Pires C.A., Debenedetti S., et al., 2005
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase DB-5PE-5DB-5HP-5MSRTX-1
Column length (m) 30.30.30.30.60.
Carrier gas HeH2HeHeHe
Substrate      
Column diameter (mm) 0.250.320.250.250.25
Phase thickness (mum) 0.250.250.250.250.25
Tstart (C) 60.60.60.60.60.
Tend (C) 300.230.230.280.250.
Heat rate (K/min) 3.5.3.3.5.
Initial hold (min)  2.   
Final hold (min)  4.20. 10.
I 971.988.979.973.978.
ReferenceSimoes-Pires C.A., Debenedetti S., et al., 2005Singh, Raina, et al., 2005Skoula and Grayer, 2005Slavkovska, Couladis, et al., 2005Sonboli A., Fakhari A.R., et al., 2005
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase RTX-1DB-1DB-5CP Sil 8 CBHP-5MS
Column length (m) 60.60.30.30.30.
Carrier gas HeHe HeHe
Substrate      
Column diameter (mm) 0.250.250.250.250.25
Phase thickness (mum) 0.250.250.25 0.25
Tstart (C) 60.60.40.60.50.
Tend (C) 25.250.210.290.240.
Heat rate (K/min) 5.5.2.3.3.
Initial hold (min)   2.5.3.
Final hold (min) 10.10.33.  
I 976.975.977.988.964.
ReferenceSonboli, Salehi, et al., 2005Sonboli, Salehi, et al., 2005, 2Stevanovic, Garneau, et al., 2005Suárez, Vásquez, et al., 2005Tepe B., Sokmen M., et al., 2005
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase HP-5 MSHP-5MSDB-5HP-5 MSDB-1
Column length (m) 30.30.30.30.50.
Carrier gas HeHeHeHeliumN2
Substrate      
Column diameter (mm) 0.250.250.320.250.25
Phase thickness (mum) 0.500.250.250.250.25
Tstart (C) 60.60.60.60.90.
Tend (C) 260.280.280.240.240.
Heat rate (K/min) 3.3.3.3.4.
Initial hold (min)      
Final hold (min) 20.    
I 986.958.957.979.964.
ReferenceTopçu, Barla, et al., 2005Tzakou, Bazos, et al., 2005Tzakou and Constantinidis, 2005Urdampilleta, Amat, et al., 2005Velasco-Negueruela, Pérez-Alonso, et al., 2005
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase DB-1HP-5MSSPB-1HP-5CP Sil 5 CB
Column length (m) 50.30.50.30.30.
Carrier gas   HeHeN2
Substrate      
Column diameter (mm) 0.250.250.20.320.25
Phase thickness (mum) 0.250.250.330.250.25
Tstart (C) 60.40.50.60.50.
Tend (C) 240.220.220.260.200.
Heat rate (K/min) 3.3.4.5.5.
Initial hold (min)  5.3.2. 
Final hold (min)  10.30.13. 
I 963.969.974.984.972.
ReferenceVelasco-Negueruela, Pérez-Alonso, et al., 2005, 2Vichi, Riu-Aumatell, et al., 2005Wong, Lee, et al., 2005Yayli, Yasar, et al., 2005Agnaniet, Menut, et al., 2004
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase DB-5BP-1SE-52DB-1SPB-5
Column length (m) 30.50.25.60.60.
Carrier gas He N2N2He
Substrate      
Column diameter (mm) 0.250.220.320.250.32
Phase thickness (mum) 0.250.250.150.251.
Tstart (C) 90.60.45.70.60.
Tend (C) 220.220.200.230.200.
Heat rate (K/min) 7.2.3.2.4.
Initial hold (min) 2. 5.2. 
Final hold (min) 5.20.30.20.30.
I 970.970.970.983.984.
ReferenceAgnihotri, Thappa, et al., 2004Blanc, Muselli, et al., 2004Cakir, Kordali, et al., 2004Choi, 2004Gauvin, Ravaomanarivo, et al., 2004
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase DB-1DB-5ZB-5DB-5RTX-1
Column length (m) 25.25.60.60.30.
Carrier gas  NitrogenHeHeN2
Substrate      
Column diameter (mm) 0.250.250.250.250.25
Phase thickness (mum) 0.250.250.250.250.25
Tstart (C) 60.60.40.40.60.
Tend (C) 180.240.260.280.300.
Heat rate (K/min) 3.3.6.4.4.
Initial hold (min) 10. 4.64. 
Final hold (min) 10. 1.  
I 979.982.990.976.974.
Referencebin Jantan, Ayop, et al., 2004JAvidnia, Mojab, et al., 2004Jürgens and Dötterl, 2004Kalvandi, Sefidkon, et al., 2004Kalemba and Thiem, 2004
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase SE-54HP-5MSDB-5MSDB-5RTX-1
Column length (m) 30.30.30.30.30.
Carrier gas HeHeHeHeN2
Substrate      
Column diameter (mm) 0.250.250.250.250.32
Phase thickness (mum) 0.250.250.250.250.25
Tstart (C) 60.50.60.60.60.
Tend (C) 260.230.240.300.300.
Heat rate (K/min) 2.5.3.3.4.
Initial hold (min) 5.2.   
Final hold (min)  10.   
I 977.967.980.974.971.
ReferenceKilic, Hafizoglu, et al., 2004Li and Jiang, 2004paz Lima, Silva, et al., 2004Limberger, Sobral, et al., 2004Lis, Boczek, et al., 2004
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase DB-5DB-5MSDB-5MSHP-5MSDB-5
Column length (m) 30.30.30.30.30.
Carrier gas  HeHeHe 
Substrate      
Column diameter (mm) 0.250.250.250.250.25
Phase thickness (mum) 0.250.250.250.250.15
Tstart (C) 40.60.60.60.60.
Tend (C) 210.280.280.275.220.
Heat rate (K/min) 2.3.3.4.3.
Initial hold (min) 2.   3.
Final hold (min) 33.30.30.  
I 977.953.950.981.970.
ReferenceLopez Arze, Collin, et al., 2004Marongiu, Piras, et al., 2004Marongiu, Porcedda, et al., 2004Mehrabani, Asadipour, et al., 2004Mevy, Bessiere, et al., 2004
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase HP-5MSNB-30NB-30DB-1DB-1
Column length (m) 30.50.50.50.50.
Carrier gas HeHeHeHeN2
Substrate      
Column diameter (mm) 0.250.20.20.220.25
Phase thickness (mum) 0.250.250.250.250.25
Tstart (C) 60.50.50.70.95.
