Butanoic acid

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Van Den Dool and Kratz RI, polar column, temperature ramp

Go To: Top, References, Notes

Data compilation copyright by the U.S. Secretary of Commerce on behalf of the U.S.A. All rights reserved.

Data compiled by: NIST Mass Spectrometry Data Center, William E. Wallace, director

Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase DB-WaxInnowaxDB-FFAPFFAPFFAP
Column length (m) 30.30.30.30.30.
Carrier gas HeH2HeHeHe
Substrate      
Column diameter (mm) 0.250.250.250.250.25
Phase thickness (μm) 0.250.250.50.250.25
Tstart (C) 50.45.35.35.35.
Tend (C) 180.210.225.225.225.
Heat rate (K/min) 3.53.54.10.10.
Initial hold (min) 2.5.5.5.5.
Final hold (min) 25.20.30.25.25.
I 1637.1644.1624.1653.1625.
ReferenceBotelho, Caldeira, et al., 2007Botelho, Caldeira, et al., 2007Jarunrattanasri, Theerakulkait, et al., 2007Lozano P.R., Drake M., et al., 2007Lozano P.R., Miracle E.R., et al., 2007
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase HP-20MDB-WaxDB-WaxFFAPFFAP
Column length (m) 50.30.30.30.30.
Carrier gas HeliumHeHeHe 
Substrate      
Column diameter (mm) 0.200.250.250.320.32
Phase thickness (μm) 0.200.50.5 0.25
Tstart (C) 70.40.40.40.40.
Tend (C) 180.250.250.240.240.
Heat rate (K/min) 4.4.4.8.6.
Initial hold (min) 4.5.5.2.2.
Final hold (min) 15.15.15.5.10.
I 1576.1637.1637.1620.1620.
ReferencePoliteo, Jukic, et al., 2007Pozo-Bayon M.A., Ruiz-Rodriguez A., et al., 2007Pozo-Bayon M.A., Ruiz-Rodriguez A., et al., 2007Schlutt B., Moran N., et al., 2007Steinhaus and Schieberle, 2007
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase DB-WaxInnowaxDB-WaxDB-WaxDB-FFAP
Column length (m) 30.60.30.30.30.
Carrier gas HeHeHe H2
Substrate      
Column diameter (mm) 0.320.250.250.320.25
Phase thickness (μm) 0.50.250.250.50.25
Tstart (C) 40.40.50.40.30.
Tend (C) 265.230.220.200.230.
Heat rate (K/min) 7.4.4.5.3.
Initial hold (min)  4.4.3.2.
Final hold (min) 5.20.20.8.4.
I 1644.1614.1607.1647.1613.
ReferenceGurbuz O., Rouseff J.M., et al., 2006Lee, Lee, et al., 2006Osorio, Alarcon, et al., 2006Petka, Ferreira, et al., 2006Schwambach and Peterson, 2006
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase DB-WaxOV-351DB-WaxDB-WaxSupelcowax-10
Column length (m) 30.50.30.30.60.
Carrier gas HeHe   
Substrate      
Column diameter (mm) 0.250.320.250.250.25
Phase thickness (μm) 0.250.20.250.250.25
Tstart (C) 40.60.40.40.35.
Tend (C) 200.220.200.200.195.
Heat rate (K/min) 10.5.10.10.6.
Initial hold (min) 3. 3.3.5.
Final hold (min) 20. 20.20.60.
I 1663.1625.1661.1650.1576.
ReferenceWhetstine M.E.C., Drake M.A., et al., 2006Bonvehí, 2005Carunchia Whetstine, Croissant, et al., 2005Carunchia Whetstine, Croissant, et al., 2005Chung, Fung, et al., 2005
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase DB-FFAPStabilwaxDB-WaxSupelcowax-10Carbowax 20M
Column length (m) 30.30.60.30.60.
Carrier gas N2N2HeHeHe
Substrate      
Column diameter (mm) 0.250.320.320.250.25
Phase thickness (μm) 0.251.1.0.250.25
Tstart (C) 40.40.45.60.45.
Tend (C) 230.230.250.240.250.
Heat rate (K/min) 5.4.5.3.2.
Initial hold (min) 2.2.1.5.0.17
Final hold (min) 6.10.12.10. 
I 1628.1652.1647.1620.1599.
