1-Octanol

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Van Den Dool and Kratz RI, polar column, temperature ramp

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Data compilation copyright by the U.S. Secretary of Commerce on behalf of the U.S.A. All rights reserved.

Data compiled by: NIST Mass Spectrometry Data Center, William E. Wallace, director

Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase DB-WaxDB-WaxDB-WaxDB-WaxZB-Wax
Column length (m) 60.30.30.30.30.
Carrier gas HeHeHeHeHe
Substrate      
Column diameter (mm) 0.250.320.250.320.32
Phase thickness (μm) 0.250.50.50.50.25
Tstart (C) 40.40.40.40.40.
Tend (C) 200.240.250.240.250.
Heat rate (K/min) 4.7.4.7.5.
Initial hold (min) 1. 5. 2.
Final hold (min) 10.5.15.5.5.
I 1546.1560.1569.1573.1556.
ReferenceCho I.H., Lee S.M., et al., 2007Mahattanatawee K., Perez-Cacho P.R., et al., 2007Pozo-Bayon M.A., Ruiz-Rodriguez A., et al., 2007Ruiz Perez-Cacho, Mahattanatawee, et al., 2007Wu, Zorn, et al., 2007
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase ZB-WaxDB-Wax EtrDB-WaxDB-WaxDB-Wax
Column length (m) 30.30.60.60.60.
Carrier gas HeHeHeHeHe
Substrate      
Column diameter (mm) 0.320.250.250.250.25
Phase thickness (μm) 0.250.250.250.250.25
Tstart (C) 40.40.40.40.40.
Tend (C) 250.250.200.200.200.
Heat rate (K/min) 5.5.4.4.4.
Initial hold (min) 2.3.1.1.1.
Final hold (min) 5.15.10.10.10.
I 1557.1561.1561.1566.1546.
ReferenceWu, Zorn, et al., 2007Aubert C. and Pitrat M., 2006Cho, Choi, et al., 2006Cho, Choi, et al., 2006Cho, Kim, et al., 2006
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase DB-WaxDB-WaxCP-Wax 52CBDB-WaxDB-Wax
Column length (m) 30.60.60.30.30.
Carrier gas HeHeHeHeHe
Substrate      
Column diameter (mm) 0.250.250.250.250.25
Phase thickness (μm) 0.250.250.250.50.25
Tstart (C) 50.40.40.50.40.
Tend (C) 230.265.250.260.250.
Heat rate (K/min) 10.7.4.4.3.
Initial hold (min) 5.    
Final hold (min) 25.5. 5.20.
I 1558.1563.1552.1540.1537.
ReferenceFernandez-Segovia, Escriche, et al., 2006Gurbuz O., Rouseff J.M., et al., 2006Kourkoutas, Elmore, et al., 2006Selli, Rannou, et al., 2006Berlinet, Ducruet, et al., 2005
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase OV-351DB-WaxSupelcowax-10BP-20DB-Wax
Column length (m) 50.60.60.50.60.
Carrier gas HeN2HeHeHe
Substrate      
Column diameter (mm) 0.320.250.250.220.32
Phase thickness (μm) 0.20.250.250.251.
Tstart (C) 60.70.40.60.45.
Tend (C) 220.230.280.220.250.
Heat rate (K/min) 5.2.4.2.5.
Initial hold (min)  2.2. 1.
Final hold (min)  20. 20.12.
I 1520.1566.1553.1550.1565.
ReferenceBonvehí, 2005Choi, 2005Elmore, Nisyrios, et al., 2005Ferrari, Tomi, et al., 2005Malliaa, Fernandez-Garcia, et al., 2005
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase InnowaxSupelcowax-10Supelcowax-10Carbowax 20MZB-Wax
Column length (m) 30.30.60.60.30.
Carrier gas HeHeHeHeHe
Substrate      
Column diameter (mm) 0.250.250.20.250.32
Phase thickness (μm) 0.250.250.20.250.25
Tstart (C) 40.60.60.45.40.
Tend (C) 200.240.200.250.250.
Heat rate (K/min) 5.3.2.2.5.
Initial hold (min) 5.5. 0.172.
Final hold (min) 2.10.10. 5.
I 1559.1553.1507.1538.1555.
ReferencePena, Barciela, et al., 2005Riu-Aumatell, Lopez-Tamames, et al., 2005Smadja, Rondeau, et al., 2005Verzera, Campisi, et al., 2005Wu, Zorn, et al., 2005
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase ZB-WaxDB-WaxDB-WaxDB-WaxInnowax
Column length (m) 30.30.30.30.15.
Carrier gas HeHeHeHeHe
Substrate      
Column diameter (mm) 0.250.320.250.250.25
Phase thickness (μm) 0.150.50.250.250.25
Tstart (C) 35.40.40.40.35.
Tend (C) 220.240.240.250.225.
Heat rate (K/min) 1.85.6.3.4.
Initial hold (min) 10.5.10. 5.
Final hold (min) 10. 25.20.20.
I 1559.1566.1545.1534.1569.
ReferenceLedauphin, Saint-Clair, et al., 2004Rega, Fournier, et al., 2004Varming, Andersen, et al., 2004Brat, Rega, et al., 2003Chisholm, Jell, et al., 2003