Tend (C) 280.250.250.220.240.
Heat rate (K/min) 3.2.2.4.4.
Initial hold (min)      
Final hold (min)      
I 976.973.973.978.964.
ReferenceMimica-Dukic, Bozin, et al., 2004Orav, Stulova, et al., 2004Orav, Stulova, et al., 2004Palá-Paúl, García-Jiménez, et al., 2004Palá-Paúl, Velasco-Negueruela, et al., 2004
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase NB-30NB-30DB-1DB-5Methyl Silicone
Column length (m) 50.50.60.30.60.
Carrier gas HeHeHeHeHe
Substrate      
Column diameter (mm) 0.20.200.250.250.25
Phase thickness (mum) 0.250.250.250.250.25
Tstart (C) 50.50.50.35.60.
Tend (C) 250.250.250.220.200.
Heat rate (K/min) 2.2.4.2.54.
Initial hold (min)     1.
Final hold (min)    6.20.
I 971.970.967.979.970.
ReferenceRaal, Arak, et al., 2004Raal, Paaver, et al., 2004Rasooli and Razzaghi Abyaneh, 2004Rohloff, Mordal, et al., 2004Rojas, Usubillaga, et al., 2004
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase HP-5 MSHP-5MSHP-5MSDB-1DB-1
Column length (m) 30.30.30.30.60.
Carrier gas HeliumHeHeHe 
Substrate      
Column diameter (mm) 0.250.250.250.250.25
Phase thickness (mum) 0.250.250.250.250.25
Tstart (C) 60.60.60.50.70.
Tend (C) 200.280.280.265.230.
Heat rate (K/min) 4.4.4.2.52.
Initial hold (min) 1.  1.2.
Final hold (min) 20.  20.20.
I 970.987.981.966.983.
ReferenceRoyas, Usubillaga, et al., 2004Sadeghpour, Asghari, et al., 2004Sajjadi and Shahpiri, 2004Sarkhail, Amin, et al., 2004Sawamura, Son, et al., 2004
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase DB-1DB-5DB-1DB-5HP-5
Column length (m) 60.30.60.30.25.
Carrier gas Nitrogen HeHeN2
Substrate      
Column diameter (mm) 0.250.250.250.250.2
Phase thickness (mum) 0.250.250.250.250.5
Tstart (C) 70.50.40.40.30.
Tend (C) 230.250.280.250.280.
Heat rate (K/min) 2.3.4.2.3.
Initial hold (min) 2.5.5.5. 
Final hold (min)    20. 
I 983.980.975.978.982.
ReferenceSawamura, Sou, et al., 2004Sefidkon, Jamzad, et al., 2004Sefidkon and Shaabani, 2004Senatore, Rigano, et al., 2004Shafi, Nambiar, et al., 2004
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase HP-5DB-5CP Sil 5 CBDB-5BPX-5
Column length (m) 25.30.20.30.25.
Carrier gas H2 HeHeHe
Substrate      
Column diameter (mm) 0.320.250.250.250.22
Phase thickness (mum) 0.520.250.250.251.
Tstart (C) 40.60.100.60.60.
Tend (C) 240.300.270.300.250.
Heat rate (K/min) 4.3.8.3.3.
Initial hold (min)   2. 5.
Final hold (min)     10.
I 980.971.968.979.990.
ReferenceSimic, Sokovic, et al., 2004Suyenaga, Apel, et al., 2004Thappa, Bakshi, et al., 2004Tirillini, Pellegrino, et al., 2004Vilaseca, Guy, et al., 2004
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase CP Sil 8 CBCP Sil 8 CBDB-5DB-5HTHP-5MS
Column length (m) 30.30.30.27.30.
Carrier gas He HeHeHe
Substrate      
Column diameter (mm) 0.250.320.2490.250.25
Phase thickness (mum) 0.250.250.25 0.25
Tstart (C) 50.50.60.50.60.
Tend (C) 200.200.300.250.275.
Heat rate (K/min) 10.5.3.2.4.
Initial hold (min) 3.5. 2. 
Final hold (min) 2.  20. 
I 984.991.974.980.979.
ReferenceWang and Guo-Y. -L., 2004Wang, Guo, et al., 2004Woerdenbag, Windono, et al., 2004Yusufoglu, Celik, et al., 2004Afsharypuor and Jahromy, 2003
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase HP-5DB-1HP-5MSMethyl SiliconeDB-1
Column length (m) 30.60.30.12.560.
Carrier gas N2HeHeHeHe
Substrate      
Column diameter (mm) 0.250.250.250.250.25
Phase thickness (mum) 0.250.250.25  
Tstart (C) 60.70.60.50.50.
Tend (C) 220.230.280.270.250.
Heat rate (K/min) 5.2.3.4.4.
Initial hold (min) 10.2.   
Final hold (min)  20.   
I 984.983.980.978.976.
ReferenceBertoli, Menichini, et al., 2003Choi, 2003Couladis, Özcan, et al., 2003Curini, Bianchi, et al., 2003Dabiri and Sefidkon, 2003
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase RTX-5SilDB-5DB-5DB-5DB-5
Column length (m) 30.60.60.60.60.
Carrier gas HeHeHeHeHe
Substrate      
Column diameter (mm) 0.250.320.320.320.32
Phase thickness (mum) 0.25    
Tstart (C) 70.50.50.50.50.
Tend (C) 200.220.220.200.220.
Heat rate (K/min) 4.3.3.3.3.
Initial hold (min)      
Final hold (min) 10.    
I 981.979.979.979.979.
ReferenceDudai, Larkov, et al., 2003Edris and Farrag, 2003Edris and Farrag, 2003Edris, Shalaby, et al., 2003Edris, Shalaby, et al., 2003, 2
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase HP-5MSHP-1DB-1HP-5MSHP-5MS
Column length (m) 30.30.30.30.30.
Carrier gas HeHeN2HeHe
Substrate      
Column diameter (mm) 0.250.250.250.250.25
Phase thickness (mum) 0.250.250.250.250.25
Tstart (C) 60.70.50.60.60.
Tend (C) 220.200.200.275.280.
Heat rate (K/min) 5.10.5.4.4.
Initial hold (min) 20.    
Final hold (min) 20.    
I 984.974.959.978.980.
ReferenceFeizbaksh, Saber Tehrani, et al., 2003Fekam Boyom, Amvam Zollo, et al., 2003Fekam Boyom, Ngouana, et al., 2003Ghannadi, Aghazari, et al., 2003Ghasemi, Asghari, et al., 2003
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase HP-5MSMethyl SiliconeRSL-200RSL-200RSL-200
Column length (m) 30.30.30.30.30.