ReferenceColahan-Sederstrom and Peterson, 2005Fang and Qian, 2005Malliaa, Fernandez-Garcia, et al., 2005Riu-Aumatell, Lopez-Tamames, et al., 2005Verzera, Campisi, et al., 2005
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase DB-WaxDB-WaxZB-WaxDB-WaxDB-Wax
Column length (m) 30.30.30.30.30.
Carrier gas  H2He  
Substrate      
Column diameter (mm) 0.250.320.320.250.25
Phase thickness (μm) 0.250.250.250.250.25
Tstart (C) 40.40.40.40.40.
Tend (C) 200.250.250.200.200.
Heat rate (K/min) 10.5.5.10.10.
Initial hold (min) 3.2.2.5.5.
Final hold (min) 20.5.5.15.15.
I 1610.1652.1647.1624.1624.
ReferenceWhetstine, Cadwallader, et al., 2005Wu, Zorn, et al., 2005Wu, Zorn, et al., 2005Avsar, Karagul-Yuceer, et al., 2004Avsar, Karagul-Yuceer, et al., 2004
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase DB-WaxCP-Wax 52CBDB-WaxZB-WaxDB-Wax
Column length (m) 30.30.0.30.30.
Carrier gas HeliumHe HeHe
Substrate      
Column diameter (mm) 0.320.250.320.250.25
Phase thickness (μm) 0.500.20.50.150.5
Tstart (C) 40.80.40.35.40.
Tend (C) 240.240.240.220.230.
Heat rate (K/min) 7.10.7.1.85.
Initial hold (min)  4. 10.2.
Final hold (min) 5. 5.10.10.
I 1633.1617.1616.1637.1645.
ReferenceBell, 2004Ferrari, Lablanquie, et al., 2004Gocmen, Gurbuz, et al., 2004Ledauphin, Saint-Clair, et al., 2004Mahajan, Goddik, et al., 2004
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase DB-Wax EtrDB-WaxOV-351DB-WaxDB-FFAP
Column length (m) 30.30.50.60.30.
Carrier gas HeHeHeHeHe
Substrate      
Column diameter (mm) 0.250.250.320.250.25
Phase thickness (μm) 0.250.250.20.250.25
Tstart (C) 40.40.60.40.35.
Tend (C) 245.240.220.210.200.
Heat rate (K/min) 3.6.5.2.10.
Initial hold (min) 3.10.  5.
Final hold (min) 20.25. 40.30.
I 1607.1613.1625.1604.1616.
ReferenceMénager, Jost, et al., 2004Varming, Petersen, et al., 2004Bonvehi and Coll, 2003Chyau, Ko, et al., 2003Karagül-Yüceer, Vlahovich, et al., 2003
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase DB-WaxDB-WaxDB-FFAPDB-FFAPDB-FFAP
Column length (m) 30.30.30.30.15.
Carrier gas      
Substrate      
Column diameter (mm) 0.250.320.250.250.32
Phase thickness (μm) 0.250.50.250.250.25
Tstart (C) 35.40.35.35.30.
Tend (C) 240.240.200.200.225.
Heat rate (K/min) 6.7.10.10.10.
Initial hold (min) 2. 5.5.2.
Final hold (min) 6.5.30.30.20.
I 1627.1628.1624.1604.1613.
ReferencePeterson and Reineccius, 2003Valim, Rouseff, et al., 2003Karagül-Yüceer, Cadwallader, et al., 2002Karagül-Yüceer, Cadwallader, et al., 2002Zhou, Wintersteen, et al., 2002
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase DB-WaxCP-Wax 52CBDB-FFAPDB-WaxDB-Wax
Column length (m) 30.60.30.30.30.
Carrier gas  HeH2H2H2
Substrate      
Column diameter (mm) 0.250.250.320.320.32
Phase thickness (μm) 0.250.250.251.1.
Tstart (C) 35.45.40.40.40.
Tend (C) 200.250.240.210.210.
Heat rate (K/min) 10.2.5.3.3.
Initial hold (min) 5.0.172.  
Final hold (min) 30.    
I 1606.1599.1637.1623.1624.
ReferenceKaragül-Yüceer, Drake, et al., 2001Verzera, Campisi, et al., 2001Charles, Martin, et al., 2000Moio, Piombino, et al., 2000Moio, Piombino, et al., 2000
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase DB-WaxFFAPDB-WaxDB-WaxDB-Wax
Column length (m) 15.60.60.30.30.