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase DB-WaxDB-WaxAT-WaxDB-WaxHP-Innowax
Column length (m) 60.30.60.30.30.
Carrier gas N2 He He
Substrate      
Column diameter (mm) 0.250.320.320.320.25
Phase thickness (μm) 0.250.50.250.50.5
Tstart (C) 70.40.65.35.60.
Tend (C) 230.240.250.240.260.
Heat rate (K/min) 2.7.2.5.3.
Initial hold (min) 2. 10.5. 
Final hold (min) 20.5.60.5. 
I 1566.1565.1544.1566.1558.
ReferenceChoi, 2003Högnadóttir and Rouseff, 2003Pino, Almora, et al., 2003Rega, Fournier, et al., 2003Skaltsa, Demetzos, et al., 2003
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase DB-WaxMegawaxZB-WaxSupelcowax-10DB-Wax
Column length (m) 30.30.60.60.60.
Carrier gas  HeHeHeHe
Substrate      
Column diameter (mm) 0.320.250.320.250.32
Phase thickness (μm) 0.50.250.250.250.5
Tstart (C) 40.40.40.35.67.
Tend (C) 240.220.220.195.235.
Heat rate (K/min) 7.2.3.2.2.7
Initial hold (min)  6. 5. 
Final hold (min) 5.10. 90.30.
I 1557.1546.1546.1559.1584.
ReferenceValim, Rouseff, et al., 2003Verzera, Trozzi, et al., 2003Brunton, Cronin, et al., 2002Chung, Yung, et al., 2002Claudela, Dirningera, et al., 2002
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase AT-WaxSupelcowax-10DB-WaxAT-WaxAT-Wax
Column length (m) 60.60.30.60.60.
Carrier gas HeHeHeHeHe
Substrate      
Column diameter (mm) 0.320.250.320.320.32
Phase thickness (μm) 0.250.250.500.250.25
Tstart (C) 65.35.40.65.65.
Tend (C) 250.195.240.250.250.
Heat rate (K/min) 2.2.7.2.2.
Initial hold (min) 10.5. 10.10.
Final hold (min) 60.90.5.60.60.
I 1544.1559.1558.1551.1544.
ReferencePino, Marbot, et al., 2002Chung, Yung, et al., 2001Lin and Rouseff, 2001Pino and Marbot, 2001Pino, Marbot, et al., 2001
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase CP-Wax 52CBCP-Wax 52CBCP-Wax 52CBDB-WaxCP-Wax 52CB
Column length (m) 60.25.50.60.50.
Carrier gas He  N2He
Substrate      
Column diameter (mm) 0.250.250.320.250.25
Phase thickness (μm) 0.250.15 0.250.2
Tstart (C) 45.40.60.70.30.
Tend (C) 250.220.220.230.220.
Heat rate (K/min) 2.3.4.2.2.
Initial hold (min) 0.175.5.2.1.3
Final hold (min)   30.20. 
I 1538.1589.1555.1562.1540.
ReferenceVerzera, Campisi, et al., 2001Chagonda, Makanda, et al., 2000Chevance, Farmer, et al., 2000Choi and Sawamura, 2000Jensen, Christensen, et al., 2000
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase Supelcowax-10DB-WaxHP-WaxMegawaxDB-Wax
Column length (m) 30.60.15.30.30.
Carrier gas HeHeHeHeH2
Substrate      
Column diameter (mm) 0.320.320.530.250.25
Phase thickness (μm) 0.250.51.0.250.25
Tstart (C) 75.40.40.40.60.
Tend (C) 200.250.220.220.220.
Heat rate (K/min) 2.54.5.2.2.
Initial hold (min)  2.3.6.3.
Final hold (min)  10.30.10. 
I 1558.1566.1578.1546.1559.
ReferenceLazari, Skaltsa, et al., 2000Le Guen, Prost, et al., 2000Peng, 2000Verzera, Trozzi, et al., 2000Chassagne, Boulanger, et al., 1999
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase CP-Wax 52CBSupelcowax-10BP-20InnowaxDB-Wax
Column length (m) 50.60.50.60.30.
Carrier gas  HeHeHe 
Substrate      
Column diameter (mm) 0.320.250.220.250.32
Phase thickness (μm)  0.250.250.250.25
Tstart (C) 60.35.60.50.40.
Tend (C) 220.195.230.180.200.
Heat rate (K/min) 4.2.2.2.56.
Initial hold (min) 5.5. 5.5.
Final hold (min) 30.90.35. 30.
I 1549.1560.1551.1520.1537.
ReferenceChevance and Farmer, 1999Chung, 1999Lota, Serra, et al., 1999Stashenko, Cervantes, et al., 1999Cha and Cadwallader, 1998
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase DB-WaxDB-WaxDB-WaxDB-WaxPEG-20M
Column length (m) 60.60.30.30.60.
Carrier gas   N2N2He
Substrate      
Column diameter (mm) 0.250.320.530.530.25
Phase thickness (μm) 0.250.250.250.250.25
Tstart (C) 40.40.40.50.50.
Tend (C) 200.200.200.200.230.
Heat rate (K/min) 3.2.2.2.2.
Initial hold (min) 5.    
Final hold (min) 60. 40. 60.
I 1555.1579.1579.1579.1562.