Carrier gas HeHeH2H2H2
Substrate      
Column diameter (mm) 0.250.320.320.250.32
Phase thickness (mum) 0.250.250.250.250.25
Tstart (C) 60.60.40.40.40.
Tend (C) 275.250.280.280.280.
Heat rate (K/min) 4.2.6.6.6.
Initial hold (min)  2.5.2.5.
Final hold (min)  5.5.10.5.
I 977.950.971.981.981.
ReferenceHajhashemi, Ghannadi, et al., 2003Jayaprakasha, Rao, et al., 2003Jirovetz, Buchbauer, et al., 2003Jirovetz, Buchbauer, et al., 2003, 2Jirovetz, Buchbauer, et al., 2003, 3
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase SE-30CP Sil 5 CBDB-5DB-1DB-5MS
Column length (m) 12.25.30.30.30.
Carrier gas HeHeHeN2He
Substrate      
Column diameter (mm) 0.220.250.250.250.25
Phase thickness (mum) 0.30.250.250.250.25
Tstart (C) 70.35.60.80.60.
Tend (C) 220.280.280.250.240.
Heat rate (K/min) 3.5.5.4.3.
Initial hold (min)  2.5   
Final hold (min)      
I 971.967.974.965.979.
ReferenceKambouche and El-Abed, 2003Kanjilal, Kotoky, et al., 2003Lago, de Ávila, et al., 2003Mahalwal and Ali, 2003Maia, Taveira, et al., 2003
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase DB-5DB-5CP Sil 5 CBZB-1DB-1
Column length (m) 30.50.25.30.60.
Carrier gas HeHe N2He
Substrate      
Column diameter (mm) 0.250.20.250.250.25
Phase thickness (mum) 0.250.250.390.250.25
Tstart (C) 60.50.60.45.50.
Tend (C) 280.220.220.230.270.
Heat rate (K/min) 3.3.5.3.4.
Initial hold (min)  2.   
Final hold (min) 30.    
I 973.975.976.966.977.
ReferenceMarongiu, Porcedda, et al., 2003Masotti, Juteau, et al., 2003Mazloomifar, Saber-Tehrani, et al., 2003Mierendorff, Stahl-Biskup, et al., 2003Mirza, Nik, et al., 2003
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase HP-5OV-101CP Sil 5 CBDB-1DB-5
Column length (m) 30.50.25.50.30.
Carrier gas HeliumHeH2N2H2
Substrate      
Column diameter (mm) 0.320.20.250.250.25
Phase thickness (mum)  0.50.150.250.25
Tstart (C) 70.50.50.95.60.
Tend (C) 210.250.230.240.280.
Heat rate (K/min) 2.2.3.4.4.
Initial hold (min)     10.
Final hold (min) 60.   40.
I 980.967.969.983.977.
ReferenceMookdasanit, Tamura, et al., 2003Orav, Kailas, et al., 2003Oyedeji, Ekundayo, et al., 2003Perez-Alonso, Velasco-Negueruela, et al., 2003Pino, Marbot, et al., 2003
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase HP-5DB-1DB-5DB-1DB-1
Column length (m) 30.60.30.60.60.
Carrier gas HeHeHeHeHe
Substrate      
Column diameter (mm) 0.250.250.20.250.25
Phase thickness (mum) 0.250.250.250.250.25
Tstart (C) 60.50.75.40.40.
Tend (C) 280.250.220.220.220.
Heat rate (K/min) 3.4.3.4.4.
Initial hold (min)   4.  
Final hold (min)      
I 962.976.979.968.983.
ReferencePitarokili, Tzakou, et al., 2003Pourmortazavi, Sefidkon, et al., 2003Priestap, van Baren, et al., 2003Rasooli and Mirmostafa, 2003Rasooli and Mirmostafa, 2003
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase DB-5HP-5MSHP-5HP-5Methyl Silicone
Column length (m) 30.30.30.30. 
Carrier gas N2HeHeHeHe
Substrate      
Column diameter (mm) 0.250.250.250.25 
Phase thickness (mum) 0.250.250.250.25 
Tstart (C) 40.60.60.60.35.
Tend (C) 230.275.280.280.180.
Heat rate (K/min) 2.4.4.4.4.
Initial hold (min)      
Final hold (min)      
I 980.979.979.978.956.
ReferenceRotman, Ahumada, et al., 2003Sadraei, Ghannadi, et al., 2003Sajjadi and Mehregan, 2003Sajjadi and Mehregan, 2003, 2Santos and Cordeiro, 2003
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase DB-1DB-5DB-1DB-5HP-5
Column length (m) 60.30.60.30.60.
Carrier gas He HeHe 
Substrate      
Column diameter (mm) 0.250.250.250.250.25
Phase thickness (mum) 0.250.250.250.250.25
Tstart (C) 40.40.50.60.40.
Tend (C) 260.260.280.240.250.
Heat rate (K/min) 4.2.4.3.5.
Initial hold (min) 5.5.  15.
Final hold (min)      
I 975.979.976.978.982.
ReferenceSefidkon, Naderi Nik, et al., 2003Senatore and Bruno, 2003Shahmir, Ahmadi, et al., 2003da Silva, Luz, et al., 2003Stashenko, Jaramillo, et al., 2003
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase CP Sil 5 CBDB-5MSDB-1DB-1HP-1
Column length (m) 25.30.60.60.50.
Carrier gas  HeN2N2He
Substrate      
Column diameter (mm) 0.250.250.250.250.2
Phase thickness (mum) 0.150.250.250.250.5
Tstart (C) 50.60.70.70.60.
Tend (C) 230.240.230.230.220.
Heat rate (K/min) 3.3.2.2.2.
Initial hold (min)   2.2. 
Final hold (min)   20.20.40.
I 977.978.972.978.971.
ReferenceTaiwo and Bolanle, 2003Taveira, de Lima, et al., 2003Tu, Onishi, et al., 2003Tu, Onishi, et al., 2003, 2Valette, Fernandez, et al., 2003
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase DB-1Cross-Linked MethylsiliconeHP-5HP-5HP-5
Column length (m) 50.25.25.25.25.
Carrier gas N2HeH2H2Helium
Substrate      
Column diameter (mm) 0.250.20.320.320.32
Phase thickness (mum) 0.250.330.530.530.53
Tstart (C) 90.70.40.40.40.
Tend (C) 240.250.280.280.280.
Heat rate (K/min) 4.4.4.4.4.