Carrier gas He  H2H2
Substrate      
Column diameter (mm) 0.530.250.250.320.32
Phase thickness (μm) 1.0.50.251.1.
Tstart (C) 40.50.40.40.40.
Tend (C) 220.230.200.210.210.
Heat rate (K/min) 5.5.3.3.3.
Initial hold (min) 3.3.5.  
Final hold (min) 30.15.60.  
I 1666.1646.1624.1623.1624.
ReferencePeng, 2000Stephan and Steinhart, 1999Cha, Kim, et al., 1998Moio and Addeo, 1998Moio and Addeo, 1998
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase DB-WaxDB-WaxDB-WaxDB-WaxDB-Wax
Column length (m) 30.30.60.60.60.
Carrier gas H2HeHeHeHe
Substrate      
Column diameter (mm) 0.320.250.250.250.25
Phase thickness (μm) 1.0.250.250.250.25
Tstart (C) 40.20.50.50.50.
Tend (C) 210.200.230.230.230.
Heat rate (K/min) 3.4.3.3.2.
Initial hold (min)  5.   
Final hold (min)  10.   
I 1624.1623.1631.1631.1635.
ReferenceMoio and Addeo, 1998Ott, Fay, et al., 1997Shimoda, Peralta, et al., 1996Shimoda, Wu, et al., 1996Shimoda, Shigematsu, et al., 1995
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase DB-WaxDB-WaxDB-WaxDB-WaxDB-Wax
Column length (m) 30.60.60.30.30.
Carrier gas He  HeHe
Substrate      
Column diameter (mm) 0.250.250.250.250.25
Phase thickness (μm)  0.250.250.250.25
Tstart (C) 40.50.50.50.50.
Tend (C) 200.230.230.220.240.
Heat rate (K/min) 2.2.2.4.4.
Initial hold (min) 5.4.4.3.3.
Final hold (min)  30.30.20. 
I 1625.1630.1630.1598.1598.
ReferenceIwaoka, Hagi, et al., 1994Shiratsuchi, Shimoda, et al., 1993Shiratsuchi, Shimoda, et al., 1993Humpf and Schreier, 1991Krammer, Winterhalter, et al., 1991
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryPackedCapillaryCapillaryCapillary
Active phase CP-Wax 58CBCarbowax 20MDB-WaxDB-WaxDB-Wax
Column length (m) 30.3.0530.30.30.
Carrier gas He HeHeHe
Substrate  Supelcoport   
Column diameter (mm) 0.25 0.2590.2590.259
Phase thickness (μm) 0.22 0.250.250.25
Tstart (C) 40.40.50.50.50.
Tend (C) 220.200.240.240.240.
Heat rate (K/min) 3.8.4.4.4.
Initial hold (min)  4.3.3.3.
Final hold (min)      
I 1606.1600.1596.1599.1598.
ReferencePabst, Barron, et al., 1991Peng, Yang, et al., 1991Suárez, Duque, et al., 1991Suárez, Duque, et al., 1991Suárez, Duque, et al., 1991
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI
Column type CapillaryCapillaryCapillaryCapillaryCapillary
Active phase DB-WaxDB-WaxDB-WaxCarbowax 20MCarbowax 20M
Column length (m) 30.30.30.30.50.
Carrier gas HeHeHeHeHe
Substrate      
Column diameter (mm) 0.2590.250.250.250.32
Phase thickness (μm) 0.250.250.250.25 
Tstart (C) 50.50.50.40.50.
Tend (C) 240.250.250.240.200.
Heat rate (K/min) 4.4.4.4.2.
Initial hold (min) 3.3.3.3.5.
Final hold (min)     40.
I 1600.1598.1602.1591.1627.
ReferenceSuárez, Duque, et al., 1991Fröhlich, Duque, et al., 1989Fröhlich, Duque, et al., 1989Schwab, Mahr, et al., 1989Chen, Kuo, et al., 1986
Comment MSDC-RI MSDC-RI MSDC-RI MSDC-RI MSDC-RI

References

Go To: Top, Van Den Dool and Kratz RI, polar column, temperature ramp, Notes

Data compilation copyright by the U.S. Secretary of Commerce on behalf of the U.S.A. All rights reserved.

Botelho, Caldeira, et al., 2007
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Notes

Go To: Top, Van Den Dool and Kratz RI, polar column, temperature ramp, References