ReferenceCha, Kim, et al., 1998Mau, Lin, et al., 1998Mau, Chyau, et al., 1997Mau and Hwang, 1997Shimoda, Nakada, et al., 1997
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase CP-Wax 52CBDB-WaxCarbowax 20MDB-WaxDB-Wax
Column length (m) 50.60.60.60.60.
Carrier gas H2HeHe He
Substrate      
Column diameter (mm) 0.230.250.320.250.25
Phase thickness (μm) 0.120.250.4250.250.25
Tstart (C) 50.50.45.50.50.
Tend (C) 200.230.300.230.230.
Heat rate (K/min) 1.52.3.2.2.
Initial hold (min) 10. 3.  
Final hold (min) 10.60.20.  
I 1573.1562.1541.1554.1554.
ReferenceChyau, Mau, et al., 1996Shimoda, Shiratsuchi, et al., 1996Mondello, Dugo, et al., 1995Shimoda, Shigematsu, et al., 1995Shimoda, Shigematsu, et al., 1995, 2
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase DB-WaxDB-WaxHP-20MHP-FFAPDB-Wax
Column length (m) 60.60.50.50.30.
Carrier gas  HeHeHeHe
Substrate      
Column diameter (mm) 0.250.250.250.250.25
Phase thickness (μm) 0.250.25  0.25
Tstart (C) 50.50.60.60.50.
Tend (C) 230.230.190.210.220.
Heat rate (K/min) 2.2.3.3.4.
Initial hold (min)     3.
Final hold (min) 60.60.  20.
I 1565.1565.1530.1567.1550.
ReferenceShiratsuchi, Shimoda, et al., 1994Shiratsuchi, Shimoda, et al., 1994, 2Chung, Eiserich, et al., 1993Chung, Eiserich, et al., 1993Humpf and Schreier, 1991
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase CP-Wax 58CBDB-WaxDB-WaxDB-WaxSupelcowax-10
Column length (m) 30.30.30.30.60.
Carrier gas HeHeHeHe 
Substrate      
Column diameter (mm) 0.250.320.250.250.25
Phase thickness (μm) 0.220.250.250.250.25
Tstart (C) 40.40.50.50.40.
Tend (C) 220.220.250.250.175.
Heat rate (K/min) 3.5.4.4.2.
Initial hold (min)  3.3.3.5.
Final hold (min)     20.
I 1538.1550.1550.1550.1562.
ReferencePabst, Barron, et al., 1991Frohlich and Schreier, 1990Fröhlich, Duque, et al., 1989Fröhlich, Duque, et al., 1989Tanchotikul and Hsieh, 1989
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase Supelcowax-10Carbowax 20MCP-WAX 57CBSupelcowax-10Supelcowax-10
Column length (m) 60.60.50.60.60.
Carrier gas  He   
Substrate      
Column diameter (mm) 0.250.320.320.250.25
Phase thickness (μm) 0.25  0.250.25
Tstart (C) 40.50.60.40.40.
Tend (C) 175.225.200.175.175.
Heat rate (K/min) 2.1.54.2.2.
Initial hold (min) 5. 5.5.5.
Final hold (min) 20.80. 20.20.
I 1562.1560.1564.1563.1565.
ReferenceTanchotikul and Hsieh, 1989Chen and Ho, 1988Salter L.J., Mottram D.S., et al., 1988Vejaphan, Hsieh, et al., 1988Vejaphan, Hsieh, et al., 1988
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryPacked
Active phase Carbowax 20MCarbowax 20MCarbowax 20M
Column length (m) 50.  
Carrier gas HeHe 
Substrate   Celite 545
Column diameter (mm) 0.32  
Phase thickness (μm)    
Tstart (C) 50.50.75.
Tend (C) 200.160.228.
Heat rate (K/min) 2.1.4.6
Initial hold (min) 5.10. 
Final hold (min) 40.  
I 1544.1526.1533.
ReferenceChen, Kuo, et al., 1986Chen, Kuo, et al., 1982van den Dool and Kratz, 1963
Comment MSDC-RI MSDC-RI MSDC-RI

References

Go To: Top, Van Den Dool and Kratz RI, polar column, temperature ramp, Notes

Data compilation copyright by the U.S. Secretary of Commerce on behalf of the U.S.A. All rights reserved.

Cho I.H., Lee S.M., et al., 2007
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Cho, Kim, et al., 2006
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Berlinet, Ducruet, et al., 2005
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Choi, 2005
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Varming, Andersen, et al., 2004
Varming, C.; Andersen, M.L.; Poll, L., Influence of thermal treatment on black currant (Ribes nigrum L.) juice aroma, J. Agric. Food Chem., 2004, 52, 25, 7628-7636, https://doi.org/10.1021/jf049435m . [all data]

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Notes

Go To: Top, Van Den Dool and Kratz RI, polar column, temperature ramp, References