Initial hold (min)      
Final hold (min)      
I 949.964.976.979.970.
ReferenceVelasco-Negueruela, Pérez-Alonso, et al., 2003Velasco-Negueruela, Pérez-Alonso, et al., 2003, 2Velickovic, Randjelovic, et al., 2003Velickovic, Randjelovic, et al., 2003Velickovic, Ristic, et al., 2003
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase HP-5HP-5DB-5DB-5DB-1
Column length (m) 25.30.30.25.60.
Carrier gas HeliumHeHeN2He
Substrate      
Column diameter (mm) 0.320.250.250.250.25
Phase thickness (mum) 0.530.320.250.250.25
Tstart (C) 40.60.60.50.50.
Tend (C) 280.250.240.250.280.
Heat rate (K/min) 4.5.3.4.4.
Initial hold (min)  30.   
Final hold (min)    10. 
I 979.990.978.980.977.
ReferenceVelickovic, Ristic, et al., 2003Yassa, Akhani, et al., 2003Zoghbi, Andrade, et al., 2003Zrira, Elamrani, et al., 2003Ahmadi, Mirza, et al., 2002
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase DB-1DB-5OV-101DB-5HP-1
Column length (m) 60.30.25.30.30.
Carrier gas HeHe HeHe
Substrate      
Column diameter (mm) 0.250.2490.320.250.25
Phase thickness (mum) 0.250.25 0.250.25
Tstart (C) 60.60.50.60.70.
Tend (C) 220.300.200.280.220.
Heat rate (K/min) 4.3.5.3.3.
Initial hold (min)      
Final hold (min)  5. 30.15.
I 976.975.974.973.970.
ReferenceBaher, Mirza, et al., 2002Bos, Koulman, et al., 2002Boyom, Keumedjio, et al., 2002Caredda, Marongiu, et al., 2002Cavaleiro, Salgueiro, et al., 2002
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase 5 % Phenyl methyl siloxaneDB-1DB-5MSDB-5MSDB-5
Column length (m) 30.60.30.30.30.
Carrier gas HeHeHeHeN2
Substrate      
Column diameter (mm) 0.250.320.250.250.25
Phase thickness (mum) 0.250.250.250.250.25
Tstart (C) 75.50.60.60.50.
Tend (C) 200.200.280.280.250.
Heat rate (K/min) 3.3.3.3.4.
Initial hold (min) 4.6.   
Final hold (min) 8.    
I 979.973.986.986.980.
ReferenceCicció and Gómez-Laurito, 2002Cimanga, Apers, et al., 2002Congiu, Falconieri, et al., 2002Congiu, Falconieri, et al., 2002Farah, Fechtal, et al., 2002
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase HP-5DB-5DB-1HP-5PTE-5
Column length (m) 30.30.30.30.60.
Carrier gas N2HeH2HeH2
Substrate      
Column diameter (mm) 0.250.250.320.250.32
Phase thickness (mum) 0.250.250.250.250.30
Tstart (C) 50.60.40.60.60.
Tend (C) 250.240.245.275.285.
Heat rate (K/min) 4.3.3.4.4.3
Initial hold (min) 5. 20.  
Final hold (min)      
I 980.982.956.974.980.
ReferenceFarah, Fechtal. M., et al., 2002Flamini, Ertugrul, et al., 2002Gancel, Ollé, et al., 2002Ghannadi, Sajjadi, et al., 2002Gudzic, Djokovic, et al., 2002
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase SE-30HP-5RSL-200RSL-200CP Sil 8 CB
Column length (m) 50.30.30.30.30.
Carrier gas He H2H2He
Substrate      
Column diameter (mm) 0.250.250.320.320.25
Phase thickness (mum) 0.25 0.250.250.25
Tstart (C) 70.50.40.50.50.
Tend (C) 240.200.280.280.220.
Heat rate (K/min) 4.3.6.6.3.
Initial hold (min)   5.5.2.
Final hold (min)   5.5. 
I 984.979.981.981.976.
ReferenceIñigo, Palá-Paúl, et al., 2002Isidorov and Jdanova, 2002Jirovetz, Buchbauer, et al., 2002Jirovetz, Ngassoum, et al., 2002Juteau, Masotti, et al., 2002
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase DB-1SPB-5DB-5DB-5DB-5
Column length (m) 25.60.30.30.30.
Carrier gas HeHeHeHeHe
Substrate      
Column diameter (mm) 0.230.250.250.250.25
Phase thickness (mum) 0.200.250.250.250.25
Tstart (C) 50.50.60.35.35.
Tend (C) 200.240.240.280.280.
Heat rate (K/min) 3.5.3.3.4.
Initial hold (min) 3.3. 2.2.
Final hold (min) 30.10. 15.15.
I 981.987.981.977.976.
ReferenceKhallouki, Younos, et al., 2002Kim and Lee, 2002Kobaisy, Tellez, et al., 2002Krauze-Baranowska, Mardarowicz, et al., 2002Krauze-Baranowska, Mardarowicz, et al., 2002, 2
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase OV-101DB-5DB-5HP-5DB-5
Column length (m) 25.30.30.30.25.
Carrier gas HeHeHe N2
Substrate      
Column diameter (mm) 0.320.250.320.250.23
Phase thickness (mum)  0.250.250.250.15
Tstart (C) 50.60.40.60.50.
Tend (C) 200.250.290.275.250.
Heat rate (K/min) 5.3.7.4.3.
Initial hold (min)    4. 
Final hold (min)      
I 974.971.978.971.980.
ReferenceKuiate, Bessière, et al., 2002Limberger, Simões-Pires, et al., 2002Lin, Rouseff, et al., 2002Lockwood, Asghari, et al., 2002Mahmout, Bessière, et al., 2002
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase DB-5DB-5MSOV-101CP Sil 5 CBCP Sil 5 CB
Column length (m) 30.30.25.25.25.
Carrier gas HeHeHeHeHe
Substrate      
Column diameter (mm) 0.250.250.320.250.25
Phase thickness (mum) 0.250.25 0.39 
Tstart (C) 60.60.50.60.60.
Tend (C) 240.240.200.220.220.
Heat rate (K/min) 3.3.5.5.5.
Initial hold (min)      
Final hold (min)      
I 977.979.971.969.976.
ReferenceMaia, da Silva, et al., 2002Maia, Zoghbi, et al., 2002Menut, Bessière, et al., 2002Mojab, Rustaiyan, et al., 2002Monfared, Davarani, et al., 2002
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase HP-5HP-5OV-101OV-101DB-1
Column length (m) 30.30.50.50.50.
Carrier gas   HeHeN2
Substrate      
Column diameter (mm) 0.250.250.20.20.25
Phase thickness (mum) 0.250.250.50.50.25
Tstart (C) 60.60.50.50.80.
Tend (C) 240.240.250.250.225.
Heat rate (K/min) 3.3.2.2.4.
Initial hold (min)      
Final hold (min)      
I 976.981.967.967.967.
ReferenceNovak, Langbehn, et al., 2002Novak, Langbehn, et al., 2002Orav, Kailas, et al., 2002Orav, Kailas, et al., 2002Palá-Paúl, Pérez-Alonso, et al., 2002
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase DB-5MSSPB-5HP-1DB-5DB-5
Column length (m) 30.30.50.30.25.
Carrier gas HeHeliumN2HeHe
Substrate      
Column diameter (mm) 0.320.250.250.250.2
Phase thickness (mum) 0.250.250.250.25 
Tstart (C) 40.60.90.60.60.
Tend (C) 280.250.220.300.220.
Heat rate (K/min) 4.4.3.2.3.
Initial hold (min)  2.   
Final hold (min) 5.20.   
I 977.979.971.973.975.
ReferencePhutdhawong, Korth, et al., 2002Pino, Marbot, et al., 2002Priestap, van Baren, et al., 2002Ruberto, Biondi, et al., 2002Schwob, Bessière, et al., 2002
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase DB-1DB-1DB-1DB-1DB-1
Column length (m) 60.60.60.50.50.
Carrier gas HeHeHeN2N2
Substrate      
Column diameter (mm) 0.250.250.250.250.25
Phase thickness (mum)  0.250.250.250.25
Tstart (C) 40.40.40.95.60.
Tend (C) 250.280.280.240.240.
Heat rate (K/min) 4.4.4.4.3.
Initial hold (min)  5.5.  
Final hold (min)      
I 974.977.978.964.963.
ReferenceSefidkon, Dabiri, et al., 2002Sefidkon, Jalili, et al., 2002Sefidkon, 2002Velasco-Negueruela, Pérez-Alonso, et al., 2002Velasco-Negueruela, Pérez-Alonso, et al., 2002, 2
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase HP-5DB-1DB-5MSDB-5DB-1
Column length (m) 30.60.30.30.60.
Carrier gas H2HeHeHeN2
Substrate      
Column diameter (mm) 0.250.250.250.250.248
Phase thickness (mum) 0.250.250.250.250.25
Tstart (C) 40.50.60.60.60.
Tend (C) 280.250.270.240.220.
Heat rate (K/min) 4.4.3.3.3.
Initial hold (min)  5.  5.
Final hold (min)     22.
I 980.974.976.982.970.
ReferenceVelickovic, Randjelovic, et al., 2002Yamini, Sefidkon, et al., 2002Zoghbi, Andrade, et al., 2002Zoghbi, Andrade, et al., 2002, 2Bailac, Dellacasa, et al., 2001
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase DB-5MSSPB-5DB-1DB-1DB-5MS
Column length (m) 30.60.60.60.60.
Carrier gas HeHeHeHeHe
Substrate      
Column diameter (mm) 0.250.320.250.250.25
Phase thickness (mum) 0.25 0.250.250.25
Tstart (C) 60.40.40.40.35.
Tend (C) 240.220.280.280.250.
Heat rate (K/min) 3.3.4.4.3.
Initial hold (min)  5.5.5.5.
Final hold (min)  15.   
I 975.976.962.966.982.
ReferenceCherchi, Deidda, et al., 2001Cornu, Carnat, et al., 2001Dabiri and Sefidkon, 2001Dabiri and Sefidkon, 2001Fernando and Grün, 2001
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase HP-5OV-1HP-5Optima-5RTX-1
Column length (m) 30.30.30.30.30.
Carrier gas N2H2N2HeN2
Substrate      
Column diameter (mm) 0.250.320.250.20.25
Phase thickness (mum) 0.250.30.25 0.25
Tstart (C) 60.50.60.50.60.
Tend (C) 220.250.220.250.300.
Heat rate (K/min) 5.3.5.3.4.
Initial hold (min) 10.1.10.3. 
Final hold (min)  20.   
I 981.968.982.970.973.
ReferenceFlamini, Cioni, et al., 2001Gallori, Bilia, et al., 2001Gallori, Flamini, et al., 2001Jacquemond-Collet, Bessière, et al., 2001Kalemba, Marschall, et al., 2001
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase SPB-5BP-1CBP-1DB-5MSDB-5MS
Column length (m) 60.50.25.30.30.
Carrier gas HeliumHeNitrogenHeHe
Substrate      
Column diameter (mm) 0.250.220.250.250.25
Phase thickness (mum) 0.250.250.250.250.25
Tstart (C) 50.60.50.60.60.
Tend (C) 240.230.210.240.240.
Heat rate (K/min) 3.2.3.3.3.
Initial hold (min) 3. 2.  
Final hold (min) 10.35. 30.30.
I 987.971.969.957.968.
ReferenceKim and Lee, 2001Lota, de Rocca Serra, et al., 2001Ly, Yamauchi, et al., 2001Marongiu, Porcedda, et al., 2001Marongiu, Porcedda, et al., 2001
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase DB-1OV-101OV-101DB-1DB-5
Column length (m) 60.50.50.30.60.
Carrier gas HeHeHeN2He
Substrate      
Column diameter (mm) 0.250.20.20.250.25
Phase thickness (mum) 0.25  0.25 
Tstart (C) 50.50.50.80.50.
Tend (C) 270.250.250.225.250.
Heat rate (K/min) 4.2.2.4.3.
Initial hold (min)     5.
Final hold (min)      
I 976.968.968.965.981.
ReferenceMirza, Ahmadi, et al., 2001Orav and Kann, 2001Orav and Kann, 2001Palá-Paúl, Pérez-Alonso, et al., 2001Rousis, Papadogianni, et al., 2001
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase DB-5DB-1CP Sil 5 CBCP-Sil 5 CBHP-5 MS
Column length (m) 30.30.25.25.30.
Carrier gas H2HeHeNitrogenHelium
Substrate      
Column diameter (mm) 0.250.20.250.250.25
Phase thickness (mum) 0.25 0.390.390.25
Tstart (C) 60.60.60.60.50.
Tend (C) 285.240.220.220.250.
Heat rate (K/min) 3.3.5.5.5.
Initial hold (min)     2.
Final hold (min)     5.
I 974.973.0977.977.979.
ReferenceSantos-Gomes and Fernandes-Ferreira, 2001Santos, Moreira, et al., 2001Sayyah, Kamalinejad, et al., 2001Sayyah, Kamalinejad, et al., 2001, 2Shang, Hu, et al., 2001
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase DB-5SPB-1OV-101OV-101CP Sil 5 CB
Column length (m) 30.30.50.50.25.
Carrier gas HeHeN2N2 
Substrate      
Column diameter (mm) 0.250.320.250.250.25
Phase thickness (mum) 0.250.25  0.15
Tstart (C) 60.50.80.80.50.
Tend (C) 240.250.200.200.230.
Heat rate (K/min) 3.2.2.2.3.
Initial hold (min)      
Final hold (min)      
I 980.966.980.980.968.
ReferenceTellez M., Estell R., et al., 2001Vijayanand, Rao, et al., 2001Yang, 2001Yang, 2001, 2Asekun and Ekundayo, 2000
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase DB-1CP Sil 5 CBSPB-1RSL-200SPB-5
Column length (m) 60.25.30.60.60.
Carrier gas N2HeHeH2He
Substrate      
Column diameter (mm) 0.250.250.20.320.25
Phase thickness (mum) 0.250.40.20.250.25
Tstart (C) 60.60.80.40.70.
Tend (C) 220.260.300.250.240.
Heat rate (K/min) 3.5.5.6.5.
Initial hold (min) 5.40.3. 8.
Final hold (min) 22.   20.
I 977.968.981.978.986.
ReferenceBailac, Dellacasa, et al., 2000Baser, Özek, et al., 2000Fraternale, Giamperi, et al., 2000Jirovetz, Puschmann, et al., 2000Kim, Kim, et al., 2000
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase HP-5DB-1DB-5BP-1HP-5
Column length (m) 30.25.30.25.30.
Carrier gas HeNitrogenN2N2He
Substrate      
Column diameter (mm) 0.250.500.220.330.25
Phase thickness (mum)  0.250.251.00.25
Tstart (C) 80.60.70.60.60.
Tend (C) 200.220.230.275.275.
Heat rate (K/min) 9.5.4.4.4.
Initial hold (min)   2.  
Final hold (min) 10. 20.  
I 982.974.978.980.978.
ReferenceLis-Balchin and Roth, 2000Mallavarapu, Rao, et al., 2000Mitiku, Sawamura, et al., 2000Mohagheghzadeh, Shams-Ardakani, et al., 2000Mohagheghzadeh, Shams-Ardakani, et al., 2000, 2
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase HP-5OV-101DB-5SE-30OV-101
Column length (m) 30.50.30.25.25.
Carrier gas HeNitrogenHeHeN2
Substrate      
Column diameter (mm) 0.250.250.250.20.25
Phase thickness (mum) 0.25 0.25  
Tstart (C) 40.40.60.60.50.
Tend (C) 240.200.240.230.200.
Heat rate (K/min) 3.2.3.3.5.
Initial hold (min) 5.10.   
Final hold (min)      
I 982.980.981.966.975.
ReferenceNovak, Novak, et al., 2000Tamura, Boonbumrung, et al., 2000Tellez, Dayan, et al., 2000Ali N.A.M. and Jantan, 1999Ayedoun, Adéoti, et al., 1999
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase Methyl SiliconeOV-1SPB-1DB-1SE-30
Column length (m) 60.25.50.60.30.
Carrier gas  Hydrogen HeN2
Substrate      
Column diameter (mm) 0.250.320.20.250.25
Phase thickness (mum) 0.250.300.330.250.25
Tstart (C) 40.50.60.50.60.
Tend (C) 220.200.260.230.220.
Heat rate (K/min) 5.3.4.4.4.
Initial hold (min) 10.1.  10.
Final hold (min)  10.   
I 970.68959.971.976.970.
ReferenceBaraldi, Rapparini, et al., 1999Bicchi, Binello, et al., 1999Choo, Wong, et al., 1999Eikani, Goodarznia, et al., 1999Jassbi, Ahmad, et al., 1999
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase RTX-1DB-1OV-101CBP-1OV-101
Column length (m) 30.25.25.25.50.
Carrier gas N2He HeN2
Substrate      
Column diameter (mm) 0.250.250.320.30.2
Phase thickness (mum) 0.250.25   
Tstart (C) 60.50.50.60.80.
Tend (C) 300.290.200.240.200.
Heat rate (K/min) 4.4.5.4.1.
Initial hold (min)      
Final hold (min)     20.
I 974.975.974.980.980.
ReferenceKalemba, 1999Koulman, 1999Kuiate, Zollo, et al., 1999Labuckas, Zygadlo, et al., 1999Menon, Chacko, et al., 1999
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase DB-5SE-30DB-1OV-1CP Sil 5 CB
Column length (m) 30.25.30.25.25.
Carrier gas  HeHeH2He
Substrate      
Column diameter (mm) 0.320.20.250.250.25
Phase thickness (mum) 1. 0.250.25 
Tstart (C) 40.60.50.40.50.
Tend (C) 200.230.200.220.230.
Heat rate (K/min) 3.3.4.3.3.
Initial hold (min) 5.10. 5. 
Final hold (min)    5. 
I 977.966.974.965.972.
ReferenceMeynier, Novelli, et al., 1999Mohd and Jantan, 1999Nori-Shargh, Norouzi-Arasi, et al., 1999Oberhofer, Nikiforov, et al., 1999Oyedeji, Olawore, et al., 1999
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase DB-1OV-101DB-5BP-1CP Sil 5 CB
Column length (m) 50.50.30.25.25.
Carrier gas HeHeHeN2He
Substrate      
Column diameter (mm) 0.250.250.250.50.25
Phase thickness (mum) 0.250.250.25 0.39
Tstart (C) 70.70.40.60.60.
Tend (C) 240.220.250.220.220.
Heat rate (K/min) 4.2.2.5.5.
Initial hold (min)  5.5. 5.
Final hold (min)   60.10.20.
I 966.969.952.973.976.
ReferencePalá-Paúl, Pérez-Alonso, et al., 1999Pateira, Nogueira, et al., 1999Porta, Porcedda, et al., 1999Rao, Bhattacharya, et al., 1999Rustaiyan, Masoudi, et al., 1999
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase CP Sil 5 CBDB-1DB-5DB-1DB-1
Column length (m) 25.60.30.60.60.
Carrier gas N2HeHeHeHe
Substrate      
Column diameter (mm) 0.250.250.250.250.32
Phase thickness (mum) 0.390.250.250.25 
Tstart (C) 60.40.40.50.60.
Tend (C) 220.280.220.220.230.
Heat rate (K/min) 5.4.4.4.3.
Initial hold (min)  5.5.  
Final hold (min)     5.
I 976.981.973.977.974.
ReferenceRustaiyan and Nadji, 1999Sefidkon, Dabiri, et al., 1999Sefidkon and Khajavi, 1999Sefidkon and Mirza, 1999Shafiee, Javidnia, et al., 1999
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase DB-5DB-5OV-101SPB-5CP Sil 5 CB
Column length (m) 30.30.25.60.25.
Carrier gas H2HeNitrogenHeN2
Substrate      
Column diameter (mm) 0.320.250.200.32 
Phase thickness (mum)  0.25 1.0.39
Tstart (C) 32.60.60.40.60.
Tend (C) 260.240.220.200.220.
Heat rate (K/min) 7.3.4.3.5.
Initial hold (min) 5. 0.5. 
Final hold (min) 5. 0.2. 
I 980.981.973.987.977.
ReferenceSun and Petracek, 1999Tellez, Canel, et al., 1999Tropnikova, Zenkevich, et al., 1999Viallon C., Verdier-Metz I., et al., 1999Weyerstahl, Marschall, et al., 1999
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase OV-101DB-5DB-5MSSPB-5DB-5
Column length (m) 25.30.30.50.30.
Carrier gas HeHeHeHeHe
Substrate      
Column diameter (mm) 0.200.250.250.320.25
Phase thickness (mum)  0.250.250.250.25
Tstart (C) 80.60.60.60.60.
Tend (C) 240.240.240.240.240.
Heat rate (K/min) 6.3.3.3.3.
Initial hold (min)      
Final hold (min)    20. 
I 970.978.978.980.974.
ReferenceZenkevich, Kosman, et al., 1999Zoghbi, Andrade, et al., 1999Zoghbi, Andrade, et al., 1999, 2Doneanu and Anitescu, 1998El-Sakhawy, El-Tantawy, et al., 1998
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase SE-30OV-1DB-5HP-101HP-5
Column length (m) 25.50.30.25.25.
Carrier gas HeHeHeHeHe
Substrate      
Column diameter (mm) 0.20.320.250.20.2
Phase thickness (mum)  0.250.250.20.33
Tstart (C) 60.50.60.70.70.
Tend (C) 180.250.240.200.290.
Heat rate (K/min) 3.10.3.3.3.
Initial hold (min) 10.5. 2.8.
Final hold (min)  20. 10.20.
I 974.974.978.973.976.
ReferenceJantan, Ahmad, et al., 1998Kökdil, Kurucu, et al., 1998Maia, Zohhbi, et al., 1998Milso, Mastelic, et al., 1998Poiana, Sicari, et al., 1998
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase HP-1OV-101CP Sil 5 CBCP Sil 5 CBCP Sil 5 CB
Column length (m) 60.25.25.25.25.
Carrier gas He N2N2He
Substrate      
Column diameter (mm) 0.250.320.320.320.25
Phase thickness (mum) 0.25 0.250.250.25
Tstart (C) 50.50.50.50.60.
Tend (C) 280.200.290.290.300.
Heat rate (K/min) 4.5.4.4.6.
Initial hold (min) 5.    
Final hold (min)      
I 965.975.964.964.964.
ReferenceStashenko, Cervantes, et al., 1998Zollo, Biyiti, et al., 1998Bos, Woerdenbag, et al., 1997Bos, Woerdenbag, et al., 1997Bos, Woerdenbag, et al., 1997, 2
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase OV-1OV-1SPB-SulfurSPB-SulfurDB-5
Column length (m) 30.30.30.30.30.
Carrier gas He HeHeHe
Substrate      
Column diameter (mm) 0.320.320.320.320.25
Phase thickness (mum) 0.250.254.4.0.25
Tstart (C) 40.40.45.45.50.
Tend (C) 270.270.240.240.250.
Heat rate (K/min) 2.2.5.5.2.
Initial hold (min) 4.4.13.13.5.
Final hold (min)   5.5. 
I 970.967.991.992.968.
ReferenceKökdil, Kurucu, et al., 1997Kökdil, Tanker, et al., 1997Mariaca, Berger, et al., 1997Mariaca, Berger, et al., 1997Reverchon, Porta, et al., 1997
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase DB-1DB-5DB-5CBP-1HP-1
Column length (m)  30.30.25.23.
Carrier gas  HeliumHeHeHe
Substrate      
Column diameter (mm)  0.250.250.220.32
Phase thickness (mum)  0.25  0.17
Tstart (C) 80.60.60.60.60.
Tend (C) 220.240.240.240.250.
Heat rate (K/min) 6.3.4.5.5.
Initial hold (min)     3.
Final hold (min)     30.
I 963.980.980.978.967.
ReferenceSalgueiro, Vila, et al., 1997Tellez, Estell, et al., 1997Zunino, Novillo-Newton, et al., 1997Zygadlo, Ariza-Espinar, et al., 1997Ayedoun, Adeoti, et al., 1996
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase OV-101HP-1OV-101DB-1DB-5
Column length (m) 50.30.50.60.30.
Carrier gas N2N2HeHe 
Substrate      
Column diameter (mm) 0.250.530.250.320.25
Phase thickness (mum) 0.170.88 0.50 
Tstart (C) 50.60.50.50.40.
Tend (C) 220.300.250.250.210.
Heat rate (K/min) 5.8.2.8.2.
Initial hold (min)    1.2.
Final hold (min)  15. 6.33.
I 983.961.967.975.977.
ReferenceChacko, Jayalekshmy, et al., 1996Malizia, Molli, et al., 1996Orav, Kailas, et al., 1996Sagrero-Nieves and Bartley, 1996Sohounhloue, Dangou, et al., 1996
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase DB-1HP-1HP-5OV-101DB-1
Column length (m) 60.25. 50.60.
Carrier gas HeHelium HeHe
Substrate      
Column diameter (mm) 0.250.32 0.20.25
Phase thickness (mum) 0.250.25 0.50.25
Tstart (C) 50.60.35.70.50.
Tend (C) 250.220.200.180.250.
Heat rate (K/min) 2.54.6.1.3.5
Initial hold (min) 5.2.2. 5.
Final hold (min)  20.   
I 981.967.989.967.968.
ReferenceStashenko, Puertas, et al., 1996Thanh, Dung, et al., 1996Larsen and Frisvad, 1995Orav, Kuningas, et al., 1995Stashenko, Torres, et al., 1995
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase DB-1DB-1OV-1DB-1HP-5
Column length (m) 60.60.50.60. 
Carrier gas HeHeN2  
Substrate      
Column diameter (mm) 0.250.250.270.32 
Phase thickness (mum) 0.250.250.20.50 
Tstart (C) 70.70.80.50.40.
Tend (C) 270.270.240.225.210.
Heat rate (K/min) 2.52.53.2.2.
Initial hold (min) 5.5.   
Final hold (min)      
I 973.973.975.983.976.
ReferenceTirado, Stashenko, et al., 1995Tirado, Stashenko, et al., 1995Ramanoelina, Viano, et al., 1994Sagrero-Nieves, Bartley, et al., 1994Collin, Deslauriers, et al., 1993
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase HP-5Methyl SiliconeMethyl SiliconeCP Sil 5 CBMethyl Silicone
Column length (m)  50.50.25.25.
Carrier gas  N2N2  
Substrate      
Column diameter (mm)  0.250.250.250.50
Phase thickness (mum)  0.170.17  
Tstart (C) 40.80.80.60.60.
Tend (C) 210.200.200.280.220.
Heat rate (K/min) 2.2.3.5.5.
Initial hold (min)      
Final hold (min)      
I 976.981.981.975.977.
ReferenceCollin, Deslauriers, et al., 1993Gopalakrishnan, Menon, et al., 1993Gopalakrishnan, Menon, et al., 1993Kaul, Singh, et al., 1993Mallavarapu, Ramesh, et al., 1993
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase OV-101DB-1SPB-5SE-54DB-1
Column length (m) 54.60.30.30.30.
Carrier gas HeHe HydrogenN2
Substrate      
Column diameter (mm) 0.260.32 0.25 
Phase thickness (mum)  1.21.00.25 
Tstart (C) 50.30.50.60.80.
Tend (C) 230.240.250.250.220.
Heat rate (K/min) 3.3.8.2.4.
Initial hold (min)  10. 5. 
Final hold (min)    2. 
I 975.980.977.975.969.
ReferenceZenkevich and Kulikova, 1993Ciccioli, Cecinato, et al., 1992King and Knight, 1992Kollmannsberger, Nitz, et al., 1992Velasco-Negueruela, Pérez Alonso, et al., 1991
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase CP Sil 8 CBBP-1OV-101OV-101BP-1
Column length (m) 25.25.50.50.50.
Carrier gas   N2N2H2
Substrate      
Column diameter (mm) 0.200.330.250.250.30
Phase thickness (mum)      
Tstart (C) 60.45.80.80.40.
Tend (C) 230.180.200.200.250.
Heat rate (K/min) 3.3.2.2.10.
Initial hold (min) 10.3.  1.
Final hold (min)      
I 983.972.980.980.973.
ReferenceJantan and Goh, 1990Wyllie, Brophy, et al., 1990Yang and Sugisawa, 1990Yang and Sugisawa, 1990Brophy, Davies, et al., 1989
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase SE-30OV-101OV-101OV-1OV-1
Column length (m) 40.50.50.50.60.
Carrier gas HeN2N2HeHelium
Substrate      
Column diameter (mm) 0.500.250.250.200.50
Phase thickness (mum) 0.75  0.201.2
Tstart (C) 30.80.80.30.40.
Tend (C) 220.200.200.220.220.
Heat rate (K/min) 3.2.2.2.2.
Initial hold (min)      
Final hold (min)      
I 966.980.981.968.966.
Referencede Pooter, de Buyck, et al., 1989Sugisawa, Yang, et al., 1989Sugisawa, Yang, et al., 1989de Pooter, Nicolai, et al., 1988Wahab, Aboutabl, et al., 1987
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase OV-3OV-101OV-101DB-1OV-1
Column length (m) 150.50.50.10.40.
Carrier gas He  H2He
Substrate      
Column diameter (mm) 0.660.300.300.250.5
Phase thickness (mum)    0.250.75
Tstart (C) 30.40.40.50.30.
Tend (C) 170.230.230.250.220.
Heat rate (K/min) 1.3.53.55.3.
Initial hold (min)  5.5.  
Final hold (min)      
I 980.970.979.969.966.
ReferenceButtery, Flath, et al., 1986Nykanen, 1986Nykanen, 1986Perry, Baxter, et al., 1986de Pooter, de Buyck, et al., 1986
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase OV-1OV-101OV-101OV-101OV-101
Column length (m)  30.30.30.50.
Carrier gas HeHeHeHeHe
Substrate      
Column diameter (mm)  0.50.50.50.31
Phase thickness (mum)  0.80.80.8 
Tstart (C) 40.40.40.40.0.
Tend (C) 220.220.220.220.225.
Heat rate (K/min) 2.2.2.2.3.
Initial hold (min)     1.
Final hold (min)      
I 966.966.966.966.961.
ReferenceDe Pooter, De Buyck, et al., 1986De Pooter and Schamp, 1986De Pooter and Schamp, 1986De Pooter and Schamp, 1986del Rosario, de Lumen, et al., 1984
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase DB-1SE-30SE-30+IgepalSE-30+IgepalSF-96
Column length (m) 60.50.100.100.111.
Carrier gas  He  Nitrogen
Substrate      
Column diameter (mm) 0.320.50.250.250.76
Phase thickness (mum)      
Tstart (C) 50.40.70.70. 
Tend (C) 250.170.170.170.130.
Heat rate (K/min) 4.3.1.1.3.
Initial hold (min) 0.13.  8.
Final hold (min) 5.   40.
I 968.970.971.980.968.
ReferenceFlath, Mon, et al., 1983Heydanek and McGorrin, 1981Shibamoto and Jennings, 1977Shibamoto and Jennings, 1977Donetzhuber, Johansson, et al., 1976
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI

References

Go To: Top, Normal alkane RI, non-polar column, temperature ramp, Notes

Data compilation copyright by the U.S. Secretary of Commerce on behalf of the U.S.A. All rights reserved.

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Bendimerad, N.; Bendiab, S.A.T., Composition and antibacterial activity of Pseudocytisus integrifolius (Salisb.) essential oil from Algeria, J. Agric. Food Chem., 2005, 53, 8, 2947-2952, https://doi.org/10.1021/jf047937u . [all data]

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Chaverri, C.; Cicció, J.F., Essential oil of trees of the genus Ocotea (Lauraceae) in Costa Rica. I. Ocotea brenesii, Rev. Biol. Trop., 2005, 53, 3-4, 431-436, https://doi.org/10.15517/rbt.v53i3-4.14611 . [all data]

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